JPH02310951A - Semiconductor device - Google Patents

Abstract

PURPOSE:To increase a surface area and to enhance a heat-dissipating property at a sufficient strength by a method wherein a radiating fin is connected to a radiating-fin fixation implement on the surface of a package by means of a fin support part and an interfin connection part is installed, between their fins, at a peripheral part at the side outside of the fin support part. CONSTITUTION:A radiating fin 10 is provided, at a fin support part 10e on one end-face of a central axis 10b, with a hole 10a which is fitted to a stud 3a formed on a face opposite to a fixation face of an IC chip of a radiating-fin fixation implement 3 and by which the radiating fin 10 is fixed to the radiating- fin fixation implement 3. A plurality of disk-shaped fins 10c are fixed to the central axis 10b so as to be nearly perpendicularly to this axis at equal intervals. Interfin connection parts 10d which connect a plurality of faced fins and which are composed of pillar-shaped aluminum heat-dissipating bodies are installed in positions at equal intervals on an identical circumference whose center is the central axis 10b. A surface area is increased by the interfin connection parts 10d; the individual faced fins are fixed to each other by the interfin connection parts 10d; the individual fins are reinforced in terms of their strength. As a result, it is possible to realize an efficient cooling effect.

Description

[Detailed Description of the Invention] [Summary] Regarding a semiconductor device equipped with a heat dissipation fin, the present invention relates to a semiconductor device equipped with a heat dissipation fin, which can be connected well to the package surface, increase the surface area, and provide sufficient strength. The package includes a plurality of fins arranged vertically at intervals on the package surface, and a central part of the fin facing the package surface among the plurality of fins. a fin support section connected to the package surface; a fin surface of the plurality of fins facing each other; The heat dissipation fin includes a fin-to-fin connection portion that connects opposing fins.

[Industrial application field]

The present invention relates to a semiconductor device equipped with heat dissipation fins, and more particularly to a semiconductor device that efficiently and effectively cools the semiconductor device during use to improve its characteristics and productivity.

In recent years, in the field of semiconductor devices, as the degree of integration and speed has increased, there has been a demand for lower thermal resistance in packages during use, and there is a strong desire for semiconductor devices that can be cooled efficiently and effectively. ing.

[Conventional technology]

FIG. 3 is a configuration diagram showing an example of a conventional semiconductor device.

In the figure, an IC chip 1 is attached to the surface of a heat dissipation fin fixture 3 made of copper (Cu) alloy or the like (in the figure, A plurality of electrodes 1a, lb... on the IC chip 1 and a plurality of electrodes 1a, 1b, . Each electrode 1a,
A plurality of external extraction electrodes 5a, 5b corresponding to lb...
. . are connected by bonding wires 6a, 6b, .

Further, 7 in the figure shows a package cover made of ceramic or the like for enclosing the IC chip 1 connected to the package body 2 as described above.

On the other hand, a stud 3a is formed on the end surface of the radiation fin fixture 3 opposite to the surface on which the IC chip 1 is fixed, and the stud 3a protrudes from the end surface. radiating fins 8 made of aluminum (AI) and having a plurality of (four in the figure) disc-shaped fins 8c provided on the central cough axis 8b and at equal intervals substantially perpendicular to the central cough axis 8b.
The hole 8a is inserted into the stud 3a of the heat dissipation fin fixture 3.
The two are fixed by fitting together.

Note that the disk-shaped fins 8c described above are usually cut out by machining.

In a semiconductor device having such a configuration, the heat emitted from the IC chip l is transferred to the heat dissipation fin 8 via the heat dissipation fin fixture 3 by blowing air onto the heat dissipation fin portion.
The IC chip 1 can be efficiently cooled by dissipating it into the atmosphere.

[Problem to be solved by the invention] However, especially in semiconductor devices with a high degree of integration or high operating speeds, the amount of heat generated from the IC chip increases, so it is difficult to obtain a sufficient cooling effect with conventional heat dissipation fins. Can not.

Therefore, methods such as: 1) increasing the number of fins to improve the heat dissipation effect; 2) increasing the surface area of each fin to improve the heat dissipation effect; and 2) increasing the speed of air blowing.

However, in case (2), the height of the radiation fins increases, and if the height cannot be increased due to space constraints, the fins must be made thinner, which has the disadvantage of weakening the mechanical strength of the fins.

Also, in the case of (■), increasing the external size of the fins weakens the mechanical strength, and in order to be able to package semiconductor devices in a high-density array, the limit is to make the external size of the fins about the same as the external size of the package body. It is.

Furthermore, in the case of (2), there are drawbacks such as noise from the electric fan for air cooling, vibration caused by excessive wind pressure, and overcooling of other devices, which limits its application.

On the other hand, in order to obtain sufficient mechanical strength even with thinned fins, it is possible to make the central axis thicker, for example, but in this case, the heat dissipation fins and the heat dissipation fin fixture provided on the package body As the adhesive area becomes larger, cracks tend to occur in the adhesive due to the difference in coefficient of thermal expansion between the heat dissipation fin and the heat dissipation fin fixture, resulting in poor connection of the heat dissipation fin to the package surface.

An object of the present invention is to obtain a semiconductor device having heat dissipating fins that can be well connected to the package surface, have an increased surface area, have sufficient strength, and have excellent heat dissipation properties.

[Means to solve the problem]

The above problem is solved by a plurality of fins arranged vertically at intervals on the package surface, and a central part of the fin facing the package surface among the plurality of fins. A fin support part connected to the surface, and a plurality of fin surfaces of the plurality of fins facing each other, provided in a peripheral area outside the part where the fin support part is provided, and between the mutually facing fins. The present invention is solved by a semiconductor device having a heat dissipation fin with an inter-fin connection portion connecting the fins.

[For production]

The heat dissipation fin is connected to the heat dissipation fin fixture on the package surface by the fin support provided in the center of the fin, and inter-fin connections are provided between the thin fins at the periphery outside of the fin support. The radiation fins can be well connected to the package surface, and the thin fins can be sufficiently reinforced.

Further, since the inter-fin connection portion functions as a columnar heat radiator and increases the surface area, a more efficient cooling effect can be obtained.

〔Example〕

FIG. 1 is a diagram illustrating an example of the configuration of a semiconductor device according to the present invention, in which (A) is an overall configuration diagram, and (B) is a diagram showing a radiation fin portion. , and FIG. 2 is a diagram showing another embodiment.

In FIG. 1, (A) shows a device in which only the radiation fins 8 in FIG. 3 are replaced with radiation fins 10, and the other parts are completely the same as in FIG. 3.

In FIGS. 1(A) and CB), the IC chip 1 is formed approximately in the center of the package body 2 made of ceramic or the like, and the surface (upper surface in the figure) of the heat dissipation fin fixture 3 similar to that shown in FIG. 3 is coated with gold. (Au) is fixed via a thin film 4, and bonding wires 6 are connected between the plurality of electrodes on the IC chip l and the plurality of external lead-out electrodes on the package body 2.
The connection at points a, 6b, . . . is the same as in the case of FIG. Note that 7 in the figure shows a package cover made of ceramic or the like.

On the other hand, the heat dissipation fin 10 made of aluminum (Affi) is fitted with the stud 3a formed on the surface of the heat dissipation fin fixture 3 opposite to the IC chip l fixing surface, thereby fixing the heat dissipation fin lO to the heat dissipation fin. The hole 10a for fixing to the fixture 3 is connected to the fin support part 10 on one end surface of the central shaft 10b.
e, and the central shaft 10b is provided with the intermediate shaft 10b.
A plurality of disc-shaped fins 10C (four in the figure) are fixed at equal intervals of, for example, 2 to 3III11, substantially orthogonal to the central axis tab on the disc-shaped fins 19c.
At equidistant positions on the same circumference centered on , there are inter-fin connection parts 1 consisting of columnar aluminum (Affi) heat sinks that connect a plurality of (four in the figure) facing fins.
0d is provided.

The thickness of the disc-shaped fin is, for example, 0.5+w-, the diameter is 50mm+, which is approximately equal to one side of the package outer shape, the diameter of the central axis is, for example, 10mm, and the diameter of the inter-fin connection part 10d is about 2 to 5IIIll. .

Therefore, the hole 10a of the radiation fin 10 is fitted into the stud 3a of the radiation fin fixture 3, and the two are fixed together using a thermally conductive resin, such as an epoxy resin, as an adhesive.

Note that the heat dissipation fins 10 can be integrally formed by gluing the inter-fin connection parts to heat dissipation fins and ins that are cut out by conventional machining, but in this case, the connecting parts between the fins and the fin support parts The strength of can be increased.

It is also possible to integrally form each part of the heat dissipation fins using normal electrical discharge machining technology or electrolytic machining technology. It is easy to increase the heat dissipation efficiency of individual fins by making them thinner.

According to this semiconductor device, the surface area is increased by the inter-fin connection portion 10d, and the facing fins are fixed to each other by the inter-fin connection portion 10d, and each fin is strengthened, so that efficient cooling is achieved. effect can be realized.

Therefore, in a semiconductor device equipped with such a heat dissipation fin 10, the heat dissipation surface of the heat dissipation fin 10 can be increased without changing the size of the semiconductor device, and when an IC chip with a large amount of heat is mounted. However, the IC chip can be efficiently cooled.

FIG. 2 showing another embodiment shows a semiconductor device equipped with a heat dissipation fin that corresponds to the amount of heat generated by an IC chip mounted thereon, in which (a) is an overall configuration diagram and (b) is a portion of the heat dissipation fin. This is the same as in FIG. 1.

In addition, in FIG. 2, a radiation fin 11 is fixed to a stud 3a of a radiation fin fixture 3 instead of the radiation fin 10 in FIG. 1, and other parts are the same as in FIG. 1.

In Figures (a) and (b), the radiation fins 11 made of aluminum (A1) are made of aluminum (A f ) with a plurality of low heights h) on the individual fins of the radiation fins 10, which are the same as in Figure 1. This is configured by adding a heat sink 11a.

In a semiconductor device equipped with a heat dissipation fin 11 having such a configuration, the surface area of the heat dissipation fin 11 can be changed by changing the height (h), diameter, and number of the heat dissipation body 11a, so that the IC chip mounted thereon can be changed. It becomes possible to adjust the heat dissipation efficiency of the semiconductor device in accordance with the amount of heat generated, and it is possible to obtain a semiconductor device with good heat dissipation effect and thus good cooling effect.

In the explanation of the present invention, the case where a completed heat dissipation fin is fitted and fixed to a heat dissipation fin fixing tool is described, but it is not applicable to the case where a special heat dissipation body is not attached to each fin as in the conventional example. The same effect can be obtained by fitting and fixing the heat dissipation fin to the heat dissipation fin fixture and then joining and fixing the heat dissipation body formed into a predetermined shape.

Note that the radiation fin of the present invention can also be connected to another surface other than the above-mentioned radiation fin fixing device on the surface of the package, such as the surface of the cap.

〔Effect of the invention〕

As described above, according to the present invention, a heat dissipation fin that can be well connected to the package surface, has an increased surface area, and has sufficient strength can be obtained, and the semiconductor device can be efficiently and effectively cooled during use to improve its characteristics and productivity. Accordingly, it is possible to easily provide a semiconductor device according to the present invention.

[Brief explanation of drawings]

FIG. 1 is a diagram illustrating a configuration example of a semiconductor device according to the present invention, FIG. 2 is a diagram illustrating another embodiment, and FIG. 3 is a configuration diagram illustrating an example of a conventional semiconductor device. In the figure, 1 is an IC chip, 2 is a package body, 3 is a heat dissipation fin fixture, 3a is a stud, 4 is a gold thin film, 6a is a bonding wire, '7 is a package cover, to, ii are heat dissipation fins, 10a is a hole , 10b represents a central axis, IOc represents a disc-shaped fin, 10d represents an inter-fin connection portion, 10e represents a fin support portion, and 11a represents a heat sink, respectively. (A) (El) 3 苧51 B? ko (α) (b % Figure 2)

Claims (1)

[Claims] A plurality of fins (10c) arranged vertically at intervals on the package surface, and a fin provided in the center of the fin facing the package surface among the plurality of fins (10c), A fin support part (10e) connected to the package surface and mutually opposing fin surfaces of the plurality of fins (10c), the fin support part (10e) being connected to the package surface;
A semiconductor characterized by having a plurality of heat dissipating fins (10) provided in a peripheral area outside of the portion where 10e) are provided and including an inter-fin connection part (10d) that connects mutually opposing fins. Device.