JPH0230058U - - Google Patents

Info

Publication number
JPH0230058U
JPH0230058U JP10887588U JP10887588U JPH0230058U JP H0230058 U JPH0230058 U JP H0230058U JP 10887588 U JP10887588 U JP 10887588U JP 10887588 U JP10887588 U JP 10887588U JP H0230058 U JPH0230058 U JP H0230058U
Authority
JP
Japan
Prior art keywords
probe card
semiconductor chip
probe
card board
probes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10887588U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10887588U priority Critical patent/JPH0230058U/ja
Publication of JPH0230058U publication Critical patent/JPH0230058U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の断面図、第２図は
従来のプローブカードの一例の断面図である。 １……プローブカード基板、２Ｄ，２Ｕ……緩
衛用ゴム、３Ｄ，３Ｕ……探針、４Ｄ，４Ｕ……
固定用樹脂、５……固定部、１０ＤＬ，１０ＤＲ
……下部プローブ、１０ＵＬ，１０ＵＲ……上部
プローブ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 一端がプローブカード基板に固定されている探
    針を被試験ウエーハの半導体チツプに接触して特
    性試験するプローブカードにおいて、前記プロー
    ブカード基板が、上下に前記探針を設けて上下の
    前記半導体チツプの特性試験を同時に接続するこ
    とを特徴とするプローブカード。
JP10887588U 1988-08-18 1988-08-18 Pending JPH0230058U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10887588U JPH0230058U (ja) 1988-08-18 1988-08-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10887588U JPH0230058U (ja) 1988-08-18 1988-08-18

Publications (1)

Publication Number Publication Date
JPH0230058U true JPH0230058U (ja) 1990-02-26

Family

ID=31344616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10887588U Pending JPH0230058U (ja) 1988-08-18 1988-08-18

Country Status (1)

Country Link
JP (1) JPH0230058U (ja)

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