JPH0231796Y2 - - Google Patents
Info
- Publication number
- JPH0231796Y2 JPH0231796Y2 JP17429385U JP17429385U JPH0231796Y2 JP H0231796 Y2 JPH0231796 Y2 JP H0231796Y2 JP 17429385 U JP17429385 U JP 17429385U JP 17429385 U JP17429385 U JP 17429385U JP H0231796 Y2 JPH0231796 Y2 JP H0231796Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- insulating base
- groove
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 238000007747 plating Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17429385U JPH0231796Y2 (US20090163788A1-20090625-C00002.png) | 1985-11-14 | 1985-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17429385U JPH0231796Y2 (US20090163788A1-20090625-C00002.png) | 1985-11-14 | 1985-11-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6282771U JPS6282771U (US20090163788A1-20090625-C00002.png) | 1987-05-27 |
| JPH0231796Y2 true JPH0231796Y2 (US20090163788A1-20090625-C00002.png) | 1990-08-28 |
Family
ID=31112539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17429385U Expired JPH0231796Y2 (US20090163788A1-20090625-C00002.png) | 1985-11-14 | 1985-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231796Y2 (US20090163788A1-20090625-C00002.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0195593A (ja) * | 1987-10-08 | 1989-04-13 | Asahi Chem Ind Co Ltd | 積層回路板の電気的接続構造及びその製法 |
| JPH071821B2 (ja) * | 1989-12-11 | 1995-01-11 | サンケン電気株式会社 | 配線基板 |
-
1985
- 1985-11-14 JP JP17429385U patent/JPH0231796Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6282771U (US20090163788A1-20090625-C00002.png) | 1987-05-27 |
