JP3992324B2 - Liquid crystal display device and manufacturing method thereof - Google Patents

Liquid crystal display device and manufacturing method thereof Download PDF

Info

Publication number
JP3992324B2
JP3992324B2 JP12007697A JP12007697A JP3992324B2 JP 3992324 B2 JP3992324 B2 JP 3992324B2 JP 12007697 A JP12007697 A JP 12007697A JP 12007697 A JP12007697 A JP 12007697A JP 3992324 B2 JP3992324 B2 JP 3992324B2
Authority
JP
Japan
Prior art keywords
glass substrate
liquid crystal
crystal display
display panel
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP12007697A
Other languages
Japanese (ja)
Other versions
JPH10301131A (en
Inventor
克彦 野口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Electronics Co Ltd
Original Assignee
Citizen Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Electronics Co Ltd filed Critical Citizen Electronics Co Ltd
Priority to JP12007697A priority Critical patent/JP3992324B2/en
Publication of JPH10301131A publication Critical patent/JPH10301131A/en
Application granted granted Critical
Publication of JP3992324B2 publication Critical patent/JP3992324B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other

Description

【0001】
【発明の属する技術分野】
本発明は液晶表示装置における、液晶表示パネルと外部マザー基板との接続技術に関する。
【0002】
【従来の技術】
液晶表示パネルのガラス基板の縁部に設けられた多数の表示電極端子群と、表示情報や電源を供給する外部回路を搭載したマザー基板(液晶表示パネルを駆動制御するための回路や電極を備えたプリント回路基板)上に設けた電極群との接続には殆ど例外なくコネクタ構造が用いられる。
【0003】
よく使用されるコネクタ構造の主な例をあげると、(1)ゼブラゴム(絶縁性と導電性のゴムを長手方向に交互に多数積層した角柱状のもの)を液晶表示パネル下面の電極端子面とマザー基板上面の電極群とで圧迫し、導電ゴム部の弾性接触により、対応する電極同志を接続する構造。
(2)フレキシブルシート基板(ポリイミド系樹脂やポリエステル系樹脂より成る薄く可撓性のある基板表面に、多条のリード配線を両端縁間に形成してある)の1端縁を、異方性導電シート(ACF)を仲介して液晶表示パネルの電極端子面に加熱圧着しあるいは銀ペーストを塗布し加熱固化させ、他の端縁をマザー基板の電極群に接続する構造。等がある。
【0004】
これらの従来技術には以下のような問題点がある。従来例(1)では、コネクタが柔軟で変形し易く、形状と圧着力を保持するため金属板もしくは樹脂製の枠状部材(成形用金型を必要とする)を用いることになるし、組立てにも工数がかかる。従来例(2)ではFPC等は金型で打抜かれるし、液晶表示パネルもまた他の構造物で支持しなければならない。即ちいずれの従来例においても表示パネル本体の他にコネクタと枠部品を必要とし、金型も伴い、コストがかかる。
【0005】
また液晶表示装置全体の設計にあたっては、コネクタの選択や液晶表示パネルの支持方法などの検討において、マザーボードを含む装置全体の設計を担当するセットメーカーと、液晶表示パネルおよびコネクタ関連の設計を担当する液晶表示パネルの部品メーカーとの協議も必要となる。故に表示まわりは設計の手番も負荷も大きく(時間的コスト大)、セット毎のカスタム性が高く、部品メーカーとしては極めて望ましいことである部品の形状や仕様の標準化が困難である上、部品点数が多く加工や組立の簡便性にも劣り、ローコスト化が困難であった。
【0006】
マザー基板には他の電子部品が当然実装されるが、それらは普通SMD(表面実装素子)化されており、ロボットとハンダリフロー炉等を用いた簡便な自動化処理ができる。しかし液晶パネルに耐熱性が乏しいためコネクタを用いる従来技術においては、このような手法もその一歩前としての個別のハンダ付けによる接続もできなかった。液晶表示パネルの接続を他の素子の実装と同時に、あるいは他の素子に準じた手法でマザー基板に実装できないことも表示装置の生産性向上やコストダウンを妨げていた。
【0007】
また液晶表示装置にはLEDランプ素子やELパネルである表示を照明するバックライト用素子とか、タッチパネルやタッチセンサーであるタッチスイッチ用の検出素子等、液晶表示パネルと密接な関係を有する機能素子を伴うことが多いが、やはり液晶パネルに耐熱性が乏しいことを主な理由として、これらの機能素子を液晶表示パネルにハンダや導電接着剤等を用いて直接接続することができなかった。
【0008】
提案された従来例として特開平3−282419号「液晶表示装置」がある。本従来例はその第1図に示す如く、液晶表示パネルの背面にELバックライトパネルを配置し、その両縁をコネクタの凹溝に差し込んで保持させたものである。また他の従来例として本出願人が出願しまだ公開されていない特願平9−44903号がある。これは照明用の発光素子のマザー基板への電気的接続を液晶表示パネルに固着したコネクタを介して行った構造を開示している。
【0009】
これら従来例においては、液晶表示パネルに付随する機能素子の保持や接続の構造として進歩があり、他の保持・接続用の構成部材を省略できる利点があるが、保持や接続をコネクタを介して行っているのでコネクタが必須であり、コネクタにまつわるコストや設計手番がかかる不利益を克服することはできない。
【0010】
【発明が解決しようとする課題】
本発明の目的は、液晶表示装置に伴うコネクタ構造を省略し、液晶表示パネルをマザー基板にハンダ付けあるいは熱硬化性の導電接着剤により直接接続することを可能にし、部品数が少なく極度に簡素化した構成で、製造のコストや時間的コストを大幅に削減した液晶表示装置を構成する技術を提供することである。
【0011】
本発明の液晶表示装置は、下記(1)または(2)の特徴を有する。
(1)液晶表示パネルを構成する、略長方形状の平面形状を有する上ガラス基板と下ガラス基板のうち、前記上ガラス基板の長手方向の両側に大きく突き出た下ガラス基板の両短辺の側面には該下ガラス基板を貫通して設けられた後で分割された多数のスルーホールを有し、該分割されたスルーホールのそれぞれの内側面を覆うと共に前記上ガラス基板の外縁から離れた位置で前記下ガラス基板上面の表示用透明電極と個々に接続している銀パラジウム電極が塗布および焼成によって形成されており、前記液晶パネルをマザー基板に前記下ガラス基板が接するように載置し、前記マザー基板上の表示駆動電極の個々と、前記液晶表示パネルの外周側面に露出している前記分割されたスルーホールの内側面の銀パラジウム電極の個々とをハンダにて直接接続したこと。
)前記(1)において、前記液晶表示パネルを構成する上ガラス基板または下ガラス基板の表面に、ポリイミド樹脂を基材とする偏光板を固着したこと。
本発明の液晶表示装置の製造方法は、下記(3)の特徴を有する。
(3)液晶表示パネルを構成する上ガラス基板または下ガラス基板が整列した状態で含まれる大ガラス基板を準備し、該大ガラス基板に透明電極を形成する工程と、該透明電極の上に配向層を形成する工程と、前記大ガラス基板における前記上ガラス基板よりも長手方向に大なる前記下ガラス基板の両短辺となる位置に直線状に配列されるようにスルーホールの穴あけを行なう工程と、前記大ガラス基板の上下面および前記スルーホール内面に前記透明電極と一部重なるようにかつその重なり位置は前記上ガラスの外縁となる位置よりも離れているように銀パラジウムを含む導電ペーストを塗布する工程と、該導電ペーストを約500°Cで焼成して銀パラジウム電極を形成する工程と、大ガラス基板に液晶注入空間を作るためのシール材を印刷する工程と、2枚の大ガラス基板を前記上ガラス基板と下ガラス基板が重なるように貼合わせる工程と、液晶の注入および封止を行なう工程と、前記スルーホール列の中心を通る切断線で個々の液晶表示パネルに分割する工程と、液晶表示パネルに基材がポリイミド樹脂である偏光板を貼付ける工程と、偏光板付きの前記液晶表示パネルを前記下ガラス側が接するようにマザー基板上に載置し、該マザー基板上の表示駆動電極と前記液晶表示パネルの長手方向の外縁に配列した分割されたスルーホールとを重ね、前記表示駆動電極と前記分割されたスルーホール内面の銀パラジウム電極とをハンダ付けする工程とを有すること。
【0012】
【発明の実施の形態】
図1(a)は本発明の実施の形態の1例における液晶表示パネルの平面図、同(b)はそのA−A線断面図である。図において、1は液晶表示パネルの上ガラス基板、2は下ガラス基板であり、その間隙に液晶材料(図示せず)を保持する。3は下ガラス基板2の上面に形成された下ITO電極(透明導電膜)である。4は下ガラス基板に切断前に明けられ、切断された状態のスルーホール、5は銀パラジウム電極で、下ITO電極に一部重なるように、そしてスルーホール4の内壁と重なり、下ガラス基板2の両端面付近に所定のピッチで多数形成されている。なお6は上ガラス1の上面に貼りつけられた上偏光板である。
【0013】
以下(b)の断面図によって液晶表示パネルの接続状態を説明する。マザー基板等は点線(想像線の代用)で描かれている。7はマザー基板、8はその上面に形成されたマザー基板電極で、一般的な銅箔のパターンであり、液晶表示パネルと重なる部分の平面的配置は、銀パラジウム電極5と等しいピッチでかつ一致するように配列されている。9はハンダで、スルーホール4の内壁面に形成された銀パラジウム電極5とマザー基板電極8の各々1個づつを接続する。
【0014】
液晶表示パネルを構成する要素の内、液晶材料を除けば上偏光板6や図示しない下偏光板も普通耐熱性が低い。これを改善するために偏光板の基材を耐熱性の高い材料であるポリイミド樹脂とすることができる。ポリイミド樹脂の透光性はやや劣るが、厚さを数10μm程度に薄くすることで解決できる。
【0015】
図2は本発明の実施の形態の一例に用いるガラス基板の主要な製造工程図、図3は工程3までを行った状態の大ガラス基板の平面図、図4は工程4までを行った状態の大ガラス基板の平面図、図5(a)は工程5を行った状態、(b)は工程6を行った状態の大ガラス基板のスルーホール部の断面図である。
【0016】
上下のガラス基板は、例えば250mm×200mmのサイズを持つ大ガラス基板の面内に多数個づつ同時形成され、最後に個々に分離される。なお図3、図4では1枚の大ガラス基板内に上ガラス基板と下ガラス基板が共に描かれているが、これは説明の便宜のためで、実際には同じ大ガラス基板には同種のガラス基板のみを作り込む方が収率がよいであろう。
【0017】
図2工程1で大ガラス基板の表面にITO電極が蒸着され、工程2で所要のパターンにエッチングされる。工程3では液晶を配向させるための配向層が加工形成される。本工程終了時の状態を図3に示す。図3において、10は大ガラス基板であり、その中で最終的に切断分離さるべき上ガラス基板1および下ガラス基板2の予定の輪郭を細い実線で示してある。3はパターン化されたITO電極であるが、表示にかかわる部分は図示を省略し、引出し線となる部分だけを細い実線で示した。
【0018】
図2工程4ではドリルを用いて多数のスルーホールの穴明け加工が行われる。穴径は0.3mm以上で例えば0.5mmである。(この場合、穴列のピッチ即ち表示引出し端子の間隔は穴径にもよるが0.6mm以上1.5mm以下例えば0.8−1mm程度が可能となり、極めて高密度とは言えないが、比較的単純な表示パターン、あるいはLCDドライバーICを液晶表示パネル上に搭載して液晶表示パネルへの入出力端子数を抑えた表示装置に対しては十分対応できる。)この工程が済んだ状態を拡大して図4に示す。
【0019】
図2工程5では銀パラジウムを含む導電ペーストを大ガラス基板の上面のスルーホール4の周囲にスクリーン印刷法にて塗布する。このとき大ガラス基板10の下面から真空吸引を行って導電ペーストがスルーホールの内壁面まで覆うようにする。この状態を図5(a)に示す。穴周辺の導電ペーストは下ITO電極3に一部重ねられるので両者は導通し、銀パラジウム電極5は完成後表示引出し線の端子となる。次に工程6で大ガラス基板10の下面に対して同様な作業を行うと、導電ペーストはスルーホール4の内壁面を完全に覆う。この状態を図5(b)に示す。
【0020】
図2工程7では塗布された導電ペーストを焼成して銀パラジウム電極5を完成する。焼成温度は液晶表示パネル用ガラス材の転移点温度(Tg)約560°Cを下回る約500°Cである。銀パラジウムの焼成温度は従来700−750°Cもあったが、最近低温焼成用の材料が開発されたことも本発明を可能にした。
【0021】
以下従来技術と同様であるから簡略に述べる。図2工程8では液晶注入空間を作るためのシール剤印刷、工程9ではコモン電極の印刷、工程10では大ガラス基板の貼合わせ(異なる大ガラス基板上にある上ガラス基板予定部と下ガラス基板予定部とが位置合わせされ重ね合わされる)、工程11では液晶の注入と封止、工程12では単体の液晶表示パネルへの切断分離が行われ、工程13では上下偏光板の貼付けが行われ、完成液晶表示パネルが得られる。
【0022】
切断はスライサー等を用いて行うが、所定の切断線はスルーホール4の中心を通るので個々のスルーホールは2つに分割され、内壁面に形成された銀パラジウム電極は図1のように分離された液晶表示パネルの側面に露出し、本発明におけるハンダ付け可能な端子電極群が得られる。
【0023】
次に図示しないが、完成液晶表示パネルとマザー基板とのハンダ付け工程について述べる。ハンダ付けはマザー基板9に液晶表示パネルを位置決めして載せ、液晶パネル全体の耐熱性が許せばハンダリフロー炉を通して行うことが望ましいが、耐熱性がまだ厳しい場合には手作業でエアーガン等を用いて手早いハンダ付けを行ってもよい。またガラスの割れやクラックを防ぐため、液晶の耐熱温度例えば100−120°Cにプレヒートしたり、銀パラジウム電極上にハンダメッキを施しておいてもよい。またハンダ量を制御して下ガラス基板の下面に回った銀パラジウム電極だけとマザー基板電極との接続を行ってもよい。
【0024】
次に本発明の他の実施の形態について述べておく。端子電極となる金属皮膜の材質については、銀パラジウム以外にも適用し得るものがあり得る。またハンダ付け可能な端子電極群の製法として、小穴のスルーホールを用いず、予め切断を行った上または下ガラス基板の平滑な側面、あるいはスルーホール列の代わりに直線状の長穴を明けた状態の大ガラス基板の長穴の平滑な内壁面に金属膜を形成してもよい(スルーサイド)。例えば銀ペーストを板面方向に並ぶ縞状に転写印刷して焼成し、更に銅、ニッケル等の下地メッキを施した後、ハンダメッキを行う。要は耐熱性と強度を必要なだけ備えた金属皮膜をガラス基板の側面付近に形成できればよい。またマザー基板と液晶表示パネルとの接続はハンダ付けに限らず、熱硬化性の導電接着剤を用いてもよいし、あるいはハンダ材以外の低融点合金を用いて接合してもよい。本発明の適用範囲は前に説明された実施例に限られない。
【0025】
【発明の効果】
本発明においては、液晶表示パネルとマザー基板との直接接続ができる技術を達成したので、以下の諸効果が得られる。
(1)コネクタや接続部材を用いずに液晶表示パネルのマザー基板への支持と接続が可能となり、表示装置の構成が著しく簡素化される。
(2)その結果、表示装置の大幅なコストダウンが達成される。
(3)セットメーカーと部品メーカー共に設計負荷が減少し納期も短縮される。
(4)コネクタもなく液晶表示パネルの支持枠も不要化し、超薄型の表示体構造も可能になる。
(5)本発明の技術は適用範囲が広く、液晶表示パネル上に照明用素子やタッチ検出用素子等の機能素子を直接搭載させた構造に応用でき、その場合も極限的に簡素化した構造を実現できる。
【図面の簡単な説明】
【図1】(a)は本発明の実施の形態の一例の平面図、(b)はそのA−A線断面図である。
【図2】前記実施の形態における液晶表示パネルの製造工程図である。
【図3】前記製造工程中第3工程を終えた大ガラス基板の平面図である。
【図4】前記製造工程中第4工程を終えた大ガラス基板の一部平面図である。
【図5】前記製造工程中、(a)は第5工程、(b)は第6工程を終えた大ガラス基板の断面図である。
【符号の説明】
1 上ガラス基板
2 下ガラス基板
3 下ITO電極
4 スルーホール
5 銀パラジウム電極
6 上偏光板
7 マザー基板
8 マザー基板電極
9 ハンダ
10 大ガラス基板
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a technology for connecting a liquid crystal display panel and an external mother substrate in a liquid crystal display device.
[0002]
[Prior art]
A mother board (provided with circuits and electrodes for driving and controlling the liquid crystal display panel) equipped with a large number of display electrode terminal groups provided at the edge of the glass substrate of the liquid crystal display panel and an external circuit for supplying display information and power The connector structure is used almost without exception for the connection with the electrode group provided on the printed circuit board).
[0003]
Main examples of commonly used connector structures are: (1) zebra rubber (a prismatic structure in which a number of insulating and conductive rubbers are alternately stacked in the longitudinal direction) and the electrode terminal surface on the bottom surface of the liquid crystal display panel. A structure in which the electrodes are pressed together with the electrodes on the upper surface of the mother board, and the corresponding electrodes are connected by elastic contact of the conductive rubber part.
(2) One edge of a flexible sheet substrate (multiple lead wiring is formed between both ends on a thin and flexible substrate surface made of polyimide resin or polyester resin) is anisotropic. A structure in which a conductive sheet (ACF) is used as an intermediate to heat-press the electrode terminal surface of the liquid crystal display panel or apply a silver paste to solidify by heating, and connect the other edge to the electrode group of the mother substrate. Etc.
[0004]
These conventional techniques have the following problems. In the conventional example (1), the connector is flexible and easily deformed, and a metal plate or a resin frame-like member (requiring a molding die) is used to maintain the shape and the crimping force. Takes time. In the conventional example (2), the FPC or the like is punched with a mold, and the liquid crystal display panel must also be supported with another structure. That is, in any of the conventional examples, a connector and a frame part are required in addition to the display panel body, and a die is involved, which is expensive.
[0005]
In designing the entire liquid crystal display device, we are in charge of the design of the liquid crystal display panel and connectors, as well as the set manufacturer who is responsible for the design of the entire device including the motherboard, in consideration of the selection of connectors and the support method of the liquid crystal display panel. Consultation with LCD panel parts manufacturers is also necessary. Therefore, the design around the display is heavy in design and load (large time cost), high customizability for each set, and it is difficult to standardize the shape and specifications of parts, which is extremely desirable for parts manufacturers. It was difficult to reduce the cost because of the large number of points and inferior processing and assembly.
[0006]
Other electronic components are naturally mounted on the mother board, but they are usually SMD (surface mounted device) and can be easily automated using a robot and a solder reflow furnace. However, since the heat resistance of the liquid crystal panel is poor, in the conventional technique using a connector, such a method cannot be connected by individual soldering as a step ahead. The fact that the connection of the liquid crystal display panel cannot be mounted on the mother substrate at the same time as mounting of other elements or by a method according to other elements has hindered improvement in productivity and cost reduction of the display device.
[0007]
In addition, the liquid crystal display device includes functional elements having a close relationship with the liquid crystal display panel, such as a backlight element that illuminates a display that is an LED lamp element or an EL panel, or a detection element for a touch switch that is a touch panel or a touch sensor. In many cases, however, these functional elements cannot be directly connected to the liquid crystal display panel using solder, conductive adhesive or the like, mainly because the liquid crystal panel has poor heat resistance.
[0008]
Japanese Patent Laid-Open No. 3-282419 “Liquid Crystal Display” is a conventional example proposed. In this conventional example, as shown in FIG. 1, an EL backlight panel is disposed on the back surface of a liquid crystal display panel, and both edges thereof are inserted into concave grooves of a connector and held. As another conventional example, there is Japanese Patent Application No. 9-44903 filed by the present applicant and not yet published. This discloses a structure in which an electrical connection of a light emitting element for illumination to a mother substrate is made through a connector fixed to a liquid crystal display panel.
[0009]
In these conventional examples, there is an advance as a structure for holding and connecting a functional element attached to the liquid crystal display panel, and there is an advantage that other constituent members for holding and connecting can be omitted. Since this is done, a connector is essential, and the disadvantages associated with the cost and design cost of the connector cannot be overcome.
[0010]
[Problems to be solved by the invention]
The object of the present invention is to eliminate the connector structure associated with the liquid crystal display device, and to enable the liquid crystal display panel to be directly connected to the mother board by soldering or by using a thermosetting conductive adhesive. It is to provide a technique for constructing a liquid crystal display device that has a reduced structure and significantly reduced manufacturing costs and time costs.
[0011]
The liquid crystal display device of the present invention has the following feature (1) or (2).
(1) Of the upper glass substrate and the lower glass substrate having a substantially rectangular planar shape constituting the liquid crystal display panel, the side surfaces of both short sides of the lower glass substrate protruding greatly on both sides in the longitudinal direction of the upper glass substrate Has a plurality of through-holes that are divided after being provided through the lower glass substrate, covers the inner side surfaces of the divided through-holes, and is located away from the outer edge of the upper glass substrate A silver palladium electrode individually connected to the transparent electrode for display on the upper surface of the lower glass substrate is formed by coating and firing, and the liquid crystal panel is placed so that the lower glass substrate is in contact with the mother substrate, solder and individual display driving electrode on the mother substrate, and the individual silver-palladium electrodes of the inner side surface of the divided through holes are exposed on the outer peripheral side surface of said liquid crystal display panel It has direct connection Te.
( 2 ) In (1), a polarizing plate having a polyimide resin as a base material is fixed to the surface of an upper glass substrate or a lower glass substrate constituting the liquid crystal display panel.
The manufacturing method of the liquid crystal display device of the present invention has the following feature (3).
(3) preparing a large glass substrate included in an aligned state of the upper glass substrate or the lower glass substrate constituting the liquid crystal display panel, forming a transparent electrode on the large glass substrate, and aligning on the transparent electrode A step of forming a layer, and a step of drilling through holes so that the large glass substrate is linearly arranged at positions that are both short sides of the lower glass substrate that is larger in the longitudinal direction than the upper glass substrate. And a conductive paste containing silver palladium so that the transparent electrode partially overlaps with the upper and lower surfaces of the large glass substrate and the inner surface of the through-hole, and the overlapping position is separated from the position serving as the outer edge of the upper glass. A step of forming a silver-palladium electrode by baking the conductive paste at about 500 ° C., and a sealing material for creating a liquid crystal injection space on a large glass substrate A step of printing, a step of laminating two large glass substrates so that the upper glass substrate and the lower glass substrate overlap, a step of injecting and sealing liquid crystal, and a cutting line passing through the center of the through-hole row On the mother substrate so that the lower glass side is in contact with the liquid crystal display panel, the step of attaching a polarizing plate whose base material is a polyimide resin to the liquid crystal display panel, The display drive electrode on the mother substrate and the divided through hole arranged on the outer edge in the longitudinal direction of the liquid crystal display panel are overlapped, and the display drive electrode and silver palladium on the inner surface of the divided through hole are overlapped. And soldering the electrodes.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1A is a plan view of a liquid crystal display panel in one example of an embodiment of the present invention, and FIG. In the figure, 1 is an upper glass substrate of a liquid crystal display panel, and 2 is a lower glass substrate, and a liquid crystal material (not shown) is held in the gap. Reference numeral 3 denotes a lower ITO electrode (transparent conductive film) formed on the upper surface of the lower glass substrate 2. Reference numeral 4 denotes a through-hole that is opened before being cut into the lower glass substrate, and 5 is a silver-palladium electrode. The lower glass substrate 2 overlaps with the inner wall of the through-hole 4 so as to partially overlap the lower ITO electrode. A large number of them are formed at a predetermined pitch in the vicinity of both end faces. Reference numeral 6 denotes an upper polarizing plate attached to the upper surface of the upper glass 1.
[0013]
The connection state of the liquid crystal display panel will be described below with reference to the cross-sectional view of (b). The mother board and the like are drawn with dotted lines (instead of imaginary lines). 7 is a mother substrate, and 8 is a mother substrate electrode formed on the upper surface thereof, which is a general copper foil pattern. The planar arrangement of the portion overlapping the liquid crystal display panel is the same pitch and coincides with the silver palladium electrode 5. Are arranged to be. Reference numeral 9 denotes solder, which connects one silver palladium electrode 5 and one mother substrate electrode 8 formed on the inner wall surface of the through hole 4 one by one.
[0014]
Of the elements constituting the liquid crystal display panel, the upper polarizing plate 6 and the lower polarizing plate (not shown) are usually low in heat resistance except for the liquid crystal material. In order to improve this, the base material of a polarizing plate can be made into the polyimide resin which is a material with high heat resistance. Although the translucency of the polyimide resin is slightly inferior, it can be solved by reducing the thickness to about several tens of μm.
[0015]
FIG. 2 is a main manufacturing process diagram of a glass substrate used for an example of an embodiment of the present invention, FIG. 3 is a plan view of a large glass substrate in a state where up to step 3 is performed, and FIG. 5A is a plan view of the large glass substrate, FIG. 5A is a cross-sectional view of the through-hole portion of the large glass substrate in which the step 5 is performed, and FIG.
[0016]
A large number of upper and lower glass substrates are simultaneously formed on the surface of a large glass substrate having a size of 250 mm × 200 mm, for example, and finally separated individually. In FIGS. 3 and 4, the upper glass substrate and the lower glass substrate are drawn together in one large glass substrate, but this is for convenience of explanation. The yield will be better if only the glass substrate is made.
[0017]
In FIG. 2, step 1, ITO electrodes are deposited on the surface of the large glass substrate, and in step 2, they are etched into a required pattern. In step 3, an alignment layer for aligning liquid crystals is processed and formed. The state at the end of this step is shown in FIG. In FIG. 3, reference numeral 10 denotes a large glass substrate, in which the predetermined outlines of the upper glass substrate 1 and the lower glass substrate 2 to be finally cut and separated are indicated by thin solid lines. Reference numeral 3 denotes a patterned ITO electrode, but the portion related to display is not shown, and only the portion that becomes the lead line is shown by a thin solid line.
[0018]
In step 4 of FIG. 2, a number of through holes are drilled using a drill. The hole diameter is 0.3 mm or more, for example 0.5 mm. (In this case, the pitch of the hole rows, that is, the distance between the display lead terminals is 0.6 mm or more and 1.5 mm or less, for example, about 0.8-1 mm, although it depends on the hole diameter. This is enough for a display device that has a simple display pattern or LCD driver IC mounted on the liquid crystal display panel to reduce the number of input / output terminals to the liquid crystal display panel. This is shown in FIG.
[0019]
In step 5 of FIG. 2, a conductive paste containing silver palladium is applied around the through hole 4 on the upper surface of the large glass substrate by screen printing. At this time, vacuum suction is performed from the lower surface of the large glass substrate 10 so that the conductive paste covers the inner wall surface of the through hole. This state is shown in FIG. Since the conductive paste around the hole is partially overlapped with the lower ITO electrode 3, they both conduct, and the silver-palladium electrode 5 becomes a terminal of the display lead line after completion. Next, when the same operation is performed on the lower surface of the large glass substrate 10 in step 6, the conductive paste completely covers the inner wall surface of the through hole 4. This state is shown in FIG.
[0020]
In step 7 of FIG. 2, the applied conductive paste is baked to complete the silver palladium electrode 5. The firing temperature is about 500 ° C. which is lower than the transition temperature (Tg) of about 560 ° C. of the glass material for liquid crystal display panels. The firing temperature of silver palladium has been 700-750 ° C. in the past, but the recent development of materials for low temperature firing has also enabled the present invention.
[0021]
Since it is the same as the prior art, a brief description will be given below. In FIG. 2, step 8 is a sealant printing for creating a liquid crystal injection space, a step 9 is printing a common electrode, and a step 10 is bonding a large glass substrate (an upper glass substrate planned portion and a lower glass substrate on different large glass substrates). In step 11, liquid crystal is injected and sealed, in step 12, cut and separated into a single liquid crystal display panel is performed, and in step 13, upper and lower polarizing plates are pasted, A finished liquid crystal display panel is obtained.
[0022]
Cutting is performed using a slicer or the like, but the predetermined cutting line passes through the center of the through hole 4, so each through hole is divided into two parts, and the silver-palladium electrode formed on the inner wall surface is separated as shown in FIG. A terminal electrode group which is exposed on the side surface of the liquid crystal display panel and can be soldered according to the present invention is obtained.
[0023]
Next, although not shown, a soldering process between the completed liquid crystal display panel and the mother substrate will be described. Soldering is preferably done by positioning and placing the LCD panel on the mother board 9 and through a solder reflow furnace if the entire LCD panel allows heat resistance, but if the heat resistance is still severe, use an air gun or the like by hand. You can also solder quickly. In order to prevent the glass from cracking or cracking, it may be preheated to a heat resistant temperature of the liquid crystal, for example, 100 to 120 ° C., or may be subjected to solder plating on the silver palladium electrode. Further, only the silver-palladium electrode turned to the lower surface of the lower glass substrate by controlling the amount of solder may be connected to the mother substrate electrode.
[0024]
Next, another embodiment of the present invention will be described. Regarding the material of the metal film used as the terminal electrode, there may be a material other than silver palladium. In addition, as a method of manufacturing a terminal electrode group that can be soldered, a straight long hole is drilled instead of a through-hole array on the smooth side surface of the upper or lower glass substrate that has been cut in advance without using a small hole through-hole. A metal film may be formed on the smooth inner wall surface of the long hole of the large glass substrate in the state (through side). For example, a silver paste is transferred and printed in stripes aligned in the plate surface direction, fired, and further subjected to a base plating such as copper or nickel, followed by solder plating. In short, it is only necessary to form a metal film having the necessary heat resistance and strength near the side surface of the glass substrate. Further, the connection between the mother substrate and the liquid crystal display panel is not limited to soldering, and a thermosetting conductive adhesive may be used, or a low melting point alloy other than the solder material may be used for bonding. The scope of application of the present invention is not limited to the previously described embodiments.
[0025]
【The invention's effect】
In the present invention, since the technology capable of directly connecting the liquid crystal display panel and the mother substrate has been achieved, the following effects can be obtained.
(1) The liquid crystal display panel can be supported and connected to the mother substrate without using a connector or a connecting member, and the configuration of the display device is remarkably simplified.
(2) As a result, a significant cost reduction of the display device is achieved.
(3) Both the set maker and the parts maker reduce the design load and shorten the delivery time.
(4) Since there is no connector and no support frame for the liquid crystal display panel is required, an ultra-thin display body structure is possible.
(5) The technology of the present invention has a wide range of applications, and can be applied to a structure in which functional elements such as illumination elements and touch detection elements are directly mounted on a liquid crystal display panel, and in that case also a structure that is extremely simplified Can be realized.
[Brief description of the drawings]
1A is a plan view of an example of an embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line AA in FIG.
FIG. 2 is a manufacturing process diagram of the liquid crystal display panel in the embodiment.
FIG. 3 is a plan view of a large glass substrate after a third step in the manufacturing process.
FIG. 4 is a partial plan view of a large glass substrate after the fourth step in the manufacturing process.
5A is a cross-sectional view of a large glass substrate after the fifth step and FIG. 5B after the sixth step during the manufacturing process.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Upper glass substrate 2 Lower glass substrate 3 Lower ITO electrode 4 Through hole 5 Silver palladium electrode 6 Upper polarizing plate 7 Mother substrate 8 Mother substrate electrode 9 Solder 10 Large glass substrate

Claims (3)

液晶表示パネルを構成する、略長方形状の平面形状を有する上ガラス基板と下ガラス基板のうち、前記上ガラス基板の長手方向の両側に大きく突き出た下ガラス基板の両短辺の側面には該下ガラス基板を貫通して設けられた後で分割された多数のスルーホールを有し、該分割されたスルーホールのそれぞれの内側面を覆うと共に前記上ガラス基板の外縁から離れた位置で前記下ガラス基板上面の表示用透明電極と個々に接続している銀パラジウム電極が塗布および焼成によって形成されており、前記液晶パネルをマザー基板に前記下ガラス基板が接するように載置し、前記マザー基板上の表示駆動電極の個々と、前記液晶表示パネルの外周側面に露出している前記分割されたスルーホールの内側面の銀パラジウム電極の個々とをハンダにて直接接続したことを特徴とする液晶表示装置。 Among the upper glass substrate and the lower glass substrate having a substantially rectangular planar shape constituting the liquid crystal display panel, the side surfaces of both short sides of the lower glass substrate protruding greatly on both sides in the longitudinal direction of the upper glass substrate are A plurality of through-holes divided after being provided through the lower glass substrate are covered, and each of the divided through-holes covers the inner side surface of the divided through-hole and is separated from the outer edge of the upper glass substrate. A silver-palladium electrode individually connected to the transparent electrode for display on the upper surface of the glass substrate is formed by coating and baking, and the liquid crystal panel is placed so that the lower glass substrate is in contact with the mother substrate, and the mother substrate straight and individual display driving electrodes of the upper and the individual silver-palladium electrodes of the inner side surface of the divided through holes are exposed on the outer peripheral side surface of said liquid crystal display panel by soldering The liquid crystal display device, characterized in that connected. 前記液晶表示パネルを構成する上ガラス基板または下ガラス基板の表面に、ポリイミド樹脂を基材とする偏光板を固着したことを特徴とする請求項1に記載の液晶表示装置。  The liquid crystal display device according to claim 1, wherein a polarizing plate based on a polyimide resin is fixed to a surface of an upper glass substrate or a lower glass substrate constituting the liquid crystal display panel. 液晶表示パネルを構成する上ガラス基板または下ガラス基板が整列した状態で含まれる大ガラス基板を準備し、該大ガラス基板に透明電極を形成する工程と、該透明電極の上に配向層を形成する工程と、前記大ガラス基板における前記上ガラス基板よりも長手方向に大なる前記下ガラス基板の両短辺となる位置に直線状に配列されるようにスルーホールの穴あけを行なう工程と、前記大ガラス基板の上下面および前記スルーホール内面に前記透明電極と一部重なるようにかつその重なり位置は前記上ガラスの外縁となる位置よりも離れているように銀パラジウムを含む導電ペーストを塗布する工程と、該導電ペーストを約500°Cで焼成して銀パラジウム電極を形成する工程と、大ガラス基板に液晶注入空間を作るためのシール材を印刷する工程と、2枚の大ガラス基板を前記上ガラス基板と下ガラス基板が重なるように貼合わせる工程と、液晶の注入および封止を行なう工程と、前記スルーホール列の中心を通る切断線で個々の液晶表示パネルに分割する工程と、液晶表示パネルに基材がポリイミド樹脂である偏光板を貼付ける工程と、偏光板付きの前記液晶表示パネルを前記下ガラス側が接するようにマザー基板上に載置し、該マザー基板上の表示駆動電極と前記液晶表示パネルの長手方向の外縁に配列した分割されたスルーホールとを重ね、前記表示駆動電極と前記分割されたスルーホール内面の銀パラジウム電極とをハンダ付けする工程とを有することを特徴とする液晶表示装置の製造方法。Preparing a large glass substrate included in an aligned state of an upper glass substrate or a lower glass substrate constituting a liquid crystal display panel, forming a transparent electrode on the large glass substrate, and forming an alignment layer on the transparent electrode And a step of drilling through holes so as to be linearly arranged at positions that are both short sides of the lower glass substrate that is larger in the longitudinal direction than the upper glass substrate in the large glass substrate, and A conductive paste containing silver palladium is applied so that the transparent electrode partially overlaps the upper and lower surfaces of the large glass substrate and the inner surface of the through hole, and the overlapping position is separated from the position of the outer edge of the upper glass. Printing a sealing material for forming a liquid crystal injection space on a large glass substrate, a step of baking the conductive paste at about 500 ° C. to form a silver palladium electrode, and A process, a process of laminating two large glass substrates so that the upper glass substrate and the lower glass substrate overlap, a step of injecting and sealing liquid crystal, and a cutting line passing through the center of the through-hole row. A process of dividing the liquid crystal display panel into a liquid crystal display panel, a process of attaching a polarizing plate whose base material is a polyimide resin to the liquid crystal display panel, and a liquid crystal display panel with a polarizing plate mounted on the mother substrate so that the lower glass side is in contact And the display drive electrode on the mother substrate and the divided through hole arranged on the outer edge in the longitudinal direction of the liquid crystal display panel are overlapped, and the display drive electrode and the silver palladium electrode on the inner surface of the divided through hole, And a method of manufacturing a liquid crystal display device.
JP12007697A 1997-04-24 1997-04-24 Liquid crystal display device and manufacturing method thereof Expired - Fee Related JP3992324B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12007697A JP3992324B2 (en) 1997-04-24 1997-04-24 Liquid crystal display device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12007697A JP3992324B2 (en) 1997-04-24 1997-04-24 Liquid crystal display device and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JPH10301131A JPH10301131A (en) 1998-11-13
JP3992324B2 true JP3992324B2 (en) 2007-10-17

Family

ID=14777316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12007697A Expired - Fee Related JP3992324B2 (en) 1997-04-24 1997-04-24 Liquid crystal display device and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JP3992324B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4038969B2 (en) * 2000-07-31 2008-01-30 セイコーエプソン株式会社 LIQUID CRYSTAL DEVICE, ITS CONNECTION METHOD, AND ELECTRONIC DEVICE
KR20040053123A (en) * 2001-09-07 2004-06-23 마츠시타 덴끼 산교 가부시키가이샤 Display apparatus and its manufacturing method

Also Published As

Publication number Publication date
JPH10301131A (en) 1998-11-13

Similar Documents

Publication Publication Date Title
KR100321883B1 (en) Structure and method of mounting semiconductor device and liquid crystal display device
US7977698B2 (en) System and method for surface mountable display
US6266119B1 (en) Liquid crystal apparatus and production process thereof
JPH025375A (en) Actual fitting of electronic component
JPS63246724A (en) Liquid crystal display device
EP1026744A1 (en) Video display and manufacturing method therefor
JPH09203907A (en) Liquid crystal display device and its production apparatus
JP3992324B2 (en) Liquid crystal display device and manufacturing method thereof
JP3646639B2 (en) Substrate mounting structure, electro-optical device, and electronic apparatus
WO1998048319A1 (en) Tiled flat panel displays
JP3797742B2 (en) Manufacturing method of liquid crystal display panel
JP3856521B2 (en) Liquid crystal display
JP3157967B2 (en) Display panel mounting structure
JP2010212466A (en) Method of manufacturing junction structure
JP3642324B2 (en) Liquid crystal display device and electro-optical device
JP3729113B2 (en) Electronics
JP2000077484A (en) Tape material for flexible substrate, manufacture of the flexible substrate, manufacture of semiconductor device, and manufacture of liquid crystal device
JP2959641B2 (en) Liquid crystal display
JP3601455B2 (en) Liquid crystal display
JP3636159B2 (en) Liquid crystal display device, semiconductor chip mounting structure, electro-optical device, and electronic printing device
JP4109665B2 (en) Mobile phone
JP2008216466A (en) Display device and manufacturing method thereof
JPS6119191A (en) Printed board structure
JPH0521240U (en) Liquid crystal display
JPS6119190A (en) Mounting structure of electronic device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040308

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060127

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070406

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070528

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070724

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070724

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100803

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100803

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130803

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees