JPH01115270U - - Google Patents
Info
- Publication number
- JPH01115270U JPH01115270U JP1032488U JP1032488U JPH01115270U JP H01115270 U JPH01115270 U JP H01115270U JP 1032488 U JP1032488 U JP 1032488U JP 1032488 U JP1032488 U JP 1032488U JP H01115270 U JPH01115270 U JP H01115270U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- integrated circuit
- thick film
- hybrid integrated
- final stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 claims 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例である厚膜混成集
積回路基板の斜視展開図、第２図は従来の厚膜混
成集積回路基板の斜視展開図である。
図において、１はアルミナ基板、２は導体パタ
ーン、３はスルーホール、４は融着部分５のコー
ナー部、６はトランジスタ８のコレクタ電極、７
はトランジスタ８のエミツタ電極、９はトランジ
スタ８のベース電極を示す。なお、図中、同一符
号は同一、または相当部分を示す。
FIG. 1 is a perspective development view of a thick film hybrid integrated circuit board which is an embodiment of this invention, and FIG. 2 is a perspective development view of a conventional thick film hybrid integrated circuit board. In the figure, 1 is an alumina substrate, 2 is a conductor pattern, 3 is a through hole, 4 is a corner of a fused portion 5, 6 is a collector electrode of a transistor 8, and 7
9 indicates the emitter electrode of the transistor 8, and 9 indicates the base electrode of the transistor 8. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
タ融着の位置決めを行うために、終段トランジス
タ融着部分のコーナーを階段状にしたことを特徴
とする厚膜混成集積回路基板。 A thick film hybrid integrated circuit board characterized in that the corner of the final stage transistor welding part is stepped in order to position the final stage transistor welding of the high frequency thick film hybrid integrated circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1032488U JPH01115270U (en) | 1988-01-27 | 1988-01-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1032488U JPH01115270U (en) | 1988-01-27 | 1988-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01115270U true JPH01115270U (en) | 1989-08-03 |
Family
ID=31217884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1032488U Pending JPH01115270U (en) | 1988-01-27 | 1988-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115270U (en) |
-
1988
- 1988-01-27 JP JP1032488U patent/JPH01115270U/ja active Pending