JPH0231135U - - Google Patents
Info
- Publication number
- JPH0231135U JPH0231135U JP10891588U JP10891588U JPH0231135U JP H0231135 U JPH0231135 U JP H0231135U JP 10891588 U JP10891588 U JP 10891588U JP 10891588 U JP10891588 U JP 10891588U JP H0231135 U JPH0231135 U JP H0231135U
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- conductor
- integrated circuit
- hybrid integrated
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 1
Description
第１図は本考案の混成集積回路用基板が基板母
材に形成された状態を示す平面図、第２図は要部
を拡大して示す平面図である。
２……基板本体、３……導体パターン、４……
テストパツド４。
FIG. 1 is a plan view showing a state in which a hybrid integrated circuit board of the present invention is formed on a substrate base material, and FIG. 2 is a plan view showing an enlarged main part. 2... Board body, 3... Conductor pattern, 4...
Test pad 4.
Claims (1)
ンと同質の接着強度測定用導体部を導体パターン
とは離間し独立に形成したことを特徴とする混成
集積回路。 1. A hybrid integrated circuit characterized in that a conductor part for measuring adhesion strength of the same quality as the conductor pattern is formed independently and separated from the conductor pattern in an area where the conductor pattern is not formed on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10891588U JPH0231135U (en) | 1988-08-19 | 1988-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10891588U JPH0231135U (en) | 1988-08-19 | 1988-08-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0231135U true JPH0231135U (en) | 1990-02-27 |
Family
ID=31344693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10891588U Pending JPH0231135U (en) | 1988-08-19 | 1988-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231135U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61156748A (en) * | 1984-12-24 | 1986-07-16 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Test structural body |
-
1988
- 1988-08-19 JP JP10891588U patent/JPH0231135U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61156748A (en) * | 1984-12-24 | 1986-07-16 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Test structural body |