JPH02291680A - 回路の接続構造 - Google Patents
回路の接続構造Info
- Publication number
- JPH02291680A JPH02291680A JP10480590A JP10480590A JPH02291680A JP H02291680 A JPH02291680 A JP H02291680A JP 10480590 A JP10480590 A JP 10480590A JP 10480590 A JP10480590 A JP 10480590A JP H02291680 A JPH02291680 A JP H02291680A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- conductive agent
- crystal panel
- plating
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000006258 conductive agent Substances 0.000 claims description 23
- 239000011810 insulating material Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 23
- 238000007747 plating Methods 0.000 description 14
- 229910052709 silver Inorganic materials 0.000 description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 13
- 239000004033 plastic Substances 0.000 description 13
- 239000004332 silver Substances 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000007772 electroless plating Methods 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 230000001235 sensitizing effect Effects 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 101150003802 Sncg gene Proteins 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10480590A JPH02291680A (ja) | 1990-04-20 | 1990-04-20 | 回路の接続構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10480590A JPH02291680A (ja) | 1990-04-20 | 1990-04-20 | 回路の接続構造 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57065698A Division JPS58182685A (ja) | 1982-04-20 | 1982-04-20 | 表示体パネル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02291680A true JPH02291680A (ja) | 1990-12-03 |
| JPH0423389B2 JPH0423389B2 (enrdf_load_stackoverflow) | 1992-04-22 |
Family
ID=14390643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10480590A Granted JPH02291680A (ja) | 1990-04-20 | 1990-04-20 | 回路の接続構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02291680A (enrdf_load_stackoverflow) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5343306A (en) * | 1976-10-01 | 1978-04-19 | Furukawa Electric Co Ltd:The | Current collecting method for moving body |
| JPS56118467A (en) * | 1980-02-25 | 1981-09-17 | Nippon Kokuen Kogyo Kk | Manufacture of conductive powder paint |
| JPS57175126U (enrdf_load_stackoverflow) * | 1981-04-30 | 1982-11-05 |
-
1990
- 1990-04-20 JP JP10480590A patent/JPH02291680A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5343306A (en) * | 1976-10-01 | 1978-04-19 | Furukawa Electric Co Ltd:The | Current collecting method for moving body |
| JPS56118467A (en) * | 1980-02-25 | 1981-09-17 | Nippon Kokuen Kogyo Kk | Manufacture of conductive powder paint |
| JPS57175126U (enrdf_load_stackoverflow) * | 1981-04-30 | 1982-11-05 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0423389B2 (enrdf_load_stackoverflow) | 1992-04-22 |
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