JPH0227859U - - Google Patents

Info

Publication number
JPH0227859U
JPH0227859U JP10556888U JP10556888U JPH0227859U JP H0227859 U JPH0227859 U JP H0227859U JP 10556888 U JP10556888 U JP 10556888U JP 10556888 U JP10556888 U JP 10556888U JP H0227859 U JPH0227859 U JP H0227859U
Authority
JP
Japan
Prior art keywords
view
cutting
blade
base metal
holds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10556888U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10556888U priority Critical patent/JPH0227859U/ja
Publication of JPH0227859U publication Critical patent/JPH0227859U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)

Description

【図面の簡単な説明】
第1図はこの考案の一実施例を示す正面図、第
2図は要部正面図、第3図は要部側面図、第4図
は従来装置の正面図、第5図はその部分平面図、
第6図は第5図の側面図、第7図は第6図の部分
拡大側面図、第8図は第6図の部分側面図である
。 図中、1は切削刃、2は台金、8は溝である。
なお、各図中同一符号は同一又は相当部分を示す

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ウエハを切削加工するダイシングブレー
    ドにおいて、切削刃を保持する台金に径方向の溝
    を形成したことを特徴とするダイシングブレード
JP10556888U 1988-08-09 1988-08-09 Pending JPH0227859U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10556888U JPH0227859U (ja) 1988-08-09 1988-08-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10556888U JPH0227859U (ja) 1988-08-09 1988-08-09

Publications (1)

Publication Number Publication Date
JPH0227859U true JPH0227859U (ja) 1990-02-22

Family

ID=31338301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10556888U Pending JPH0227859U (ja) 1988-08-09 1988-08-09

Country Status (1)

Country Link
JP (1) JPH0227859U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217135A (ja) * 2001-01-19 2002-08-02 Disco Abrasive Syst Ltd 切削装置
JP2018122413A (ja) * 2017-02-02 2018-08-09 株式会社ディスコ 切削ブレード及び切削方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217135A (ja) * 2001-01-19 2002-08-02 Disco Abrasive Syst Ltd 切削装置
JP2018122413A (ja) * 2017-02-02 2018-08-09 株式会社ディスコ 切削ブレード及び切削方法

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