JPH0226390B2 - - Google Patents

Info

Publication number
JPH0226390B2
JPH0226390B2 JP60097160A JP9716085A JPH0226390B2 JP H0226390 B2 JPH0226390 B2 JP H0226390B2 JP 60097160 A JP60097160 A JP 60097160A JP 9716085 A JP9716085 A JP 9716085A JP H0226390 B2 JPH0226390 B2 JP H0226390B2
Authority
JP
Japan
Prior art keywords
integrated circuits
substrate
conductive pattern
holes
index
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60097160A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60242631A (ja
Inventor
Yoshio Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP9716085A priority Critical patent/JPS60242631A/ja
Publication of JPS60242631A publication Critical patent/JPS60242631A/ja
Publication of JPH0226390B2 publication Critical patent/JPH0226390B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP9716085A 1985-05-07 1985-05-07 集積回路の多量製造方法 Granted JPS60242631A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9716085A JPS60242631A (ja) 1985-05-07 1985-05-07 集積回路の多量製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9716085A JPS60242631A (ja) 1985-05-07 1985-05-07 集積回路の多量製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP6515679A Division JPS55157245A (en) 1979-05-25 1979-05-25 Mass producing method of integrated circuit

Publications (2)

Publication Number Publication Date
JPS60242631A JPS60242631A (ja) 1985-12-02
JPH0226390B2 true JPH0226390B2 (enrdf_load_stackoverflow) 1990-06-08

Family

ID=14184815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9716085A Granted JPS60242631A (ja) 1985-05-07 1985-05-07 集積回路の多量製造方法

Country Status (1)

Country Link
JP (1) JPS60242631A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0170316B1 (ko) * 1995-07-13 1999-02-01 김광호 반도체 장치의 패드 설계 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4528100Y1 (enrdf_load_stackoverflow) * 1967-09-27 1970-10-29
JPS4836983A (enrdf_load_stackoverflow) * 1971-09-10 1973-05-31
JPS5758777Y2 (enrdf_load_stackoverflow) * 1977-05-27 1982-12-15
JPS55157245A (en) * 1979-05-25 1980-12-06 Sanyo Electric Co Ltd Mass producing method of integrated circuit

Also Published As

Publication number Publication date
JPS60242631A (ja) 1985-12-02

Similar Documents

Publication Publication Date Title
KR910002035B1 (ko) 반도체 장치와 그 제조 방법
US5897334A (en) Method for reproducing printed circuit boards for semiconductor packages including poor quality printed circuit board units and method for fabricating semiconductor packages using the reproduced printed circuit boards
KR20050009292A (ko) 반도체장치 및 그 제조방법
US5032542A (en) Method of mass-producing integrated circuit devices using strip lead frame
JP3093960B2 (ja) 半導体回路素子搭載基板フレームの製造方法
JP4159348B2 (ja) 回路装置の製造方法
GB2026234A (en) Circuit element package having lead patterns
JPH04303960A (ja) ハイブリッド回路用リードなしチップ抵抗コンデンサ担体及びその製造方法
JPS6329414B2 (enrdf_load_stackoverflow)
JPH0226390B2 (enrdf_load_stackoverflow)
JPS58159361A (ja) 多層混成集積回路装置
JPS60242632A (ja) 集積回路の多量製造方法
JPH03132061A (ja) 集積回路の多量製造方法
JPS60242630A (ja) 集積回路の多量製造方法
JPH02163956A (ja) 集積回路の多量製造方法
JP2545964B2 (ja) 磁気抵抗効果素子
JPH02138763A (ja) 集積回路の多量製造方法
JPS58134450A (ja) 半導体装置およびその製造方法
JPH02138764A (ja) 集積回路の多量製造方法
JPH03132062A (ja) 集積回路の多量製造方法
JPS6220694B2 (enrdf_load_stackoverflow)
JPS62188345A (ja) 混成集積回路の製造方法
JPH03104129A (ja) 集積回路の多量製造方法
JPS6155247B2 (enrdf_load_stackoverflow)
JPH02215185A (ja) 混成集積回路の製造方法