JPH022573Y2 - - Google Patents

Info

Publication number

JPH022573Y2

JPH022573Y2 JP12258583U JP12258583U JPH022573Y2 JP H022573 Y2 JPH022573 Y2 JP H022573Y2 JP 12258583 U JP12258583 U JP 12258583U JP 12258583 U JP12258583 U JP 12258583U JP H022573 Y2 JPH022573 Y2 JP H022573Y2

Authority

JP

Japan

Prior art keywords

mold

sheet

molding

foam

molded product

Prior art date

1983-08-05

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
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• 238000000465 moulding Methods 0.000 claims description 29
• 239000006260 foam Substances 0.000 claims description 22
• 229920003002 synthetic resin Polymers 0.000 claims description 10
• 239000000057 synthetic resin Substances 0.000 claims description 10
• 239000011087 paperboard Substances 0.000 claims description 4
• 238000004519 manufacturing process Methods 0.000 description 11
• 239000000463 material Substances 0.000 description 8
• 230000003014 reinforcing effect Effects 0.000 description 8
• 238000005520 cutting process Methods 0.000 description 6
• 238000009966 trimming Methods 0.000 description 6
• 238000012360 testing method Methods 0.000 description 5
• 239000000123 paper Substances 0.000 description 4
• 238000007666 vacuum forming Methods 0.000 description 4
• 230000015572 biosynthetic process Effects 0.000 description 3
• 238000000034 method Methods 0.000 description 3
• 239000002245 particle Substances 0.000 description 3
• 239000000853 adhesive Substances 0.000 description 2
• 230000001070 adhesive effect Effects 0.000 description 2
• 238000005452 bending Methods 0.000 description 2
• 238000004806 packaging method and process Methods 0.000 description 2
• 238000012545 processing Methods 0.000 description 2
• 229920005989 resin Polymers 0.000 description 2
• 239000011347 resin Substances 0.000 description 2
• JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
• ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
• 239000004793 Polystyrene Substances 0.000 description 1
• NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
• 238000012937 correction Methods 0.000 description 1
• 238000005336 cracking Methods 0.000 description 1
• 238000013461 design Methods 0.000 description 1
• 229920006248 expandable polystyrene Polymers 0.000 description 1
• 239000004794 expanded polystyrene Substances 0.000 description 1
• 230000014759 maintenance of location Effects 0.000 description 1
• 238000002844 melting Methods 0.000 description 1
• 230000008018 melting Effects 0.000 description 1
• 239000002184 metal Substances 0.000 description 1
• 230000000149 penetrating effect Effects 0.000 description 1
• 230000002093 peripheral effect Effects 0.000 description 1
• 229920002223 polystyrene Polymers 0.000 description 1
• 238000004080 punching Methods 0.000 description 1
• 230000002787 reinforcement Effects 0.000 description 1
• 238000001179 sorption measurement Methods 0.000 description 1
• 238000009423 ventilation Methods 0.000 description 1
• 239000002023 wood Substances 0.000 description 1