JPH02302052A - Tape carrier - Google Patents

Abstract

PURPOSE:To reduce the number of kinds of tape carriers, to improve an economical efficiency and to enhance a productivity by a method wherein an inner lead is formed to be longer in advance and an excess length is cut so as to be connected to different kinds of semiconductor elements. CONSTITUTION:In tape carriers 1, 11, inner leads 1b, composed of conductors, which surround, from peripheral edges of four sides, a square mounting hole 1a-1 which has been made in a tape-shaped film 1a composed of a polyimide resin or the like and into which a semiconductor element is inserted in such a way that the inner leads correspond to electrodes formed at the four sides on the rear of the square semiconductor element protrude into the hole. Out of the inner leads 1b at the four sides, inner leads 1b-x at two opposite sides in an X-direction are extended, from both sides, between inner leads 1b-y at the other two sides in a Y-direction and are formed to be longer in advance so as to cut excess lengths to prescribed mounting lengths. The inner leads 1b-y at the other two sides are formed so as to be overlapped exactly with the electrodes (figure omitted) of the semiconductor element.

Description

[Detailed Description of the Invention] [Summary] This invention relates to a tape carrier for mounting and connecting semiconductor elements to an insulating substrate, etc., and more specifically, regarding the shape of an inner lead, connecting several types of semiconductor elements with one type and minimizing the number of types. A tape carrier comprising inner leads that protrude from the four sides of a rectangular mounting hole in a tape-like film into which a semiconductor element is inserted, and are connected to the electrodes of the semiconductor element by overlapping them.

Among the inner leads, the inner leads on two opposing sides are lengthened in advance so as to protrude from both sides between the inner leads on the other two sides, and the excess length is cut off to a predetermined length for mounting.

[Industrial Application Field] The present invention relates to a tape carrier for mounting and connecting a semiconductor element to an insulating substrate or the like, and more specifically relates to the shape of an inner lead.

Tape carriers used for signal connection and mounting of semiconductor devices (chips) are made by repeatedly forming inner leads corresponding to the electrodes of the semiconductor device on a tape-like film, and after bonding the inner leads, cut out the outer leads and roll them into a momme color. Mount and connect to wiring electrodes such as the main moat base.

Inner leads are usually formed to match the size of the semiconductor element and the arrangement shape of the electrodes, so a wide variety of tape carriers are manufactured. In order to reduce the number of types of tape carriers as much as possible, it is desired to be able to connect several types of semiconductor elements with one type of tape carrier.

(Prior Art) As shown in the plan view of the main part of FIG. 7, a conventional tape carrier 10 is a tape-shaped film 10 made of polyimide resin or the like.
Inner lead 10 on which a conductor lead is patterned on a and one end is connected to an electrode (as shown in the figure) of a semiconductor element.
b, and the other end is an outer lead 10c which is connected to a wiring electrode (path shown in the figure) of an insulating substrate.

A rectangular mounting hole 1 is formed in the film 10a to expose the inner lead 10b so that it can be thermocompression bonded to the electrode of the semiconductor element.
0a-1 is opened, and the inner lead 10b protrudes into the hole from the four peripheries of the mounting hole 10a-1, and its tip is formed in a shape that exactly overlaps with the electrode of the semiconductor element.

Similarly, the outer lead 10c is also exposed through the square frame hole 10a-2 so that it can be bonded by thermocompression to the wiring electrode of the insulating substrate.
is open.

When connecting the electrodes 30a provided on the four sides of the back surface of the rectangular semiconductor element 30 shown in FIG. 8 to this tape carrier 10, for example, as shown in the plan view of FIG. It is overlapped with the electrode 30a (indicated by diagonal lines) and bonded with a eutectic alloy bonding agent such as solder (as shown). After inner lead bonding, the outer lead 10c is connected to the square frame hole 10a-
Cut it at a predetermined position along line A so that it protrudes from the periphery of 2,
The tip is mounted and connected to the wiring electrode of the insulating substrate in a separate process.

[Problems to be Solved by the Invention] However, since the tape carrier having the above-mentioned structure is manufactured in one-to-one correspondence with the semiconductor elements, there are problems such as a large number of types, which are uneconomical and poor productivity. was there.

In view of the above problems, an object of the present invention is to provide a tape carrier that can connect several types of semiconductor elements with one type and minimize the number of types.

[Means to solve the problem]

In order to achieve the above object, the tape carrier of the present invention protrudes into the hole from the four sides of a rectangular mounting hole cut in a tape-like film into which a semiconductor element is inserted, and is overlapped and connected to the electrode of the semiconductor element. In a tape carrier equipped with inner leads, the inner leads on two opposing sides are extended from both sides between the inner leads on the other two sides so that the excess length can be cut off to a predetermined length for mounting. , lengthen and compose.

(Function) By lengthening the inner leads on two opposing sides in advance so that they protrude from both sides between the inner leads on the other two sides and cutting off the excess length to a predetermined length for mounting, the electrodes of the semiconductor element to be connected are The inner leads can be cut to suit different types of semiconductor devices.

〔Example〕

The gist of the present invention will be explained in detail below based on embodiments shown in the drawings.

As shown in the main part plan view of FIG. 1, the tape carrier 1 of the first embodiment, that is, the tape carrier 11 has a rectangular mounting hole 1a, into which a semiconductor element is inserted, which is made in a tape-shaped film 1a made of polyimide resin or the like. Inner leads 1b made of conductors corresponding to the electrodes formed on the four sides of the back surface of the semiconductor element having a rectangular flexible shape as shown in the figure are protruded into the hole from the periphery of the four sides of the semiconductor element. Among the inner leads 1b on the four sides, the inner leads 1b-x on two opposing sides in the X direction (the figure shows two electrodes/X side) are connected to the inner leads 1b-y on the other two sides in the Y direction.
(The figure shows 8 electrodes/Y side) It is formed long in advance so that it protrudes from both sides and the excess length is cut off to a predetermined length for mounting. The other two inner leads 1b-y (8-electron 1/Y sides) are made to overlap exactly with the electrodes of the semiconductor element (as shown).

This tape carrier 11 has inner leads 1b-x.

2×(
It can accommodate up to 20 electrodes (2 electrodes/X side + 8 electrodes/Y side).

As shown in the plan view of FIG. 2, this tape carrier 11 has, for example, 2×(2 electrodes/X i22 + 4 electrodes/
When connecting a semiconductor element 2 (shown with diagonal lines) having 12 electrodes 2a (Y side), the semiconductor element 2 is connected to the mounting hole 1a-1.
and each inner lead 1b-x, 1b-
y is superimposed on the electrode 2a and bonded with a eutectic alloy bonding agent such as solder (as shown). Since the inner leads that do not have corresponding electrodes and are not joined become loose, they may be cut off before joining.

Now, as shown in the plan view of Fig. 3, the arrangement pitch of the electrodes is the same but the number of electrodes is different, for example, 2 × (2 electrodes/X side + 6
When reading a semiconductor element 2 having 16 electrodes (Y'y12), that is, 2-1 (indicated by diagonal lines), the inner leads 1b-x, which are stretched out in advance before bonding according to the number of electrodes, are to be read directly. After cutting off the tip by punching,
Join. Since the inner leads that are not joined become loose, they may be cut out in advance before joining.

FIG. 4 shows a plan view of the tape carrier of the second embodiment. This tape carrier 1, that is, 12, has inner leads 12b-x (the figure shows 4 electrodes/X side) on two opposing sides in the X direction among the inner leads 12b on four sides, and inner leads 12b-x on the other two sides in the Y direction. Inner lead 12b-y (8 electrodes/Y
It extends protruding from both sides between the sides (indicated by the sides).

This tape carrier 12 can accommodate up to 24 electrodes (2×(4 electrodes/X side+8 electrodes/Y side)) with the same arrangement pitch as the inner lead 12b.

The plan view of FIG. 5 shows the case where a semiconductor element 2 having 12 electrodes of 2×(4 electrodes/X side + 2 electrodes/Y side), that is, 2-2 (shown with diagonal lines) is connected. The plan view of 2
A case is shown in which a semiconductor element 2 having 20 electrodes (4 electrodes/X side + 6 electrodes/Y side), ie, 2-3 (indicated by diagonal lines) is connected.

In this way, by lengthening the inner leads on two opposing sides in advance so that they protrude from both sides between the inner leads on the other two sides, and cutting off the excess length to a predetermined length for mounting,
If the arrangement pitch of the electrodes is the same for semiconductor elements having different numbers of electrodes, the inner leads can be cut out to match the electrodes during mounting, and the invention can be applied to different types of semiconductor elements.

〔Effect of the invention〕

As described in detail above, according to the present invention, by making the inner lead long in advance, it is possible to cut the extra length and connect different types of semiconductor elements, thereby reducing the number of types of tape carriers. It has extremely useful effects in industry, such as improving economic efficiency and productivity.

[Brief explanation of the drawing]

FIG. 1 is a plan view of essential parts of a first embodiment of the present invention, FIG. 2 is a plan view showing an example of mounting a semiconductor element connected to FIG. 1, and FIG. 3 is a plan view of a semiconductor device connected to FIG. 1. 4 is a plan view of a main part of a second embodiment of the present invention; FIG. 5 is a plan view showing an example of mounting a semiconductor element connected to FIG. 4; Fig. 6 is a plan view showing an example of mounting another semiconductor element connected to Fig. 4, Fig. 7 is a plan view of main parts of a tape carrier according to the prior art, and Fig. 8 is a perspective view of the semiconductor element seen from the back side. , FIG. 9 is a plan view showing the mounting state of the semiconductor elements connected to FIG. 7. In the figure, 1 is a tape carrier, 1a is a film, 13-1 is a mounting hole, 1b, 1b-x, and 1b-y are inner leads, 2 is a semiconductor element, and 2a is an electrode. Figure 9 is a plan view showing the mounting layout of the semiconductor elements connected to Figure 7.

Claims (1)

[Scope of Claims] A rectangular mounting hole (1a-1) made in a tape-like film (1a) into which a semiconductor element (2) is inserted, protrudes into the hole from the four side peripheries, and an electrode ( 2a), in which inner leads (1b-x) on two opposing sides are connected to inner leads (1b-x) on the other two sides of the inner leads (1b).
A tape carrier characterized in that the tape carrier is lengthened in advance so as to protrude from both sides between 1b and y) and cut off the extra length to a predetermined length for mounting.