JPH02254179A - Formation of plating film on magnesium alloy - Google Patents
Formation of plating film on magnesium alloyInfo
- Publication number
- JPH02254179A JPH02254179A JP7432289A JP7432289A JPH02254179A JP H02254179 A JPH02254179 A JP H02254179A JP 7432289 A JP7432289 A JP 7432289A JP 7432289 A JP7432289 A JP 7432289A JP H02254179 A JPH02254179 A JP H02254179A
- Authority
- JP
- Japan
- Prior art keywords
- film
- plating film
- electroless
- copper plating
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 88
- 229910000861 Mg alloy Inorganic materials 0.000 title claims abstract description 27
- 230000015572 biosynthetic process Effects 0.000 title description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052802 copper Inorganic materials 0.000 claims abstract description 32
- 239000010949 copper Substances 0.000 claims abstract description 32
- 238000005260 corrosion Methods 0.000 claims abstract description 21
- 230000007797 corrosion Effects 0.000 claims abstract description 21
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052737 gold Inorganic materials 0.000 claims abstract description 15
- 239000010931 gold Substances 0.000 claims abstract description 15
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 14
- 230000004888 barrier function Effects 0.000 claims abstract description 11
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 40
- 229910052759 nickel Inorganic materials 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 14
- 238000006467 substitution reaction Methods 0.000 claims description 9
- 239000011701 zinc Substances 0.000 claims description 9
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 230000002265 prevention Effects 0.000 claims description 6
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 5
- 238000000354 decomposition reaction Methods 0.000 claims 1
- 239000003638 chemical reducing agent Substances 0.000 abstract description 16
- 230000004913 activation Effects 0.000 abstract description 9
- 238000005554 pickling Methods 0.000 abstract description 7
- 229930040373 Paraformaldehyde Natural products 0.000 abstract description 4
- 229920002866 paraformaldehyde Polymers 0.000 abstract description 4
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052700 potassium Inorganic materials 0.000 abstract description 3
- 239000011591 potassium Substances 0.000 abstract description 3
- 229910001635 magnesium fluoride Inorganic materials 0.000 abstract description 2
- 230000003449 preventive effect Effects 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract 1
- NCPXQVVMIXIKTN-UHFFFAOYSA-N trisodium;phosphite Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])[O-] NCPXQVVMIXIKTN-UHFFFAOYSA-N 0.000 abstract 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 10
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 5
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 5
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 4
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- PYVHTIWHNXTVPF-UHFFFAOYSA-N F.F.F.F.C=C Chemical compound F.F.F.F.C=C PYVHTIWHNXTVPF-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は所要形状に加■されたマグネシウム合金に、
ハンタ付性、電気伝導性、耐食性を賦与するためのめっ
きｈ゛法に係るものである。[Detailed Description of the Invention] [Industrial Field of Application] This invention provides a magnesium alloy that has been shaped into a desired shape.
This relates to a plating method for imparting hunterability, electrical conductivity, and corrosion resistance.
従来のマグネシウム合金へのめっき成膜方法は第３図に
示すようにマグネシウム合金（１）に亜鉛置換膜（２）
を形成した後、その上に電気分解による銅めっき膜（３
）を形成し、さらにニッケルめっき皮膜（４）を設けた
後に所要の金めつき膜（５）を形成していた。As shown in Figure 3, the conventional method of plating film on magnesium alloy is to deposit zinc substitution film (2) on magnesium alloy (1).
After forming, a copper plating film (3
), and after further providing a nickel plating film (4), a required gold plating film (5) was formed.
従来はマグネシウム合金（１）に亜鉛置換膜（２）を形
成した後、電気分解による銅めっき膜（４）を設は所′
反の機能を賦すするためのめっき膜（５）を形成するよ
うにしていたが−１−記の成膜方法では、均な膜形成が
困難な為塩化物等の腐食成分を含有する。ニッケルめっ
きや硫酸銅めっき中に物品の腐食を起こしてきた。又ニ
ッケルや銅の腐食バリアーを設けたにも係わらず、めっ
き皮膜の不均一・に、よる物品の腐食を起こしてきた。Conventionally, after forming a zinc substitution film (2) on a magnesium alloy (1), a copper plating film (4) was applied by electrolysis.
A plating film (5) was formed to provide the opposite function, but the film forming method described in -1- contains corrosive components such as chloride because it is difficult to form a uniform film. Corrosion of articles has been caused during nickel plating and copper sulfate plating. In addition, despite the provision of corrosion barriers of nickel and copper, corrosion of articles has occurred due to unevenness of the plating film.
この発明はこのような従来の問題点を解決するためにな
されたものでめっき液のｐＨの制御めっき皮膜の厚み皮
膜構成を改ｉ（シマグ不ンウム合金のめっき液中での腐
食、および皮膜の不均一による物品の腐食を改善すると
ともにはんだ付性、導電性、耐食性を改否するためのマ
グネシウト合金への成膜方法を得ることを目的とするも
のである。This invention was made in order to solve these conventional problems, and it is possible to control the pH of the plating solution by changing the thickness and structure of the plating film. The object of the present invention is to obtain a method for forming a film on a magnesium alloy in order to improve corrosion of articles due to non-uniformity and to modify solderability, conductivity, and corrosion resistance.
〔課題を解決するための手段〕
マグ不ノウトは両性金属でＩＩＨが１０以」−では反応
かマイルドで１１１１ Ｐ、以下では１反応が激しくな
るそこで脱脂クロム酸による酸洗いを行った後活性化処
理による弗化マグネシウム形成から防錆バリアーである
無電解ニッケルの成膜までの全てをＰｌｆ８．５以上で
行う必要かある。 そこでこの発明はマグ不ンウム合金
の表面をクロム酸により酸洗い後リン酸１９１−２．２
２ｍｏｌ、酸性フッ化アンモン１．７２−１、８４ｍｏ
ｌに調整した活性化液を用いて活性化処理を施した後亜
鉛置換を施した後
■電気分解による銅めっき皮膜を１〜２μ施［７た後Ｐ
ｌ’ｌ］２．３〜Ｐ１１１２．７に制御したパラホルム
アルデヒドを還元剤とする無電解銅めっき膜を１μ形成
し
■次に防錆バリアーとして、膜厚を均等に次亜リン酸ソ
ーダを還元剤とする無電解ニッケル股を５〜１０μ形成
し、その後にニッケルめっきとの密着性を良くするため
に、 Ｉ）Ｉ（を３０〜４０に制御した水素化硼素化カ
リウムを還元剤とする。無電解金めっき膜を０．１〜０
．５μ形成し■次に導電性を賦ＩｊするためにＰｌｊ１
２．０〜１２６に制御シタバラホルノ＼アルデヒドを還
元剤とする）！１（電解銅め−〕き膜２〜５μを形成し
た後に電気分解による銅めっきを施した後
■半［（１付性、耐食性のための電気分解による金めつ
き膜を施すことによって得られるマグネシウｌ＼合金の
成膜方法とするとともに
■の防錆バリアーとしての無電解ニッケルめっきの後に
微視孔に四弗化エチレンの含浸を行−〕だ後所要のめっ
きを施すことにより耐食性、導電性を得るための含浸を
行うことを特徴とするマグ不ンウム合金へのめっき成膜
方法である。[Means for solving the problem] Magunout is an amphoteric metal with IIH of 10 or more - the reaction is mild or 1111 P, and below 1 the reaction becomes violent, so it is activated after pickling with degreasing chromic acid. It is necessary to perform everything from the formation of magnesium fluoride through treatment to the formation of an electroless nickel film as a rust prevention barrier at a Plf of 8.5 or higher. Therefore, in this invention, after pickling the surface of magunium alloy with chromic acid, phosphoric acid 191-2.2
2 mol, acidic ammonium fluoride 1.72-1, 84 mo
After activation treatment using an activation solution adjusted to l
1 μm of electroless copper plating film using paraformaldehyde as a reducing agent controlled to 2.3 to 12.7 was formed, and then sodium hypophosphite was reduced to an even film thickness as a rust prevention barrier. After forming 5 to 10 μm of electroless nickel as an agent, in order to improve adhesion to the nickel plating, I) Potassium borohydride with I(I) controlled to 30 to 40 is used as a reducing agent. Electroless gold plating film 0.1~0
．． 5 μm and then Plj1 to add conductivity to Ij.
Control from 2.0 to 126 using Shitabaraforno\aldehyde as the reducing agent)! 1 (Electrolytic copper plating) After forming a film of 2 to 5 μm, copper plating is applied by electrolysis. In addition to the method of forming a film of magnesium l\ alloy, the microscopic pores are impregnated with ethylene tetrafluoride after electroless nickel plating as a rust-preventive barrier in (2) - ] and then the required plating is applied to improve corrosion resistance and conductivity. This is a method for forming a plating film on a magunium alloy, which is characterized by impregnation to obtain properties.
マグネシウムはｌ）Ｉ＋が１０以に−Ｃは反応かマイル
ドでｐＨ８以下では１反応が激しくなるため防錆／＜リ
アーである無電解ニッケルの成膜までは円１を８５以上
で全′Ｃ行う必要かある。マグネシウム合金の表面をク
ロム酸により酸洗後リン酸１．９１〜２．２２ｍｏｌ酸
性フッ化アンモン１４７２〜１．８４ｍｏｌに調整した
活性液を用いて活性化処理を施した後亜鉛置換処理を施
すことにより均一・な亜鉛置換膜を形成する。Magnesium is l) I+ is 10 or more, -C is a mild reaction, and at pH 8 or less, 1 reaction becomes violent, so until the formation of electroless nickel, which is rust prevention / < rear, perform all 'C' at 85 or more for circle 1. Is it necessary? After pickling the surface of the magnesium alloy with chromic acid, performing an activation treatment using an activation solution adjusted to 1.91 to 2.22 mol of phosphoric acid and 1472 to 1.84 mol of acidic ammonium fluoride, and then performing a zinc substitution treatment. Forms a more uniform zinc-substituted film.
０） 電気分解による銅めっき皮膜１〜２μを施した
後、 Ｐ＋１１２．３〜！２７に制御したパラホルムア
ルデヒドを還元剤とする無電解銅めっき１μを施し防錆
バリアーとして膜厚を均等するため■ 次亜リン酸ソー
ダを還元剤とするニッケルめっき５〜［１μを施すこと
により複雑形状品やアスペクト比の高い物品に均一な膜
形成が可能となり、めっき液中での物品の腐食を起こす
ことがない。0) After applying a copper plating film of 1 to 2μ by electrolysis, P+112.3~! Electroless copper plating of 1μ using paraformaldehyde as a reducing agent controlled at 27°C is applied to ensure uniform film thickness as a rust preventive barrier■ Nickel plating using sodium hypophosphite as a reducing agent 5~[Complicated by applying 1μ It is possible to form a uniform film on shaped articles or articles with a high aspect ratio, and the articles will not be corroded in the plating solution.
この無電解ニッケルめっきと上層との密着性を良くする
ためｐＨを３〜４に制御した水素化硼素化カリウムを還
元剤とする無電解金め−）き膜を０１〜０５μ施し
■ 次に導電性を賦与するために、ＰＨ１２，６〜１２
２６に制御したバラポルノ・アルデヒドを還元剤とする
無電解銅めっき膜２〜５μを形成した後に電気分解によ
る銅めっきを施した後
■ 半田付性、耐食性、電気伝導性のために、電気分解
による金めつき膜を施すことによって得られるマグ不ン
ウム合金の成膜する。In order to improve the adhesion between this electroless nickel plating and the upper layer, an electroless gold plating film of 01 to 05μ using potassium borohydride as a reducing agent with a pH controlled to 3 to 4 is applied. PH12,6-12 to impart sex
After forming an electroless copper plating film of 2 to 5 μm using parapornoaldehyde as a reducing agent controlled at A film of magunium alloy obtained by applying a gold plating film is formed.
また■の防錆バリアーとしての無電解ニッケルめりきの
後の微視孔に四弗化エチレンの含にを行った後、所要の
め・２きを施すことにより更に耐食性を向Ｉ−させるこ
とができる。In addition, after applying tetrafluoroethylene to the microscopic pores after the electroless nickel plating as a rust-preventing barrier in (2), the corrosion resistance can be further improved by applying the required metallization and polishing. I can do it.
〔実施例１ 以１ζ図面に基ついてこの発明を説明する。[Example 1 The present invention will be explained below based on the drawings.
第１図において、所要の形状に加−１１されたマグネシ
ウム・合金（１）をクロム酸酸洗液で酸洗後リン酸１、
９］〜２．２２ｍｏｌ酸性フッ化アンモン１．７２〜１
．８４ｍｏｌに調整した活性化液を用いて活性化処理す
ることに上りマグネシウト合金（１）の表面にＭｇＦ、
（６）の皮膜を形成した後に亜鉛置換を施すことにより
マグネシウム合金（１）の表面は均一な亜鉛置換膜（２
）で覆われる。In Figure 1, magnesium alloy (1) which has been added to the desired shape with 11 phosphoric acid and 11 phosphoric acid after pickling with chromic acid pickling solution
9] ~ 2.22 mol acidic ammonium fluoride 1.72 ~ 1
．． By performing activation treatment using an activation solution adjusted to 84 mol, MgF,
By performing zinc substitution after forming the film of (6), the surface of magnesium alloy (1) can be uniformly zinc-substituted film (2).
).
次に電気分解による銅めっき皮膜（３）を１〜２１ノ施
しｌ’Ｈ１２，３〜１２７に制御したバラホルムアルデ
ヒドを還元剤とした無電解銅めっき（７）を１ ／、Ｚ
を施すことにより複雑形状品や高アスペクト品に均な成
膜ができる。次に防錆バリアーとして次亜リン酸ソータ
を還元剤とする無電解ニッケルめっき（８）を５〜１０
μ施すことによりめっき中での物品の腐食を起こすこと
はない。Next, a copper plating film (3) was applied by electrolysis at 1 to 21 times, and electroless copper plating (7) using rose formaldehyde as a reducing agent, which was controlled to 12, 3 to 127, was applied to 1/, Z.
By applying this method, it is possible to form a uniform film on products with complex shapes and high aspect ratios. Next, electroless nickel plating (8) using hypophosphorous acid sorter as a reducing agent is applied as a rust prevention barrier.
By applying μ, the article will not be corroded during plating.
次にニッケルめっきと−１−層のめっきとの密着性を良
くするためｐＨ３〜４に制御した無電解金めっき（９）
、 Ｐ）［１２，Ｏ〜１２．６に制御した無電解銅めっ
き（１，０）を２〜５μ施し、電気分解による掴めつき
（ＩＩ）、金めつき（）２）を施すことにより耐食性を
向にさせることができる。Next, electroless gold plating with pH controlled to 3 to 4 to improve adhesion between nickel plating and -1- layer plating (9)
, P) [12, O ~ Corrosion resistance is achieved by applying electroless copper plating (1,0) controlled to 12.6 by 2 to 5 μ, followed by electrolytic gripping (II) and gold plating (2). can be turned in the opposite direction.
第２図はこの発明の更に耐食性を向１−させる場合の他
の実施例を示す図であり１図において所要の形状に加工
されたマグネシウム合金（１） ラフ。FIG. 2 is a diagram showing another embodiment of the present invention in which the corrosion resistance is further improved. In FIG. 1, a magnesium alloy (1) rough processed into a required shape is shown.
ノ＼酸酸洗液で酸とＬ後すン酸１９１〜２．２２ｍｏｌ
、酸性フッ化アンモン１７２〜］、 ８４ｍｏＪに調整
した活性化液を用いて活性化処理することによりマグネ
シウム合金（１）の表面にＭｇＦｔ（６）の皮膜を形成
した後に亜鉛置換を施すことによりマグネシウム合金（
１）の表面は均一な亜鉛置換膜（２）で覆われる。191 to 2.22 mol of phosphoric acid after acid and L with acid pickling solution
, acidic ammonium fluoride 172 ~], a film of MgFt (6) is formed on the surface of the magnesium alloy (1) by activation treatment using an activation solution adjusted to 84 moJ, and then magnesium is replaced by zinc substitution. alloy(
The surface of 1) is covered with a uniform zinc-substituted film (2).
次に電気分解による銅めっき皮膜（３）を１〜２μ施り
、 ＰＨＩ ２．３〜１２．７に制御したパラポルムア
ルデヒドを還几剤とした無電解銅めっき（７）を５〜１
０μ施した後、四弗化エチレン（１３）を微視孔に含浸
させた所要のめっき皮膜（１４）を形成することで耐食
性を向上させることができる。−」−記のような膜形成
を行うことによってマグネシウム合金へのめっき成膜方
法ができる。Next, a copper plating film (3) of 1 to 2 μm was applied by electrolysis, and electroless copper plating (7) using parapormaldehyde controlled to a PHI of 2.3 to 12.7 as a reducing agent was applied to a film of 5 to 1 μm.
After applying 0μ, corrosion resistance can be improved by forming a required plating film (14) in which microscopic pores are impregnated with tetrafluoroethylene (13). A method for forming a plating film on a magnesium alloy can be achieved by forming a film as described in "-"-.
以−［ユのようにこの発明は、マグネシウム合金を弗化
物を含むクロム酸液により表面を安定した状態にした後
、 Ｚｎ置換処理し電気分解による銅めっき、 Ｐｌ＋
を制御した無電解銅めっき１次亜リン酸ソーダを還元剤
とした無電解ニッケルめっきを施しためっき皮膜の成膜
方法を用いており次のような効果が期待できる。マグネ
シウム合金を安定した状態でめっき成膜を行うため高ア
スペクト２複雑形状品に均一なめっき成膜を施すことが
できる。In this invention, the surface of a magnesium alloy is stabilized with a chromic acid solution containing fluoride, and then subjected to Zn substitution treatment, copper plating by electrolysis, and Pl+
Electroless copper plating with controlled primary electrolytic nickel plating using sodium hypophosphite as a reducing agent is used, and the following effects can be expected. Since the magnesium alloy is plated in a stable state, uniform plating can be applied to products with high aspect ratios and complex shapes.
又防錆バリアーとして次亜リン酸ナトリウムを還元剤と
する無電解ニッケルめっき５〜１０μ を施した後胴め
っき、金めつきを施しており、耐食性、電気伝導性、は
んだ付性に優れる。更に耐食性を必要とする場合無電解
ニッケルめっきの微視孔に四弗化エチレンを含？２させ
ることで耐食性に優れるマグネシウム合金をこのような
成膜方法で行うことでめっき液中での物品の腐食、皮膜
不均一による腐食を防止することがｌ１ｉＪ能となり製
造コスト信顛性を向」−さぜることかできマグネシウム
合金を用いた衛星部品の軽量化に対応することができる
。In addition, as a rust-preventing barrier, electroless nickel plating with a thickness of 5 to 10 μm using sodium hypophosphite as a reducing agent is applied, followed by back body plating and gold plating, resulting in excellent corrosion resistance, electrical conductivity, and solderability. If further corrosion resistance is required, do you include tetrafluoroethylene in the microscopic pores of electroless nickel plating? By using this method to form a film using magnesium alloy, which has excellent corrosion resistance, it is possible to prevent corrosion of the article in the plating solution and corrosion due to uneven coating, thereby improving manufacturing cost reliability. - Can be used to reduce the weight of satellite parts made of magnesium alloy, which can be stirred.
第１図はこの発明のマグネシウム合金へのめっき皮膜方
法を説明するための図、第２図はこの発明の他の実施例
を説明するための図、第３図は従来のマグネシウム合金
へのめっき皮膜方法を説明するための図である。
図中、（１）はマグネシウム合金、（２）は亜鉛置換膜
（３）は銅めっき皮膜、（４）はニッケルめっき皮膜、
（５）は金めつき皮膜、（６）はＭｇＦｖ−（７）は無
電解銅めっき（８）は無電解ニッケルめっき、（９）は
無電解金めっき、（１０）は無電解銅めっき、 （１１
）は電気分解による銅めっき、 （１２）は金めつき、
（１，３）は四弗化エチレン（１４）はめっき皮膜であ
る。
（］Ｏ）
なお図中同一あるいは相当部分には同−符７じ−を付し
て示しである。Fig. 1 is a diagram for explaining the plating film method for magnesium alloy of this invention, Fig. 2 is a diagram for explaining another embodiment of this invention, and Fig. 3 is a diagram for explaining the conventional plating method for magnesium alloy. FIG. 3 is a diagram for explaining a coating method. In the figure, (1) is a magnesium alloy, (2) is a zinc substitution film, (3) is a copper plating film, (4) is a nickel plating film,
(5) is gold plating film, (6) is MgFv- (7) is electroless copper plating, (8) is electroless nickel plating, (9) is electroless gold plating, (10) is electroless copper plating, (11
) is copper plating by electrolysis, (12) is gold plating,
(1,3) is tetrafluoroethylene (14) is a plating film. (]O) In the drawings, the same or corresponding parts are indicated by the same reference numerals 7 and 7.
Claims (2)
を賦与するためのめっき皮膜形成方法において、マグネ
シウム合金に亜鉛置換膜を施し電気分解による銅めっき
膜を形成した後無電解銅めっき皮膜を形成し、次に、上
記無電解銅めつき皮膜上に防錆バリアーとして無電解に
よるニッケル膜を形成した後無電解の金めっき皮膜を形
成し、さらに上記無電解の金めっき皮膜上に導電性を賦
与するための無電解による銅めっき膜を形成した後に、
電気分解による銅めっき膜を形成し、しかる後に半田付
性、導電性、耐食性のための電気分解による所要の金め
っき膜を形成することを特徴とするマグネシウム合金へ
のめっき成膜方法。(1) In a method for forming a plating film to impart solderability, electrical conductivity, and corrosion resistance to a magnesium alloy, a zinc substitution film is applied to the magnesium alloy, a copper plating film is formed by electrolysis, and then an electroless copper plating film is formed. Next, an electroless nickel film is formed as a rust prevention barrier on the electroless copper plating film, an electroless gold plating film is formed, and a conductive film is further formed on the electroless gold plating film. After forming an electroless copper plating film for imparting,
A method for forming a plating film on a magnesium alloy, which comprises forming a copper plating film by electrolysis, and then forming a required gold plating film by electrolysis for solderability, conductivity, and corrosion resistance.
を賦与するためのめっき皮膜形成方法において、マグネ
シウム合金に亜鉛置換膜を施し電気分解による銅めっき
膜を形成した後無電解銅めっき皮膜を形成し、次に、上
記無電解銅めつき皮膜上に防錆バリアーとしての無電解
ニッケル膜を形成した後に、その微視孔に四弗化エチレ
ンの含浸を行い、その上に無電解又は、電気分解により
所要の厚さのめっき皮膜を形成することを特徴とするマ
グネシウム合金へのめっき成膜方法。(2) In a method for forming a plating film to impart solderability, electrical conductivity, and corrosion resistance to a magnesium alloy, a zinc substitution film is applied to the magnesium alloy, a copper plating film is formed by electrolysis, and then an electroless copper plating film is formed. Next, after forming an electroless nickel film as a rust prevention barrier on the electroless copper plating film, the micropores are impregnated with tetrafluoroethylene, and then electroless or electrical A method for forming a plating film on a magnesium alloy, which is characterized by forming a plating film of a required thickness by decomposition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7432289A JPH0631443B2 (en) | 1989-03-27 | 1989-03-27 | Method for forming plating film on magnesium alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7432289A JPH0631443B2 (en) | 1989-03-27 | 1989-03-27 | Method for forming plating film on magnesium alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02254179A true JPH02254179A (en) | 1990-10-12 |
| JPH0631443B2 JPH0631443B2 (en) | 1994-04-27 |
Family
ID=13543764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7432289A Expired - Fee Related JPH0631443B2 (en) | 1989-03-27 | 1989-03-27 | Method for forming plating film on magnesium alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0631443B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6669997B2 (en) | 2002-03-26 | 2003-12-30 | National Research Council Of Canada | Acousto-immersion coating and process for magnesium and its alloy |
| CN100430520C (en) * | 2005-12-30 | 2008-11-05 | 东北大学 | Process for copper coating on surface of magnesium and magnesium alloy |
| JP2009504923A (en) * | 2005-08-17 | 2009-02-05 | マクダーミッド インコーポレーテッド | Pretreatment of magnesium substrate for electroplating |
| US8231743B2 (en) | 2009-10-22 | 2012-07-31 | Atotech Deutschland Gmbh | Composition and process for improved zincating magnesium and magnesium alloy substrates |
| CN105586590A (en) * | 2014-10-23 | 2016-05-18 | 吴长义 | Magnesium alloy material, terminal, communication device, vehicle and preparing method |
| CN105586598A (en) * | 2014-10-23 | 2016-05-18 | 吴长义 | Magnesium alloy material, terminal, communication device, vehicle and preparing method |
| CN114045476A (en) * | 2021-11-11 | 2022-02-15 | 重庆大学 | Copper-magnesium composite material and preparation method and application thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105525290A (en) * | 2014-10-23 | 2016-04-27 | 吴长义 | Magnesium alloy material, terminal, communication device, vehicle and preparation method |
-
1989
- 1989-03-27 JP JP7432289A patent/JPH0631443B2/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6669997B2 (en) | 2002-03-26 | 2003-12-30 | National Research Council Of Canada | Acousto-immersion coating and process for magnesium and its alloy |
| JP2009504923A (en) * | 2005-08-17 | 2009-02-05 | マクダーミッド インコーポレーテッド | Pretreatment of magnesium substrate for electroplating |
| JP4857340B2 (en) * | 2005-08-17 | 2012-01-18 | マクダーミッド インコーポレーテッド | Pretreatment of magnesium substrate for electroplating |
| CN100430520C (en) * | 2005-12-30 | 2008-11-05 | 东北大学 | Process for copper coating on surface of magnesium and magnesium alloy |
| US8231743B2 (en) | 2009-10-22 | 2012-07-31 | Atotech Deutschland Gmbh | Composition and process for improved zincating magnesium and magnesium alloy substrates |
| CN105586590A (en) * | 2014-10-23 | 2016-05-18 | 吴长义 | Magnesium alloy material, terminal, communication device, vehicle and preparing method |
| CN105586598A (en) * | 2014-10-23 | 2016-05-18 | 吴长义 | Magnesium alloy material, terminal, communication device, vehicle and preparing method |
| CN114045476A (en) * | 2021-11-11 | 2022-02-15 | 重庆大学 | Copper-magnesium composite material and preparation method and application thereof |
| CN114045476B (en) * | 2021-11-11 | 2023-10-20 | 重庆大学 | Copper-magnesium composite material and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0631443B2 (en) | 1994-04-27 |
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