JPH02305495A - Lamination of multilayer printed wiring board - Google Patents

Abstract

PURPOSE:To enable inner boards not to be positionally deviated from each other in a lamination process by a method wherein prepregs around a fixing member are removed, and spacers formed of rigid material are arranged in place of the prepregs. CONSTITUTION:Prepregs 2 around and eyelet 4 are removed, and rigid spacers 5 are arranged in place of the prepregs 2. Therefore, the prepregs 2 to which heat and pressure are applied are melted to bond an outer board 1 to an inner board 3 or the inner boards 3 together, and at this point, as the rigid spacer 5 arranged around the eyelet 4 in place of the prepreg 2 which is melted by hot press, the eyelet 4 is never deformed. By this setup, a multilayer printed wiring board high in accuracy where inner boards are not positionally deviated from each other can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] This invention relates to the production of multilayer printed wiring boards.

[Conventional technology]

Figure 2 is a cross-sectional view of a conventional method of fixing the aligned inner layer substrate and prepreg with eyelets during the process of laminating the outer layer substrate, inner layer substrate, and prepreg during the lamination process of a multilayer printed panel board. In the figure, 1 is an outer layer substrate, 2 is a prepreg, 3 is an inner layer substrate, and 4 is a hetome.

Next, the operation will be explained. As shown in Fig. 2, the outer layer substrate l, prepreg 2, and inner layer substrate 3, which are electrically bonded together, are integrally molded by applying heat and pressure in the seeding step.
The prepreg 2 melts with heat and serves to bond the outer layer substrate 1 and the inner layer substrate 3 or the inner layer substrates 3 together.

[Problem to be solved by the invention]

However, in the conventional method, when heat and pressure are applied in the state shown in Fig. 2, the prepreg 2 around the eyelet 4 melts, causing the eyelet 4 to deform and the inner layer substrates 3 to be misaligned with each other. There was a problem.

This invention was made to solve the above-mentioned problems, and aims to provide a laminating method that does not cause positional scratches between inner layer substrates in the seed layer process.

[Means to solve the problem]

In the method for laminating a multilayer printed wiring board according to the present invention, the prepreg around the hem is removed and a rigid spacer is placed in its place.

[Effect]

In this invention, the presence of the rigid spacer prevents the depression from being deformed during the lamination process and eliminates misalignment between the inner layer substrates.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with respect to meat. l In Fig. 1, l is an outer layer substrate, 2 is a prepreg, 3 is an inner layer substrate, 4 is an eyelet, and 5 is a rigid material that does not melt with heat, which is placed in place of the prepreg around the eyelet 4. It is a spacer consisting of

Next, the effect will be explained. Similar to the prior art, the prepreg 2 applied with heat and pressure melts and slides the outer layer substrate 1 and the inner layer substrate 3 or the inner layer substrates 3 together, or at this time, there is no melting around the Ii# of the eyelet 4. Since the rigid spacer 6 is placed in place of the eyelet prepreg 2, the eyelet 4 is not deformed. [Effects of the Invention] As described above, according to the present invention, the prepreg around the eyelet can be replaced by a rigid spacer. By replacing them, deformation of the eyelets during the lamination process can be eliminated, and as a result, a highly accurate multilayer printed wiring board with no positional deviation between inner layer substrates can be obtained.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing the combination of material types before the lamination process of a multilayer printed wiring board by a conventional method. In the figure, 1 is an outer layer substrate, 2 is a prepreg, 3 is an inner layer substrate,
4 is a hetome, and 5 is a rigid spacer. In addition, are the same symbols in the diagram the same or equivalent Efts? show.

Claims (1)

[Claims] During the process of laminating multilayer printed wiring boards, in the process of connecting the multilayer board, inner layer board, and prepreg, fixing members such as grommets are used to attach the aligned inner layer boards and the prepreg to be inserted between each layer. A method for laminating a multilayer printed wiring board, which comprises removing the prepreg around the fixing member and arranging a spacer made of a rigid material in its place.