JPH02263497A - Manufacture of electronic circuit device - Google Patents
Manufacture of electronic circuit deviceInfo
- Publication number
- JPH02263497A JPH02263497A JP8542689A JP8542689A JPH02263497A JP H02263497 A JPH02263497 A JP H02263497A JP 8542689 A JP8542689 A JP 8542689A JP 8542689 A JP8542689 A JP 8542689A JP H02263497 A JPH02263497 A JP H02263497A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- soldering
- board
- flexible board
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000005476 soldering Methods 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 abstract description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 18
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 3
- 230000003014 reinforcing effect Effects 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 238000012858 packaging process Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、表面実装型電子部品をはんだ付けによりフレ
キシブル基板上に実装する電子回路装置の製造方法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method of manufacturing an electronic circuit device in which surface-mounted electronic components are mounted on a flexible substrate by soldering.
従来の技術
近年、部品の消費電力から（る熱を、効率良く放熱でき
る金属板をベースとしたプリント基板が多方面で使用さ
れてきている。あわせて、自由に折り曲げられコンパク
トな機器を提供出来るフレキシブル基板も多く使用され
ている。Conventional technology In recent years, printed circuit boards based on metal plates, which can efficiently dissipate the heat generated by the power consumption of components, have been used in many fields.In addition, they can be bent freely to provide compact devices. Flexible substrates are also widely used.
この両方の特性、すなわち放熱効率が良く機器のコンパ
クト化が可能な構造としてフレキシブル基板を金属板に
接着させたプリント基板が考えられて来ており、またフ
ェノールやガラスエポキシ樹脂の基材板を金属板と合わ
せてフレキシブル基板°ｌ″−接着したものがある。Printed circuit boards in which a flexible circuit board is bonded to a metal plate have been considered as a structure that has both of these characteristics, that is, has good heat dissipation efficiency and can make equipment compact. There is also a flexible substrate 〈l''-bonded together with the board.
金属板付きフレキシブル基板を用いた電子回路装置の製
造方法の従来例を、第４図、第５図を用いて説明する。A conventional method for manufacturing an electronic circuit device using a flexible substrate with a metal plate will be described with reference to FIGS. 4 and 5.
第５図は金属板及び、フェノール板にフレキシブル基板
を接着したプリント基板１の斜視図であり、プリント基
板１はアルミナ板４、フェノール板３、及びフレキシブ
ル基板５から構成されている。FIG. 5 is a perspective view of a printed circuit board 1 in which a flexible board is bonded to a metal plate and a phenol board.
口の字形のフェノール板からなる枠３の窓部の一部をふ
さぐ形で同じフェノール板からなる基材板３ａが設けら
れている。また窓部のうち基材板３ａが設けられていな
い部分は、平板状のアルミ板４がはめ込まれている。フ
レキシブル基板５は、枠３の窓部全体をふさぐように、
基材板３ａ。A base plate 3a made of the same phenol plate is provided to cover a part of the window of the frame 3 made of a square-shaped phenol plate. Further, a flat aluminum plate 4 is fitted in a portion of the window portion where the base plate 3a is not provided. The flexible substrate 5 is arranged so as to cover the entire window of the frame 3.
Base plate 3a.
アルミ板４の上に接着されている。It is glued onto the aluminum plate 4.
このフレキシブル基板５上にはんだが印刷された後、電
子部品７が実装され、電子部品７の実装されたプリント
基板１はリフローはんだ付けが行なわれ、その後枠３は
取外される。After solder is printed on the flexible substrate 5, the electronic component 7 is mounted, the printed circuit board 1 on which the electronic component 7 is mounted is subjected to reflow soldering, and then the frame 3 is removed.
第４図にリフローはんだ付は後、不必要な枠３を取外し
たプリント基板２の斜視図を示す。FIG. 4 is a perspective view of the printed circuit board 2 with the unnecessary frame 3 removed after reflow soldering.
発明が解決しようとする課題
全体加熱リフロー槽でのはんだ付けでは、基板材質であ
るアルミ板４のような熱容量の大きなものと、フェノー
ル又は、ガラスエポキシ樹脂等の基材板３ａのような熱
容量の小さなものが同時に加熱される際、材質が異なる
為、プリント基板１の表面温度が不均一となる。特に第
４図、第５図に示したようなプリント基板構成では、ア
ルミ板４上に位置したフレキシブル基板５ａに実装され
ている部品にリフローはんだ付けに必要な熱量を与えよ
うとすると、フェノール板の温度が必要以上に上がりす
ぎ基材板３ａが焼けたり、基材板３ａの反りが太き（な
ってフレキシブル基板５との接着がはがれたりする。さ
らに基材板３ａ上のフレキシブル基板５に設置された電
子部品７が熱に対して弱＜、ｉ悪の場合破壊されるとい
う問題があった。また、急激な温度勾配により、部品の
チップ立ちが発生している等はんだ付は品質に問題があ
った。Problems to be Solved by the Invention In soldering in an overall heating reflow tank, the substrate material has a large heat capacity such as the aluminum plate 4, and the base material plate 3a, such as phenol or glass epoxy resin, has a low heat capacity. When small objects are heated at the same time, the surface temperature of the printed circuit board 1 becomes uneven because the materials are different. In particular, in the printed circuit board configuration shown in FIGS. 4 and 5, when trying to apply the heat required for reflow soldering to the components mounted on the flexible board 5a located on the aluminum plate 4, the phenol plate If the temperature of the base plate 3a rises too much than necessary, the base plate 3a may be burnt, or the base plate 3a may become warped (and the adhesive with the flexible substrate 5 may peel off). There was a problem that if the installed electronic component 7 was weak against heat, it would be destroyed.Also, due to the sudden temperature gradient, the quality of soldering could be affected, such as chips on the component. There was a problem.
また、フェノール板からなる枠３はリフローはんだ付は
後に取外され、廃棄される消耗品として使用されており
、プリント基板のコストを引き上げる要因になっていた
。In addition, the frame 3 made of a phenol board is used as a consumable item that is removed and discarded after reflow soldering, which increases the cost of the printed circuit board.
本発明は上記問題点に鑑みてなされたもので、高信頼性
の電子回路装置を目的とする。The present invention has been made in view of the above problems, and an object of the present invention is to provide a highly reliable electronic circuit device.
課題を解決するための手段
本発明は上記の目的を達成するために、一方の主面の一
部に金属板を接着したフレキシブル基板の前記金属板が
接着されていない部分に、平面状で前記金属板と同然容
量を有する金属からなる治具をあてがい、前記フレキシ
ブル基板に電子部品をはんだ付けにて実装するものであ
る。Means for Solving the Problems In order to achieve the above object, the present invention has a flexible substrate having a metal plate adhered to a part of one main surface, and a part of the flexible substrate where the metal plate is not adhered, in a planar shape. A jig made of metal having the same capacity as a metal plate is applied, and electronic components are mounted on the flexible board by soldering.
作用
本発明によれば、金属製の基材板を用いているためはん
だ付けにより基材板が反ったり焼けたりすることがなく
、フレキシブル基板全面にわたって同熱容量の金属板を
当てがってはんだ付けすることができるため、電子部品
の実装が確実に行なえる。よって極めて高信頼性の電子
回路装置を提供することができるものである。According to the present invention, since a metal base plate is used, the base plate does not warp or burn during soldering, and soldering can be performed by applying a metal plate of the same heat capacity over the entire surface of the flexible board. Therefore, electronic components can be mounted reliably. Therefore, it is possible to provide an extremely reliable electronic circuit device.
実施例
本発明の一実施例を第１図、第２図ａ、ｂ、ｃ及び第３
図を用いて説明する。Embodiment An embodiment of the present invention is shown in Fig. 1, Fig. 2 a, b, c, and Fig. 3.
This will be explained using figures.
第１図はアルミ板付きフレキシブル基板８（以下プリン
ト基板８とする）を示す斜視図、第２図ａは、上記プリ
ント基板８を固定する為の実装はんだ付は用基板固定治
具９（以下治具９とする）を示す斜視図、同図すは、フ
レキシブル基板８を治具９に取付けた状態を示す斜視図
、同図Ｃは同図すに於けるＡ−Ａ ’の断面図である。Figure 1 is a perspective view showing a flexible board 8 with an aluminum plate (hereinafter referred to as printed circuit board 8), and Figure 2a is a mounting soldering board fixing jig 9 (hereinafter referred to as This figure is a perspective view showing the state in which the flexible substrate 8 is attached to the jig 9. Figure C is a cross-sectional view taken along line A-A' in the same figure. be.
第３図はフェノール板３ａを接着し終わった電子回路装
置の斜視図である。FIG. 3 is a perspective view of the electronic circuit device to which the phenol plate 3a has been bonded.
第１図に示すプリント基板８は四角形のフレキシブル基
板５上に一定間隔離して２枚のアルミ板４ａ、４ｂが配
置されている。フレキシブル基板５のうちアルミ板４ａ
、４ｂが設けられていない領域５ａには、４つの基準穴
１２が設けられている。第２図ａに示す治具９は、アル
ミ板４と同じ材質で同じ厚みの２枚の当て板６ａ、６ｂ
と、２本のガイド板１３ａとコの字形のガイド板１３ｂ
及び口の字形のベース板１４から構成されている。２枚
の当て板６ａ、６ｂは、前記フレキシブル基板５ａにぴ
ったりと合う大きさのものを一定間隔おいてへだてて配
置し、その間隔と同じ長さのガイド板１３ａが当て板６
ａ、６ｂの間に配設されて、２枚の当て板６ａ、６ｂと
２本のガイド板１３ａとが丁度口の字形を形成している
。またコの字形のガイド板１３ｂが一方の当て板６ｂに
接続されており、当て板６ａと６ｂとの間の凹み１０ａ
にアルミ板４ａがはまり込み、当て板６ｂとガイド板１
３ｂとが形成する凹み１０ｂにアルミ板４ｂがはまり込
むように構成されている。そしてこれらのアルミ板６ａ
、６ｂとガイド板１３ａ。In the printed circuit board 8 shown in FIG. 1, two aluminum plates 4a and 4b are arranged on a rectangular flexible board 5 with a certain distance between them. Aluminum plate 4a of flexible substrate 5
, 4b are not provided with four reference holes 12. The jig 9 shown in FIG.
, two guide plates 13a and a U-shaped guide plate 13b.
and an opening-shaped base plate 14. The two backing plates 6a and 6b are sized to fit the flexible substrate 5a and are spaced apart at a certain interval, and a guide plate 13a having the same length as the spacing is attached to the backing plate 6.
a, 6b, and the two backing plates 6a, 6b and the two guide plates 13a form a mouth shape. Further, a U-shaped guide plate 13b is connected to one of the backing plates 6b, and a recess 10a is formed between the backing plates 6a and 6b.
The aluminum plate 4a is fitted into the plate 6b and the guide plate 1.
The aluminum plate 4b is configured to fit into the recess 10b formed by the aluminum plate 3b. And these aluminum plates 6a
, 6b and the guide plate 13a.
１３ｂから構成された部材は周囲に口の字形のベース板
１４が配設されている。また当て板６ａ。A mouth-shaped base plate 14 is disposed around the member composed of the member 13b. Also, a backing plate 6a.
６ｂには、前記基準穴１２にはまり込むガイドビン１１
が４つ段けられている。6b includes a guide bin 11 that fits into the reference hole 12.
There are four tiers.
ここから、このプリント基板８と治具９を用いて電子回
路装置を製造する方法を説明する。From here, a method for manufacturing an electronic circuit device using this printed circuit board 8 and jig 9 will be explained.
アルミ板４ａ、４ｂを凹み１０ａ、１０ｂにはめ込み、
フレキイプル基板５ａに設けられた基準穴１２を治具９
に設けられたガイドビン１１にはめ込んで取付けられ、
第２図すに示す様に仮固定される。この際、フレキシブ
ル基板５ａの部品実装面の裏面には治具９のアルミ板６
ａ、６ｂが当てがわれ、フレキシブル基板５全体にわた
って同熱容量のアルミ板４ａ、４ｂ、６ａ、６ｂが配置
されることとなる。Insert the aluminum plates 4a and 4b into the recesses 10a and 10b,
The reference hole 12 provided on the flexible board 5a is inserted into the jig 9.
It is fitted and attached to the guide bin 11 provided in the
It is temporarily fixed as shown in Figure 2. At this time, the aluminum plate 6 of the jig 9 is placed on the back side of the component mounting surface of the flexible board 5a.
a, 6b are applied, and aluminum plates 4a, 4b, 6a, 6b having the same heat capacity are arranged over the entire flexible substrate 5.
次工程で、アルミ板４上のフレキシブル基板５ａ及びフ
レキシブル基板５ｂ上にはんだが印刷され、部品実装工
程にて電子部品７が実装される。In the next step, solder is printed on the flexible substrates 5a and 5b on the aluminum plate 4, and the electronic components 7 are mounted in a component mounting step.
この後、リフローはんだ付けを行っ後、治具９を取り外
し、次工程でフレキシブル基板５ａの補強板としてフェ
ノール板３ａを接着し、電子回路装置とする。このよう
な治具９を用いて部品実装することでプリント基板８の
フレキシブル基板５の各部分は同熱容量のアルミ板４
ａ 、 ４ ｂ 、６ ａ ｒ６ｂが当てがわれている
ため、フレキシブル基板５の熱容量は均一となるので、
リフローはんだ付けの際、プリント基板８に実装されて
いる全ての電子部品７の信頼性を損う事なく、はんだ付
けが良好に行なわれる。プリント基板８が取外された治
具９は、再使用することができる。尚、治具９はプリン
ト基板８が折れ曲る事を防止する事ができれば、ガイド
板１３ａ、１３ｂ及びベース板１４の形状はどんなもの
でも良く、また治具９の数箇所に、部品実装機用の基準
穴を設けることも出来る。フェノール板３ａの接着の終
ったプリント基板８の斜視図を第３図に示す。Thereafter, after reflow soldering is performed, the jig 9 is removed, and in the next step, a phenol plate 3a is bonded as a reinforcing plate to the flexible substrate 5a to form an electronic circuit device. By mounting components using such a jig 9, each part of the flexible board 5 of the printed circuit board 8 is made of an aluminum plate 4 having the same heat capacity.
Since a, 4b, 6a r6b are applied, the heat capacity of the flexible substrate 5 is uniform, so
During reflow soldering, soldering can be performed satisfactorily without impairing the reliability of all the electronic components 7 mounted on the printed circuit board 8. The jig 9 from which the printed circuit board 8 has been removed can be reused. The jig 9 may have any shape for the guide plates 13a, 13b and the base plate 14 as long as it can prevent the printed circuit board 8 from bending. It is also possible to provide a reference hole for this purpose. FIG. 3 shows a perspective view of the printed circuit board 8 to which the phenol plate 3a has been bonded.
発明の効果
以上の説明から明らかな様に本発明のよれば、プリント
基板全面にわたって同熱容量の金属板をあてがっている
ため電子部品のはんだ付けを均等な温度で行なう事がで
き、実装された電子部品の品質、信頼性を向上させる事
ができ、かつ良好なはんだ付けを行う事ができかつ良好
なはんだ付けを行う事ができる。また、プリント基板の
はんだ付は工程終了後、治具を再使用できプリント基板
のコスト削減もできる。さらにはんだ付は終了後、補強
板としてフェノール板３ａを取りつけるので、はんだ付
は時の熱によりフェノール板３ａが反ったりすることも
なく、高品質の電子回路装置を提供できるものである。Effects of the Invention As is clear from the above explanation, according to the present invention, since a metal plate with the same heat capacity is applied over the entire surface of the printed circuit board, electronic components can be soldered at a uniform temperature, and the mounted electronic components can be soldered at a uniform temperature. It is possible to improve the quality and reliability of parts, and also to perform good soldering. Additionally, the jig for soldering printed circuit boards can be reused after the process is completed, which reduces the cost of printed circuit boards. Furthermore, since the phenol plate 3a is attached as a reinforcing plate after the soldering is completed, the phenol plate 3a does not warp due to the heat during soldering, and a high quality electronic circuit device can be provided.
第１図は本発明の一実施例の金属付フレキシブル基板の
斜視図、第２図ａはプリント基板実装はんだ付は用固定
治具の斜視図、第２図すはアルミ板付きフレキシブル基
板を同治具に取り付けた状態を示す斜視図、第２図Ｃは
第２図すに於けるＡ−Ａ’の断面図、第３図は樹脂基材
板を接着し終わった電子回路装置の斜視図、第４図は分
割終了後の電子回路装置の斜視図、第５図は従来のプリ
ント基板の斜視図である。
１・・・・・・プリント基板、２・・・・・・電子回路
装置、３・・・・・・枠、３ａ・・・・・・基材板、４
＋ ４ ａ 、４ ｂ・・・・・・アルミ板、５，５
ａ・・・・・・フレキシブル基板、６ａ。
６ｂ・・・・・・当て板、７・・・・・・電子部品、８
・・・・・・金属板付きフレキシブル基板（プリント基
板）、９・・・・・・実装はんだ付は用基板固定治具（
治具）、１０ａ。
１０ｂ・・・・・・凹み、１１・・・・・・ガイドビン
、１２・・・・・・基準穴、１３ａ、１３ｂ・・・・・
・ガイド板、１４・・・・・・ベース板。
代理人の氏名 弁理士 粟野重孝 ほか１名Ｃす
くFig. 1 is a perspective view of a metal-attached flexible board according to an embodiment of the present invention, Fig. 2a is a perspective view of a fixing jig for mounting and soldering a printed circuit board, and Fig. 2 is a perspective view of a fixing jig for mounting and soldering a printed circuit board. FIG. 2C is a sectional view taken along line A-A' in FIG. FIG. 4 is a perspective view of the electronic circuit device after division, and FIG. 5 is a perspective view of a conventional printed circuit board. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2... Electronic circuit device, 3... Frame, 3a... Base board, 4
+ 4 a, 4 b...aluminum plate, 5,5
a...Flexible board, 6a. 6b...Packing plate, 7...Electronic parts, 8
・・・・・・Flexible board with metal plate (printed circuit board), 9... Board fixing jig for mounting soldering (
jig), 10a. 10b...Recess, 11...Guide bin, 12...Reference hole, 13a, 13b...
・Guide plate, 14...Base plate. Name of agent: Patent attorney Shigetaka Awano and 1 other person C
Claims (1)
の前記金属板が接着されていない部分に、平面状で前記
金属板と同熱容量を有する金属からなる治具をあてがい
、前記フレキシブル基板上に電子部品をはんだ付けにて
実装する電子回路装置の製造方法。A flat jig made of a metal having the same heat capacity as the metal plate is applied to the part of the flexible substrate with a metal plate bonded to a part of one main surface where the metal plate is not bonded, and the jig is placed on the flexible substrate. A method of manufacturing an electronic circuit device in which electronic components are mounted on the board by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8542689A JPH02263497A (en) | 1989-04-04 | 1989-04-04 | Manufacture of electronic circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8542689A JPH02263497A (en) | 1989-04-04 | 1989-04-04 | Manufacture of electronic circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02263497A true JPH02263497A (en) | 1990-10-26 |
Family
ID=13858505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8542689A Pending JPH02263497A (en) | 1989-04-04 | 1989-04-04 | Manufacture of electronic circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02263497A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007158233A (en) * | 2005-12-08 | 2007-06-21 | Mitsubishi Electric Corp | Wiring structure, method of manufacturing same, and jig |
-
1989
- 1989-04-04 JP JP8542689A patent/JPH02263497A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007158233A (en) * | 2005-12-08 | 2007-06-21 | Mitsubishi Electric Corp | Wiring structure, method of manufacturing same, and jig |
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