JPH0227562Y2 - - Google Patents

Info

Publication number

JPH0227562Y2

JPH0227562Y2 JP13262084U JP13262084U JPH0227562Y2 JP H0227562 Y2 JPH0227562 Y2 JP H0227562Y2 JP 13262084 U JP13262084 U JP 13262084U JP 13262084 U JP13262084 U JP 13262084U JP H0227562 Y2 JPH0227562 Y2 JP H0227562Y2

Authority

JP

Japan

Prior art keywords

sealing member

frame

attached

leadless

face

Prior art date

1984-08-31

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000003990 capacitor Substances 0.000 claims description 35
• 238000007789 sealing Methods 0.000 claims description 26
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 9
• -1 polybutylene terephthalate Polymers 0.000 claims description 8
• 229920003002 synthetic resin Polymers 0.000 claims description 7
• 239000000057 synthetic resin Substances 0.000 claims description 7
• 239000004695 Polyether sulfone Substances 0.000 claims description 4
• 125000003118 aryl group Chemical group 0.000 claims description 4
• 229920000728 polyester Polymers 0.000 claims description 4
• 229920006393 polyether sulfone Polymers 0.000 claims description 4
• 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
• 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
• BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 4
• 239000004696 Poly ether ether ketone Substances 0.000 claims description 3
• 229920001707 polybutylene terephthalate Polymers 0.000 claims description 3
• 229920002530 polyetherether ketone Polymers 0.000 claims description 3
• 239000011810 insulating material Substances 0.000 claims 1
• 230000000694 effects Effects 0.000 description 3
• 229920005989 resin Polymers 0.000 description 3
• 239000011347 resin Substances 0.000 description 3
• 239000000758 substrate Substances 0.000 description 3
• RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
• 239000008151 electrolyte solution Substances 0.000 description 2
• 239000011888 foil Substances 0.000 description 2
• 238000004519 manufacturing process Methods 0.000 description 2
• 238000000465 moulding Methods 0.000 description 2
• 229910000679 solder Inorganic materials 0.000 description 2
• 239000004721 Polyphenylene oxide Substances 0.000 description 1
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
• 229910052782 aluminium Inorganic materials 0.000 description 1
• 239000003792 electrolyte Substances 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 238000003780 insertion Methods 0.000 description 1
• 230000037431 insertion Effects 0.000 description 1
• 150000002576 ketones Chemical class 0.000 description 1
• 229920001748 polybutylene Polymers 0.000 description 1
• 229920000570 polyether Polymers 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1