JPH0230844Y2 - - Google Patents
Info
- Publication number
- JPH0230844Y2 JPH0230844Y2 JP863784U JP863784U JPH0230844Y2 JP H0230844 Y2 JPH0230844 Y2 JP H0230844Y2 JP 863784 U JP863784 U JP 863784U JP 863784 U JP863784 U JP 863784U JP H0230844 Y2 JPH0230844 Y2 JP H0230844Y2
- Authority
- JP
- Japan
- Prior art keywords
- carbon
- carbon layer
- printed circuit
- substrate
- bleeding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 29
- 229910052799 carbon Inorganic materials 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 230000000740 bleeding effect Effects 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Printing Methods (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Contacts (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP863784U JPS60121660U (ja) | 1984-01-25 | 1984-01-25 | 印刷配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP863784U JPS60121660U (ja) | 1984-01-25 | 1984-01-25 | 印刷配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60121660U JPS60121660U (ja) | 1985-08-16 |
| JPH0230844Y2 true JPH0230844Y2 (enrdf_load_stackoverflow) | 1990-08-20 |
Family
ID=30488110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP863784U Granted JPS60121660U (ja) | 1984-01-25 | 1984-01-25 | 印刷配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60121660U (enrdf_load_stackoverflow) |
-
1984
- 1984-01-25 JP JP863784U patent/JPS60121660U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60121660U (ja) | 1985-08-16 |
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