JPH02264466A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH02264466A JPH02264466A JP8591589A JP8591589A JPH02264466A JP H02264466 A JPH02264466 A JP H02264466A JP 8591589 A JP8591589 A JP 8591589A JP 8591589 A JP8591589 A JP 8591589A JP H02264466 A JPH02264466 A JP H02264466A
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- gate electrode
- semiconductor device
- gate electrodes
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 10
- 238000002955 isolation Methods 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 14
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract description 7
- 230000010354 integration Effects 0.000 abstract description 5
Landscapes
- Element Separation (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 [産業上の利用分野コ 本発明は、半導体装置のパターンレイアウトに関する。[Detailed description of the invention] [Industrial application fields] The present invention relates to pattern layout of semiconductor devices.
[発明が解決しようとする課題]
従来の、LOooSによる素子間分離では、L000S
形成工程で、素子間分離位置が固定されてしまう。従っ
て、ゲートアレーのように、ゲート電極形成工程以後の
配線工程で回路を選択する場合、素子間分離の位置変更
はできなかった。そのため、高集積化が困難であった。[Problem to be solved by the invention] In the conventional isolation between elements using LOooS, L000S
During the formation process, the isolation position between elements is fixed. Therefore, when selecting a circuit in a wiring process after the gate electrode forming process, as in the case of a gate array, it is not possible to change the position of isolation between elements. Therefore, it has been difficult to achieve high integration.
そこで、本発明は、従来LOOO8で素子間分離をして
いたため、ゲート電極形成工程以後で素子間分離位置変
更ができず、高集積化が困難であったのを、トランジス
タ自体を素子間分離素子として使用することにより解決
した半導体装置を提供することを目的とする。Therefore, the present invention solves the problem that conventionally the element isolation was performed using LOOO8, which made it impossible to change the element isolation position after the gate electrode formation process, making it difficult to achieve high integration. The purpose of the present invention is to provide a semiconductor device that solves the problem by being used as a semiconductor device.
[課題を解決するための手段]
本発明の半導体装置は、LOOOSに凹まれて分離され
ている領域に複数のトランジスタを有し、この領域内の
トランジスタ自体を素子間分離素子として使用すること
により1.ゲート電極形成工程以後に、素子間分離位置
が選択できること・を特徴とする。[Means for Solving the Problems] The semiconductor device of the present invention has a plurality of transistors in a region recessed and separated by LOOOS, and the transistors themselves in this region are used as inter-element isolation elements. 1. A feature is that the isolation position between elements can be selected after the gate electrode forming step.
[作用コ
トランジスタがオフしているということは、トランジス
タのソース、ドレイン間が絶縁状態になっているという
ことである。従って、分離したい素子間のトランジスタ
をオフさせれば素子間分離が可能である。また、このオ
フするトランジスタは、ゲート電極形成工程以後に選択
することができるため、′ゲート電極形成工程以後に、
素子間分離素子位置を選択することができる。[The fact that the active co-transistor is off means that the source and drain of the transistor are insulated. Therefore, isolation between elements is possible by turning off the transistors between the elements to be isolated. In addition, since the transistor to be turned off can be selected after the gate electrode formation step,
The location of the isolation element can be selected.
[実施例コ
本発明の半導体装置は、基本的には第1図で示される構
造をしている。[Embodiment 2] A semiconductor device of the present invention basically has the structure shown in FIG.
101はLOOOSであり、102はゲート電極、10
3はソース、ドレイン領域である。101 is LOOOS, 102 is a gate electrode, 10
3 is a source and drain region.
以下、詳細に本発明を説明してい(。The present invention will be explained in detail below.
まず、LoooSlolにより、ブロックを囲み、ブロ
ック間の分離を行う。ここで、ブロックとは、複数のト
ランジスタから成り、LOOO31011Cより囲まれ
ている領域をさす。First, LoooSlol is used to surround blocks and separate the blocks. Here, the block refers to a region made up of a plurality of transistors and surrounded by LOOO31011C.
次に、ブロック内に、ゲート電極102及び、ソース、
ドレイン領域103を形成する。Next, in the block, a gate electrode 102, a source,
A drain region 103 is formed.
ブロック内の素子間分離は、ゲート電極形成工程以後の
配線工程で、素子間分離したいトランジスタのゲート電
極に、トランジスタがオフとなる電圧を印加して行う。Isolation between elements within a block is performed in a wiring process after the gate electrode formation process by applying a voltage that turns off the transistor to the gate electrode of the transistor whose elements are to be isolated.
以上のように素子間分離をした結果、ブロック内の素子
間分離位置は、ゲート電極形成工程以後に選択すること
ができ、従来の第2図に比べ、高集積化を図ることがで
きる。As a result of the isolation between elements as described above, the isolation position between elements within a block can be selected after the gate electrode forming step, and higher integration can be achieved than in the conventional structure shown in FIG.
[発明の効果]
以上述べた本発明によれば、素子間分離位置がゲート電
極形成工程以後の配線工程で選択できる。従って、ゲー
トアレーのように、ゲート電極形成工程以後の配線工程
で回路を選択する場合、高集積化を計ることができる。[Effects of the Invention] According to the present invention described above, the isolation position between elements can be selected in the wiring process after the gate electrode forming process. Therefore, when a circuit is selected in the wiring process after the gate electrode forming process, as in the case of a gate array, high integration can be achieved.
第1図は、本発明の半導体装置を示す平面図。
第2図は、従来の半導体装置を示す平面図。
1 0 1 −−−−−−−−− L OOOB10
2・・・・・・・・・ゲート電極
10)・・・・・・・・・ソー°ス、ドレイン領域20
1 ・・・・・・・・・ LOOC)J202・・・・
・・・・・ゲート電極
203・・・・・・・・・ソース、ドレイン領域梯i−
邑
以上
出願人 セイコーエプソン株式会社
代理人 弁理士 鈴木喜三部(他1名)葉z IgFIG. 1 is a plan view showing a semiconductor device of the present invention. FIG. 2 is a plan view showing a conventional semiconductor device. 1 0 1 --------------------- L OOOB10
2...... Gate electrode 10)... Source, drain region 20
1 ・・・・・・・・・LOOC)J202・・・・
. . . Gate electrode 203 . . . Source, drain region ladder i-
Applicant: Seiko Epson Co., Ltd. Agent Patent attorney: Kizobe Suzuki (and 1 other person) Yoz Ig
Claims (1)
Sと略す)に囲まれて分離されている領域に複数のトラ
ンジスタを有し、この領域内のトランジスタ自体を素子
間分離素子として使用することにより、ゲート電極形成
工程以後に、素子間分離位置が選択できることを特徴と
する半導体装置。(1) LOCOS (Local Oxidation of Silicon, hereinafter LOCO)
By having a plurality of transistors in a region surrounded and separated by a region (abbreviated as S) and using the transistor itself in this region as an element isolation element, the element isolation position can be changed after the gate electrode forming process. A semiconductor device characterized by being selectable.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8591589A JPH02264466A (en) | 1989-04-05 | 1989-04-05 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8591589A JPH02264466A (en) | 1989-04-05 | 1989-04-05 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02264466A true JPH02264466A (en) | 1990-10-29 |
Family
ID=13872100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8591589A Pending JPH02264466A (en) | 1989-04-05 | 1989-04-05 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02264466A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5285069A (en) * | 1990-11-21 | 1994-02-08 | Ricoh Company, Ltd. | Array of field effect transistors of different threshold voltages in same semiconductor integrated circuit |
JP2011166116A (en) * | 2009-12-08 | 2011-08-25 | Soi Tec Silicon On Insulator Technologies | Circuit of uniform transistors on seoi with buried back control gate beneath insulating film |
-
1989
- 1989-04-05 JP JP8591589A patent/JPH02264466A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5285069A (en) * | 1990-11-21 | 1994-02-08 | Ricoh Company, Ltd. | Array of field effect transistors of different threshold voltages in same semiconductor integrated circuit |
JP2011166116A (en) * | 2009-12-08 | 2011-08-25 | Soi Tec Silicon On Insulator Technologies | Circuit of uniform transistors on seoi with buried back control gate beneath insulating film |
US8384425B2 (en) | 2009-12-08 | 2013-02-26 | Soitec | Arrays of transistors with back control gates buried beneath the insulating film of a semiconductor-on-insulator substrate |
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