JPH0229534U - - Google Patents
Info
- Publication number
- JPH0229534U JPH0229534U JP10802088U JP10802088U JPH0229534U JP H0229534 U JPH0229534 U JP H0229534U JP 10802088 U JP10802088 U JP 10802088U JP 10802088 U JP10802088 U JP 10802088U JP H0229534 U JPH0229534 U JP H0229534U
- Authority
- JP
- Japan
- Prior art keywords
- fins
- lid
- container
- integrated circuit
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
Description
第１図は本考案の実施例の斜視図である。
１…容器、２…外部リード、３…蓋、４，５…
フイン。
FIG. 1 is a perspective view of an embodiment of the present invention. 1... Container, 2... External lead, 3... Lid, 4, 5...
Finn.
Claims (1)
の電極を外部に引出す外部リードを有する容器と
、該容器の上面を封止する蓋とから成る集積回路
用パツケージにおいて、前記蓋の上面に前記蓋と
同一材料で一体化形成される複数枚の放熱用フイ
ンを設け、かつ前記フインの最外側のフインの厚
さを内側よりも厚くした構造にしたことを特徴と
する集積回路用パツケージ。 An integrated circuit package consisting of a container that houses a semiconductor chip inside and has an external lead for drawing out the electrodes of the semiconductor chip to the outside, and a lid that seals the top surface of the container, wherein the top surface of the lid has a container that is the same as the lid. 1. A package for an integrated circuit, comprising a plurality of heat dissipating fins integrally formed of a material, and having a structure in which the outermost fins of the fins are thicker than the inner fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10802088U JPH0229534U (en) | 1988-08-16 | 1988-08-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10802088U JPH0229534U (en) | 1988-08-16 | 1988-08-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0229534U true JPH0229534U (en) | 1990-02-26 |
Family
ID=31342962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10802088U Pending JPH0229534U (en) | 1988-08-16 | 1988-08-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229534U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05129485A (en) * | 1991-10-31 | 1993-05-25 | Sumitomo Metal Ind Ltd | Heat sink dissipating fin and manufacture thereof |
-
1988
- 1988-08-16 JP JP10802088U patent/JPH0229534U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05129485A (en) * | 1991-10-31 | 1993-05-25 | Sumitomo Metal Ind Ltd | Heat sink dissipating fin and manufacture thereof |