JPH02311248A - Hole process method of printed circuit board - Google Patents

Abstract

PURPOSE:To correct a boring position accurately by putting a print circuit board on a table provided with a suction hole on its upper surface, by adjusting the circuit board flat by reducing pressure of each suction hole and adsorbing the print circuit board to the table, and by measuring the boring point in this condition. CONSTITUTION:On an upper surface of a table 2, suction holes 4, 4 are recessed, which communicate one another by a communicating passage 11 provided into a tunnel in the table 2. The communicating passage 11 is connected with a pressure reduction device. On the table 2, a print circuit board 1 is put, and when the pressure of each suction hole 4 is reduced by the pressure reduction device, the print circuit board 1 is adsorbed along a flattened upper surface of the table 2, whereby the curve is adjusted flat. Reference marks 6, 6 on the print circuit board 1 are photographed using a camera 9, in this condition, and through operational process, distance between the respective reference marks is measured. The expansion degree of the print circuit board 1 is calculated thereby, and based on that, boring position is corrected.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to a method for forming holes that serve as a reference for positioning when laminating multiple layers of printed wiring boards.

[Conventional technology]

2. Description of the Related Art When producing a multilayer printed wiring board by laminating and molding printed wiring boards into multiple layers, holes are formed in the printed wiring board in order to align circuits and prevent misalignment. By passing a bottle through this hole, when laminating the multilayer pudding onto a wiring board, the position of the circuit can be adjusted using this hole as a reference, and positional shift can be prevented. In order to process this reference hole, a reference mark is formed on the printed wiring board, and then a hole is drilled using a drilling tool such as a drill in line with the reference mark. If the circuit pattern is misaligned due to expansion and contraction of the printed wiring board during the manufacturing process such as printing, it is necessary for Komei to correct the position according to this misalignment. To correct the position, for example, the degree of expansion and contraction of the printed wiring board is measured by measuring the length between the reference marks formed at multiple locations on the printed wiring board, and based on this measurement result, the drill is drilled. This is done by shifting the position of the holes.

[Problem to be solved by the invention]

However, if the printed wiring board is extremely thin, such as 0.02 to 0.6 mm thick, it is unavoidable that the printed wiring board will undergo deformation such as curving or twisting. If blackening treatment (oxidation treatment of the circuit to improve adhesion) or the like is performed, even more complicated deformation will occur. When Komei measured the length between the reference marks to correct the position, he was unable to measure the correct dimensions if the printed wiring board was deformed in this way, so Komei corrected the position accurately. The problem was that it could not be done. The present invention has been made in view of the above points, and it is an object of the present invention to provide a method for drilling holes in a printed wiring board that can accurately correct the position and drill holes. be.

[Means to solve the problem]

In the method for drilling holes in a printed wiring board according to the present invention, a printed wiring board 1 is placed on a table 2 provided with suction holes 4, 4, etc. at a plurality of locations on the top surface, and each suction hole 4 is placed in a reduced pressure state. With the printed wiring board 1 straightened flat by adsorbing the printed wiring board 1, the holes are measured, and then the holes in the measured printed wiring board 1 are machined with the drilling tool 3. It is characterized by this.

[For use]

In the present invention, by suctioning the printed wiring board 1 through the suction hole 4 and adhering it to the upper surface of the table 2, Komei measures the location with the printed wiring board 1 flattened. Therefore, even if the printed wiring board 1 has deformation or the like, measurement can be performed with the deformation or the like corrected, and the hole machining can be performed by accurately correcting the position.

【Example】

The present invention will be explained in detail below with reference to Examples. The printed wiring board 1 to be subjected to drilling is used as an inner-layer circuit board or an outer-layer circuit board of a multilayer printed wiring board, and is, for example, a 0.1LnIIl-thick copper-clad epoxy laminated board covered with metal foil. The metal foil of the laminate is printed to form a circuit pattern 5 as shown in Figure 4.
In addition to providing reference marks 6.6 and 6.6 at multiple locations on the edge.
It is formed by providing... The reference mark 6 serves as a reference for drilling. In order to drill a reference hole in this printed wiring board 1, which will serve as a hole for inserting a positioning bottle during multilayer molding, first place the printed wiring board 1 on a table 2, as shown in Fig. 3 (,). Place and set. At this time table 2
It is preferable to provide a guideline or the like on the upper surface of the board so that the printed wiring board 1 can be set at a predetermined position. The table 2 is formed with a flat upper surface, and the holes 8, 8... having diameters of several Iom to several CLI+ are provided vertically and penetratingly corresponding to the locations. . In addition, there are suction holes 4, 4 and 4 in multiple places on the top surface of the table 2.
. . are recessed, and the suction holes 4, 4 . As shown in FIG. 1, this communication passage 11 is opened as a connection port 12 on the lower surface of the table 2, and the connection port 12 is connected to a pressure reducing device such as a vacuum pump through a hose or the like. The suction holes 4, 4, . . . are arranged so as to be located on the lower side of the printed wiring board 1, and are preferably arranged as evenly as possible. After placing the printed wiring board 1 on the table 2 as described above,
The pressure reducing device is activated to reduce the pressure in each suction hole 4, 4, . The degree of vacuum in the suction hole 4 is set to such an extent that the wiring board 1 will not be bent due to pudding being sucked into the suction hole 4. In this way, printed wiring board 1
When the back side of the board is suctioned through the suction holes 4, 4..., the printed wiring board 1 will be attracted to the top surface of the table 2.
Therefore, even if the printed wiring board 1 is deformed such as curved or twisted, the printed wiring board 1 can be stretched along the flat upper surface of the table 2, and the printed wiring board 1 can be straightened into a flat state. can. With the printed wiring board 1 flattened in this way, Komei measures the location. This measurement can be performed using the same method as conventionally performed. That is, as shown in Figure 3 (n), each reference mark 6,6... provided on the printed wiring board 1 is photographed using a camera 9 disposed above the table 2, and the photographed data is transferred to a computer. Each reference mark is calculated by 6.
6...Measure the distance between. This length measurement is carried out with the printed wiring board 1 sucked onto the top surface of the table 2 and corrected flat, so that accurate dimensions can be obtained. By measuring the distance between each reference mark 6°6... in this way, it is possible to calculate the degree of expansion and contraction of the printed wiring board 1, that is, the degree of deviation of the circuit pattern 5 formed on the printed wiring board 1. can. Komei then makes corrections in accordance with the degree of deviation calculated in this way. The correction is performed by horizontally moving the drilling tool 3, such as an electric drill, arranged below the table 2, and normally it is necessary to make the correction by moving the reference mark 26 by about several tens of micrometers from the center. After correcting the position of the drilling tool 3 in this way, move the drilling tool 3 upward as shown in FIG. 3(1)) and pass the drill bit 3a through the hole 8 of the table 2, The drilling process is performed at the location of the reference mark 6 of No. 1. For example, as shown in FIG. 5, the distance between the holes 10 and 10 is adjusted to L' by correcting the distance @L between the centers of the reference marks 6.6. is for processing.

【Effect of the invention】

As described above, in the present invention, a printed wiring board is placed on a table with suction holes provided at multiple locations on the top surface, and each suction hole is brought into a reduced pressure state to cause the printed wiring board to be suctioned. With the printed wiring board flattened, I measured the holes, and then used a drilling tool to drill holes in the measured printed wiring boards. Komei can measure the location by adsorbing it to the top of the table and correcting it flat, and even if the printed wiring board is deformed, measurements can be made accurately with the deformation corrected. There is a drill hole that can be used to accurately correct the position and drill the hole.

[Brief explanation of the drawing]

Figure 1 is a sectional view showing an embodiment of the present invention, Figure 2 is an exploded perspective view of the same as the above, Figure 3 (a) (+1) is a front view of each step of the same, and Figure 4 is a print of the same as the above. Perspective view of wiring board, fifth
The figure is an enlarged view showing the position of Komei, same as above. 1 is a printed wiring board, 2 is a table, 3 is a punching tool, and 4 is a suction hole.

Claims (1)

[Claims] (1) A state where the printed wiring board is flattened by placing the printed wiring board on a table with suction holes in multiple places on the top surface, and by reducing the pressure in each suction hole and sucking the printed wiring board. 1. A method for making holes in a printed wiring board, comprising: measuring a hole to be drilled in a printed wiring board; and then drilling a hole in the measured hole in the printed wiring board using a punching tool.