JPH02277299A - Air cooling structure of electronic apparatus - Google Patents

Abstract

PURPOSE:To suppress the passage of wind which does not contribute to cooling so as to reduce the total quantity of air by providing a flow control plate, which prevents the air flow flowing between a heating element and an adjacent other package, between packages. CONSTITUTION:When plural sheets of packages 5 loaded with low heat- generating elements 4 are mounted at regular intervals in series, flow control plates 9, which reduce the ventilation areas of ventilation paths constituted between mutually adjacent packages 3 and 5, and 5 and 5 and prevent the air from flowing between the loaded electronic part 4 and adjacent packages 3 and 5, are installed between packages 3 and 5, and 5 and 5, respectively. Hereby, the flow control plates 9 installed in the ventilation path can adjust the ventilation area equivalent to the calorific value of the heat-generating element 4, control the passage of wind which does not contribute to the cooling, and reduce the total quantity of air.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to the control of cooling air necessary for each package mounting a heating element in an air cooling structure for electronic equipment.

[Conventional technology]

Electronic components mounted in each package in a structure in which multiple packages carrying electrical components are mounted, and the heat generated by the air components is cooled by flowing air into the ventilation channels between adjacent packages. The types and quantities are not the same, and there are considerable differences in calorific value. Therefore, even if a uniform air volume is supplied to these packages, there is a problem in that an unnecessary amount of cooling air is unnecessarily supplied to packages with a low calorific value. In order to solve this problem, conventional devices install a perforated plate between a group of packages with different calorific values and an air cooling device, as described in Japanese Patent Laid-Open No. 58-153398, and increase the aperture ratio of the perforated plate. By changing the amount of air flowing into the package group, the amount of air flowing into the package group can be adjusted.

[Problem to be solved by the invention]

In the above-mentioned prior art, the amount of air flowing into a package group on which heating elements are mounted is adjusted depending on the population. However, when the wind enters between the package groups, the ventilation area becomes wider according to the size of the ventilation path, and the wind spreads and flows over the entire ventilation area. Therefore, if there is a wide gap between the heat generating element or the heat dissipation fin attached to it and the adjacent package, there is a problem in that the air flowing near the adjacent package will pass through without contributing to cooling. Ta.

The present invention aims to make a part of the wind that does not contribute to cooling effectively contribute to cooling, thereby further reducing the overall air volume.

[Means to solve the problem]

In order to achieve the above objectives, we reduced the ventilation area of the ventilation passages between adjacent packages, and installed a flow control plate in the package that prevents air from flowing between the mounted electronic components and the adjacent packages. It was placed in between.

[Effect]

The flow restricting plate installed in the ventilation passage narrows the ventilation area between the flow restricting plate and the nozzle facing it. As a result, the ventilation area can be adjusted to match the amount of heat generated by the heating element, and the generation and passage of wind that does not contribute to cooling can be prevented, thereby reducing the overall appearance.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

A package 3 on which a high heat generating element 2 with a radiation fin 10 as shown in FIG. They are mounted and stored on the shelf 6.

The air flow path that cools the heat generated by the heat generating elements of each package is
It is formed by providing air leakage prevention plates 7 at both ends of each package, which are configured to prevent cooling air from leaking from both sides of the package when the cooling air passes through the ventilation path and the adjacent package surfaces. This creates a flow path that prevents air from leaking from sources other than the air inlet and outlet. Further, in order to cool down the heat generated by the heating element, a blower 8 is provided that blows air into the flow path. In the flow path of the low heat generating element, which generates a small amount of heat, the ventilation area becomes large due to the absence of the radiation fins 10, so a flow control plate 9 having a shape as shown in FIG. 6 is provided in the larger area. As a result, when air is sent from the blower 8, the package 5 on which the low heat generation element 4 is mounted and the package 3 on which the high heat generation element 2 on which the radiation fins 10 are attached are mounted.
Even if they are mounted at equal intervals, the air flow path of the package mounted on the low heat generating element is blocked by the flow control plate 9, and only the amount of air necessary for cooling can enter the air path. Inside, the flow control plate 9 allows the air to pass only around the low heat generation element 4, and the amount of air can be sent in accordance with the amount of heat generated by each package.

The shape of the flow control plate 9 includes, for example, a rectangular parallelepiped as shown in FIG. 6, a hollow drawer-like shape as shown in FIG.
As shown in FIG. 8, there is a concave solid body from FIG. 7 with a pair of opposing side plates removed, and as shown in FIG. 9, there is an L-shaped solid body from FIG. 8 with one side of the opposing side plates removed.

In the present invention, by providing the flow control plate 9, it is possible to prevent the passage and generation of ineffective wind and reduce the overall air volume. This reduces the burden on the blower 8, reduces the size of the blower 8, and! ! It also has the effect of reducing illumination noise. Furthermore, the landscape can be reduced simply by installing the flow control plate 9 without changing the mounting position of the package or the shape of the package itself, so it is possible to downsize the entire device.

As another embodiment, a suction type cooling device can be implemented in the same way as a blower type cooling device. In addition to being attached to the wind leak prevention plate 7 as shown in FIG. 2, the flow control plate 9 can also be inserted and guided by a package guide rail.

〔Effect of the invention〕

According to the present invention, the generation and passage of air that does not contribute to cooling can be prevented, so the overall air volume can be reduced.

4. Detailed Description of the Invention Fig. 1 is a front view showing the configuration of an embodiment of the present invention, Fig. 2 is a cross-sectional view of Fig. 1, and Fig. 3 shows a high heat generating element with radiation fins attached to a tower. FIG. 4 is a perspective view of a package mounted with a low heat generation element, and FIG. 5 is a front view showing the configuration of another embodiment. FIG. 6, FIG. 7, FIG. 8, and FIG. 9 are perspective views showing examples of the shape of the flow control plate.

1...motherboard, 2...high heat generating element, 3...
Package with high heat generating element mounted, 4...Low heat generating element, 5
...Package with low heat generation element mounted on it, 6...Shelf,
7... Wind leak prevention plate, 8... Air blower, 9... Current control plate,
10...Radiating fin.

Claims (2)

[Claims] 1. In an electronic device in which a plurality of packages each having a heat generating element mounted on a printed circuit board are mounted substantially parallel to each other and are cooled by blowing air to the packages, there is a gap between the packages and another package adjacent to the heat generating element. A cooling structure for electronic equipment, characterized by being provided with a flow control plate that obstructs airflow flowing through the air. 2. 2. The electronic device according to claim 1, further comprising: a flow control plate that prevents the air flow from flowing between the packages; and a flow control plate that prevents the air flow from entering a gap between the packages adjacent to the heating element. cooling structure.