JPH0227833B2 - - Google Patents

Info

Publication number
JPH0227833B2
JPH0227833B2 JP60051860A JP5186085A JPH0227833B2 JP H0227833 B2 JPH0227833 B2 JP H0227833B2 JP 60051860 A JP60051860 A JP 60051860A JP 5186085 A JP5186085 A JP 5186085A JP H0227833 B2 JPH0227833 B2 JP H0227833B2
Authority
JP
Japan
Prior art keywords
component
solder
intake
air supply
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60051860A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61210692A (ja
Inventor
Kinsaku Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP5186085A priority Critical patent/JPS61210692A/ja
Publication of JPS61210692A publication Critical patent/JPS61210692A/ja
Publication of JPH0227833B2 publication Critical patent/JPH0227833B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP5186085A 1985-03-15 1985-03-15 プリント配線基板に部品を半田付けする方法 Granted JPS61210692A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5186085A JPS61210692A (ja) 1985-03-15 1985-03-15 プリント配線基板に部品を半田付けする方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5186085A JPS61210692A (ja) 1985-03-15 1985-03-15 プリント配線基板に部品を半田付けする方法

Publications (2)

Publication Number Publication Date
JPS61210692A JPS61210692A (ja) 1986-09-18
JPH0227833B2 true JPH0227833B2 (en, 2012) 1990-06-20

Family

ID=12898618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5186085A Granted JPS61210692A (ja) 1985-03-15 1985-03-15 プリント配線基板に部品を半田付けする方法

Country Status (1)

Country Link
JP (1) JPS61210692A (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03154733A (ja) * 1989-11-13 1991-07-02 Fuji Jikou Kk 磁力チャック

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6377193A (ja) * 1986-09-19 1988-04-07 東洋エレクトロニクス株式会社 プリント配線基板に部品を半田付けする方法
JP6176630B2 (ja) * 2014-06-14 2017-08-09 株式会社アンド 半田処理装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5765771U (en, 2012) * 1980-09-30 1982-04-20
JPS5742999A (en) * 1981-03-20 1982-03-10 Denki Kagaku Kogyo Kk Paint for polishing and press processing paper

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03154733A (ja) * 1989-11-13 1991-07-02 Fuji Jikou Kk 磁力チャック

Also Published As

Publication number Publication date
JPS61210692A (ja) 1986-09-18

Similar Documents

Publication Publication Date Title
US4934582A (en) Method and apparatus for removing solder mounted electronic components
US4813589A (en) Surface mounted device rework heat guide
US5113581A (en) Outer lead bonding head and method of bonding outer lead
JP2007227663A (ja) 半田付け実装構造の製造方法および製造装置
JPH0227833B2 (en, 2012)
US4735354A (en) Method of soldering component on printed circuit board
JPH06244548A (ja) 回路部品の着脱装置および回路部品の着脱方法
JP2682031B2 (ja) 半田付装置
US6827253B2 (en) Method and means for rapid heat-sink soldering
JP2006041375A (ja) 電子部品のリペア装置
JP2510688B2 (ja) 過剰はんだ除去装置
JP3344289B2 (ja) バンプ付ワークの実装方法
KR102039769B1 (ko) 본딩 툴 냉각 장치 및 본딩 툴 냉각 방법
JPH1154559A (ja) バンプ付きワークのボンディング装置およびボンディング方法
JPH05304358A (ja) ボンディングヘッド
JP2001358454A (ja) はんだ付け方法およびはんだ付け装置
JP2809207B2 (ja) 半導体装置のリペア方法とリペア装置
JP2812094B2 (ja) 半田ｔａｂの構造ならびに半田ｔａｂのｉｌｂ装置およびｉｌｂ方法
JPH10117065A (ja) バンプ付きワークの半田付け方法
JPH01286387A (ja) 電子部品のリプレース方法
JPS5877769A (ja) はんだ付け方法及び装置
JPH0951006A (ja) 半導体製造治具の取付け方法
JP2001274542A (ja) 半田付け装置
JP3634396B2 (ja) プリント基板等のはんだ付方法及び装置
JPS63205993A (ja) 部品リペア装置