JPH0699334A - Correcting method for machining position of multilayer substrate - Google Patents

Abstract

PURPOSE:To drill with high accuracy circuit patterns on a multilayer substrate by comparing measurement results obtained before and after laminating four marks forming a min. rectangle surrounding a machining position with each other and by correcting the machining position specified by programs based on the comparison result. CONSTITUTION:A plurality of measuring marks P11 to P76 are placed in matrix shape at predetermined intervals on a prelaminated printed substrate 1. The distance from the reference position to each mark P11 to P76 is measured. Next, in machining the laminated multilayered substrate, the distance from the reference position to each mark P11 to P76 is again measured to compare measurement results obtained before and after laminating four marks, P34, P35, P44, and P45, forming tire min. rectangle surrounding the machining position H1 with each other. The machining position H1 specified by programs is corrected to the actual machining position based on the comparison result.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing position correcting method suitable for making a hole in a multilayer substrate.

[0002]

2. Description of the Related Art Printed circuit boards are being multilayered as the wiring density is increased. Processing of multi-layered boards is also increasing in the drilling of printed boards. The drilling of the multilayer substrate is performed after the individually formed printed circuit board and prepreg are laminated on a tool and thermocompression bonded under high temperature and high pressure.

[0003]

In the case of a multi-layer substrate,
Since the thermocompression bonding step is included, deformation due to expansion and contraction occurs, and the deformation is different for each multilayer substrate. For this reason, if a hole is directly formed at the position designated by the machining program, the formed wiring pattern and the position of the hole are misaligned with each other, resulting in defective machining.

In view of the above-mentioned circumstances, an object of the present invention is to provide a method for correcting a processing position of a multi-layer substrate, which is capable of accurately punching a wiring pattern of the multi-layer substrate which is deformed by expansion and contraction during thermocompression bonding. To provide.

[0005]

In order to achieve the above object, according to the present invention, a plurality of measurement marks are arranged in a matrix at predetermined intervals on a printed circuit board before lamination, and each measurement mark is arranged from a reference position. Before and after stacking four marks that measure the distance to the mark and measure the distance from the reference position to each mark again when processing the laminated multilayer board to form the smallest rectangle surrounding the processing position. The measurement results are compared, and the machining position designated by the program is corrected based on the comparison result.

[0006]

The principle of the above correction method will be described with reference to FIG. A line segment A connecting the points P1 and P2, a line segment B connecting the points P3 and P4, a distance V1 between the points P1 and P3, and a point P
2 and the point P4 are separated by a distance V2, each line segment A,
The distances of the same ratio α internal division points R1 and R2 of B are calculated. The ratio of the line segment A to the line segment a connecting the points P1 and R1 is as follows: A: a = 1: α (1) Similarly, the ratio of the line segment B and the line segment b connecting the points P3 and R2 is also B: b = 1: α (2).

Here, the line segment B is translated by the distance V2, and the point P2 and the point P4 are overlapped. Then, the point P3 and the point R2
Assuming that the positions after the movement of P are point P31 and point R21, respectively, the relationship of P3 = P1 + V1 (3) P3 = P31 + V2 (4) is established between the points P3 and P31. Then, the distance V between the point P31 and the point P1
11 can be obtained by V11 = V1 + V2 (5)

Since the triangle P1P2P31 and the triangle R1P2R21 are similar figures, the points R1 and R21 are the same.
The distance V12 is V12 = (A−a) / A · (V1−V2) = (1−α) (V1−V2) (6). Therefore, from the equation (6), the distance V13 between the points R1 and R2 can be obtained by the following equation: V13 = (1-α) V1 + αV2 (7)

[0009]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows the arrangement of measurement marks in the present invention, where 1 is a printed circuit board. P11 to P76 are marks for measurement, which are formed in a matrix at predetermined intervals. These marks P11 to P76 are formed by, for example, drilling. Then, for example, the positions from the reference position during punching to the marks P11 to P76 are measured and recorded before and after the stacking. The marks before lamination are designated as points P11 to P76, and the marks after lamination are designated as points P11g to P76g, respectively.

Now, it is assumed that the machining position H1 designated by the machining program is in the area surrounded by the points P34, P35, P44 and P45. The points P34 and P3
FIG. 2 is an enlarged view of the area surrounded by 5, point P44, and point P45. In FIG. 2, points P34, P35,
Point P34g, point P35g for point P44, point P45,
The movement amounts of point P44g and point P45g are V1 and V, respectively.
2, V3, V4, the line segment connecting the points P34 and P35 is A1, the line segment connecting the points P35 and P45 is B1,
The line segment connecting the points P45 and P44 is C1, and the point P44 and the point P are
A line segment connecting 34 is D1, a line segment connecting point P34g and point P35g is A2, a line segment connecting point P35g and point P45g is B2, a line segment connecting point P45g and point P44g is C2, and point P is
A line segment connecting 44g and the point P34g is defined as D2.

Now, the actual machining position H2 after the lamination with respect to the machining position H1 designated by the program before the lamination.
Ask for. Each point P34, point P35, point P44, point P
45, point P34g, point P35g, point P44g, point P4
There is a relationship of P34g = P34 + V1 (8) P35g = P35 + V2 (9) P44g = P44 + V3 ... (10) P45g = P45 + V4 ... (11) between 5g.

The machining position H1 designated by the machining program
Line segment A1 parallel to line segment A1 and draw line segment B
The intersections with 1 and D1 are obtained, and are defined as points R1 and R2, respectively. Similarly, a line segment B11 that passes through the processing position H1 and is parallel to the line segment B1 is drawn, and the intersections with the line segments A1 and C1 are obtained, which are set as points S1 and S2, respectively. The ratio of the line segment B1 and the line segment b1 connecting the points P35 and R1 is set to 1: α. Further, the ratio of the line segment A1 and the line segment a1 connecting the points P35 and S1 is 1:
Let β. Then, the shift amount V of the point R11 with respect to the point R1
11 is V11 = R11-R1 = (1-α) V2 + αV4 ··· (12) Further, the deviation amount V41 of the point R21 with respect to the point R2 is V41 = R21−R2 = (1-α) V1 + αV3 ··· (13) Required by.

Therefore, the deviation amount V0 of the actual machining position H2 with respect to the machining position H1 is: V0 = H1-H2 = (1-β) V11 + βV41 = V2 + α (V4-V2) + β (V1-V2) + αβ (V2-V4 + V3- V1) ··· (14) Therefore, when the machining position H1 is commanded by the machining program, the actual machining position H2 is obtained by H2 = P35 + V2 + α (V4-V2) + β (V1-V2) + αβ (V2-V4 + V3-V1) ··· (15) You can In this way, the actual machining position H2
By obtaining and correcting the above, it is possible to accurately make a hole in the previously formed circuit pattern.

The measuring marks P11 to P11
The reference position for measurement of 76 may be set at a convenient position such as the origin position of the processing machine, the origin position on the program, or the axial center position of the reference pin press-fitted into the board. In addition, each mark is a plurality of printed circuit boards that are stacked,
It only has to be formed on one of the outer layers. Further, the mark can be formed at a position where the outer layer circuit pattern is not formed, or at a crosspiece that connects a plurality of printed boards.

[0015]

As described above, according to the present invention, a plurality of measurement marks are arranged in a matrix on the printed circuit board before lamination at a predetermined interval, and the distance from the reference position to each mark is measured. Then, when processing the laminated multilayer substrate, the distance from the reference position to each mark is measured again, and the measurement results before and after the lamination of the four marks forming the smallest rectangle surrounding the processing position are compared. At the same time, based on the comparison result, the processing position specified by the program is corrected, so even if the laminated multilayer boards have irregular deformation, it is based on the measurement result of the mark near the processing position. Since it can be corrected by the correction, the circuit pattern of the multilayer substrate can be punched with high precision.

[Brief description of drawings]

FIG. 1 is a plan view showing the arrangement of measurement marks on a printed circuit board.

FIG. 2 is an explanatory diagram showing a correction method according to the present invention.

FIG. 3 is a schematic diagram showing the concept of the present invention.

[Explanation of symbols]

 1 Printed circuit board H1, H2 Processing position P11 to P76 Mark for measurement

Claims (1)

[Claims] 1. When a plurality of measuring marks are arranged in a matrix on a printed circuit board before stacking at predetermined intervals, and a distance from a reference position to each mark is measured to process a multilayer board after stacking. In addition, the distance from the reference position to each mark is measured again, and the measurement results before and after stacking the four marks forming the minimum rectangle surrounding the processing position are compared, and based on the comparison result, the program A method for correcting a processing position of a multilayer substrate, which comprises correcting a specified processing position.