CN105586598A - Magnesium alloy material, terminal, communication device, vehicle and preparing method - Google Patents
Magnesium alloy material, terminal, communication device, vehicle and preparing method Download PDFInfo
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- CN105586598A CN105586598A CN201410572946.5A CN201410572946A CN105586598A CN 105586598 A CN105586598 A CN 105586598A CN 201410572946 A CN201410572946 A CN 201410572946A CN 105586598 A CN105586598 A CN 105586598A
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Abstract
The invention is suitable for the field of materials and provides a magnesium alloy material. The magnesium alloy material comprises a magnesium alloy matrix, a first zinc layer attached to the magnesium alloy matrix, a copper layer attached to the first zinc layer, a second zinc layer attached to the copper layer and a passive film attached to the second zinc layer. By means of the magnesium alloy material provided by the embodiment, the corrosion-resisting performance of the magnesium alloy material is good, and the resistance is low.
Description
Technical field
The present invention relates to Material Field, relate in particular to magnesium alloy materials, terminal, communication apparatus, the vehiclesAnd preparation method.
Background technology
Magnesium alloy is the alloy that adds other element compositions taking magnesium as base. It has that density is little, specific strength is high,Elastic modelling quantity is large, shock absorbing is good, the load-carrying ability that withstands shocks is than advantages such as aluminium alloy are large. Be mainly used in aviation,The industrial departments such as space flight, transport, chemical industry, rocket.
Existing magnesium alloy materials, be generally by magnesium alloy substrate is carried out epithelium processing or electro-coppering,Nickel, chromium processing obtain, and this magnesium alloy materials exists salt fog poor performance, the problem that resistance is high.
Summary of the invention
The embodiment of the present invention provides a kind of magnesium alloy materials, is intended to solve the existing magnesium alloy materials salt fog timeThe problem short, resistance is high.
The embodiment of the present invention is achieved in that a kind of magnesium alloy materials, comprising:
Magnesium alloy substrate;
The first zinc layer, is attached to described magnesium alloy substrate;
Copper layer, is attached to described the first zinc layer;
The second zinc layer, is attached to described copper layer;
Passivating film, is attached to described the second zinc layer.
The embodiment of the present invention also provides another kind of magnesium alloy materials, comprising:
Magnesium alloy substrate;
Nickel dam, is attached to described magnesium alloy substrate;
Copper layer, is attached to described nickel dam;
Zinc layer, is attached to described copper layer;
Passivating film, is attached to described zinc layer.
The embodiment of the present invention also provides a kind of mobile terminal, includes termination support and/or terminal connector,It is characterized in that, described termination support and/or terminal connector are in whole or in part by above-mentioned magnesium alloy materialMaterial is made.
The embodiment of the present invention also provides a kind of communication apparatus, comprises equipment support members and/or equipment connection part, itsBe characterised in that, described equipment support members and/or equipment connection part are in whole or in part by above-mentioned magnesium alloy materialsMake.
The embodiment of the present invention also provides a kind of vehicles, comprises that vehicles support member and/or the vehicles connectFitting, is characterized in that, described vehicles support member and/or vehicles connector are by above-mentioned magnesium alloyMaterial is made.
The embodiment of the present invention also provides a kind of preparation method of magnesium alloy materials, it is characterized in that, described methodComprise the steps:
Heavy zinc or heavy nickel step: magnesium alloy substrate is placed in to the solution that contains zinc ion or nickel ion, in instituteState magnesium alloy matrix surface and form the heavy zinc layer of one deck or heavy nickel dam;
Copper facing step: will be placed in charged in the situation that through the magnesium alloy substrate of described heavy zinc or heavy nickel processingIn copper plating solution, form the pre-copper plate of one deck at described heavy zinc layer or heavy nickel dam surface;
Zinc-plated step: the magnesium alloy substrate through described copper plating treatment is placed in zinc-plated molten charged in the situation thatLiquid, forms one deck zinc coat on described pre-copper plate surface;
Passivation step: the magnesium alloy substrate through described zinc-plated processing is placed in to passivating solution, at described zinc coatSurface forms one deck passivating film.
The magnesium alloy materials that the embodiment of the present invention provides, its corrosion resistance and good, resistance is low.
Brief description of the drawings
Fig. 1 is the tangent plane structural representation of the first magnesium alloy materials of providing of the embodiment of the present invention 1;
Fig. 2 is the tangent plane structural representation of the second magnesium alloy materials of providing of the embodiment of the present invention 1;
Fig. 3 is the tangent plane structural representation of the third magnesium alloy materials of providing of the embodiment of the present invention 1;
Fig. 4 is the tangent plane structural representation of the 4th kind of magnesium alloy materials providing of the embodiment of the present invention 1;
Fig. 5 is preparation method's flow chart of the magnesium alloy materials that provides of the embodiment of the present invention.
Detailed description of the invention
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing and realityExecute example, the present invention is further elaborated. Only should be appreciated that specific embodiment described hereinOnly, in order to explain the present invention, be not intended to limit the present invention.
The magnesium alloy materials that the embodiment of the present invention provides on magnesium alloy substrate, be attached with the first zinc layer, copper layer,The second zinc layer and passivating film, makes magnesium alloy materials corrosion resistance and good, and resistance is low.
Described magnesium alloy substrate in the embodiment of the present invention is the alloy material that comprises magnesium, in the invention processIn example, the salt fog performance of magnesium alloy materials adopts GB/T10125-2012/ISO9227:2006 " artificial atmosphereCorrosion test salt spray test " in method of testing test, observe magnesium alloy substrate and corrosion do not occurFor a long time, this cycle observing time is 2,6,24,48,96,144,168,240,480 (h);Electric conductivity adopts the resistance of the digital microhmmeter test of ZY9987 type sample, and the probe diameter of probe is2mm (millimeter), the power that is applied to probe are 500N (newton), and per sample (p.s.) product are got 2 points and measured,Then get the resistance mean value of 2 points as the resistance of test agent, in embodiments of the present invention, carrying out saltBefore mist performance test and after test, respectively the resistive performance of sample is tested; Adhesion performance adopts ISOMethod of testing in 2409-2007 (E) " paint and varnish-cross cut test " is tested.
Embodiment 1:
With reference to figure 1 and Fig. 2, the tangent plane structure of the first magnesium alloy materials providing for the embodiment of the present invention 1The tangent plane structural representation of schematic diagram and the second magnesium alloy materials, for ease of describing, only illustrates and the present inventionRelevant part, details are as follows.
Magnesium alloy materials comprises magnesium alloy substrate 11, is attached to the first zinc layer 12 of magnesium alloy substrate 11, attachedIn the copper layer 13 of the first zinc layer 12, be attached to the second zinc layer 14 of copper layer, and be attached to the second zinc layer14 passivating films 15.
In embodiments of the present invention, the thickness of the first zinc layer 12 is 0.5～5 μ m, and preferably 3 μ m, closeDegree is 0.71～0.78 ㎎ ㎝-2·μm-1, preferably 0.71 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of copper layer 13 is 2～8 μ m, preferably 5 μ m, and density is0.89～0.98㎎·㎝-2·μm-1, preferably 0.89 ㎎ ㎝-2·μm-1。
The thickness of 0 second zinc layer 14 is 1.4～7.8 μ m in embodiments of the present invention, preferably 5 μ m,Density is 0.71～0.78 ㎎ ㎝-2·μm-1, preferably 0.71 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of described passivating film 15 is 0.2-0.6 μ m, preferably 0.4 μm。
As another embodiment of the present invention, with reference to figure 3 and Fig. 4, for the embodiment of the present invention 1 provideThe tangent plane structural representation of the tangent plane structural representation of three kinds of magnesium alloy materials and the 4th kind of magnesium alloy materials, forBe convenient to describe, part related to the present invention is only shown, details are as follows.
Magnesium alloy materials comprises magnesium alloy substrate 21, be attached to magnesium alloy substrate 21 nickel dam 22, be attached toThe copper layer 23 of nickel dam 22, be attached to the zinc layer 24 of copper layer 23, and be attached to the passivating film 25 of zinc layer 24.
In embodiments of the present invention, the thickness of nickel dam 22 is 1～5 μ m, preferably 3 μ m, and density is0.89～0.98㎎·㎝-2·μm-1, preferably 0.89 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of copper layer 23 is 2～8 μ m, preferably 5 μ m, and density is0.89～0.98㎎·㎝-2·μm-1, preferably 0.89 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of zinc layer 24 is 1.4-7.8 μ m, preferably 5 μ m, densityBe 0.71～0.78 ㎎ ㎝-2·μm-1, preferably 0.71 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of passivating film 25 is 0.2-0.6 μ m, preferably 0.4 μ m.
Magnesium alloy materials in above-mentioned two kinds of embodiment, salt fog performance can reach 96h, salt fog performance testFront resistance is below 0.8m Ω, and the resistance after salt fog performance test is below 1.0m Ω, through adhesionCan there is not the phenomenon that coating comes off by the rear magnesium alloy matrix surface of test, its corrosion resistance and good, resistance is little,Adhesion is strong.
Embodiment 2:
A kind of mobile terminal, comprises termination support and/or terminal connector, and termination support and/or terminal connectThe all or part of employing magnesium alloy materials of fitting is made.
In embodiments of the present invention, described termination support comprises shell or the support of mobile terminal, described inShell is mobile terminal outermost layer structural member, and described support is passive framework in mobile terminal.
In embodiments of the present invention, described terminal connector comprises screw, the screw etc. in mobile terminal.
As one embodiment of the invention, with reference to Fig. 1 and 2, described magnesium alloy materials comprises magnesium alloy substrate11, be attached to the first zinc layer 12 of magnesium alloy substrate 11, be attached to the copper layer 13 of the first zinc layer 12, adhere toIn the second zinc layer 14 of copper layer 13, and be attached to the second zinc layer 14 passivating film 15.
In embodiments of the present invention, the thickness of the first zinc layer 12 is 0.5～5 μ m, and preferably 3 μ m, closeDegree is 0.71～0.78 ㎎ ㎝-2·μm-1, preferably 0.71 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of copper layer 13 is 2～8 μ m, preferably 5 μ m, and density is0.89～0.98㎎·㎝-2·μm-1, preferably 0.89 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of the second zinc layer 14 is 1.4～7.8 μ m, preferably 5 μ m,Density is 0.71～0.78 ㎎ ㎝-2·μm-1, preferably 0.71 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of described passivating film 15 is 0.2-0.6 μ m, preferably 0.4 μm。
As another embodiment of the present invention, with reference to figure 3 and 4, described magnesium alloy materials comprises magnesium alloy baseBody 21, be attached to magnesium alloy substrate 21 nickel dam 22, be attached to nickel dam 22 copper layer 23, be attached to copperLayer 23 zinc layer 24, and be attached to the passivating film 25 of zinc layer 24.
In embodiments of the present invention, the thickness of nickel dam 22 is 1～5 μ m, preferably 3 μ m, and density is0.89～0.98㎎·㎝-2·μm-1, preferably 0.89 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of copper layer 23 is 2～8 μ m, preferably 5 μ m, and density is0.89～0.98㎎·㎝-2·μm-1, preferably 0.89 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of zinc layer 24 is 1.4-7.8 μ m, preferably 5 μ m, densityBe 0.71～0.78 ㎎ ㎝-2·μm-1, preferably 0.71 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of passivating film 25 is 0.2-0.6 μ m, preferably 0.4 μ m.
In embodiments of the present invention, described mobile terminal include but not limited to mobile phone, personal computer,Or personal digital assistant (PDA).
In embodiments of the present invention, the magnesium that the termination support of described mobile terminal and/or terminal connector adoptAlloy material, has the good performances such as quality is light, salt fog is good, resistance is little, makes mobile terminal moreLight, corrosion-resistant and the loss of signal is little.
Embodiment 3:
A kind of communication apparatus, comprises equipment support members and/or equipment connection part, and equipment support members and/or equipment connectThe all or part of employing magnesium alloy materials of fitting is made.
In embodiments of the present invention, described equipment support members comprises shell, support or the inside of communication apparatusThe frame structure of components and parts,, described shell is communication apparatus or outermost layer structural member, described support is for logicalPassive framework in news equipment, the frame structure of described internal component as the shell of wave filter andFrame etc.
In embodiments of the present invention, described equipment connection part comprises screw, the screw etc. in communication apparatus.
As one embodiment of the invention, with reference to Fig. 1 and 2, described magnesium alloy materials comprises magnesium alloy substrate11, be attached to the first zinc layer 12 of magnesium alloy substrate 11, be attached to the copper layer 13 of the first zinc layer 12, adhere toIn the second zinc layer 14 of copper layer 13, and be attached to the second zinc layer 14 passivating film 15.
In embodiments of the present invention, the thickness of the first zinc layer 12 is 0.5～5 μ m, and preferably 3 μ m, closeDegree is 0.71～0.78 ㎎ ㎝-2·μm-1, preferably 0.71 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of copper layer 13 is 2～8 μ m, preferably 5 μ m, and density is0.89～0.98㎎·㎝-2·μm-1, preferably 0.89 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of the second zinc layer 14 is 1.4～7.8 μ m, preferably 5 μ m,Density is 0.71～0.78 ㎎ ㎝-2·μm-1, preferably 0.71 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of described passivating film 15 is 0.2-0.6 μ m, preferably 0.4 μm。
As another embodiment of the present invention, with reference to figure 3 and 4, described magnesium alloy materials comprises magnesium alloy baseBody 11, be attached to magnesium alloy substrate 11 nickel dam 22, be attached to nickel dam 22 copper layer 13, be attached to copperLayer 13 zinc layer 24, and be attached to the passivating film 15 of zinc layer 24.
In embodiments of the present invention, the thickness of nickel dam 22 is 1～5 μ m, preferably 3 μ m, and density is0.89～0.98㎎·㎝-2·μm-1, preferably 0.89 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of copper layer 13 is 2～8 μ m, preferably 5 μ m, and density is0.89～0.98㎎·㎝-2·μm-1, preferably 0.89 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of zinc layer 24 is 1.4-7.8 μ m, preferably 5 μ m, densityBe 0.71～0.78 ㎎ ㎝-2·μm-1, preferably 0.71 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of passivating film 15 is 0.2-0.6 μ m, preferably 0.4 μ m.
In embodiments of the present invention, described mobile terminal includes but not limited to base station, modem or communicationTransmitter.
In embodiments of the present invention, the magnesium that the equipment support members of described communication apparatus and/or equipment connection part adoptAlloy material, has the good performances such as quality is light, salt fog is good, resistance is little, makes communication apparatus moreLight, corrosion-resistant and the loss of signal is little.
Embodiment 4
A kind of vehicles, comprise vehicles support member and/or vehicles connector, and the vehicles supportThe all or part of employing magnesium alloy materials of part and/or vehicles connector is made.
In embodiments of the present invention, vehicles support member comprises shell, support or the inside of the vehiclesThe frame structure of components and parts, described shell is communication apparatus or outermost layer structural member, described support is communicationPassive framework in equipment, the frame structure of described internal component is as outside engine housing, motorShell etc.
In embodiments of the present invention, described vehicles connector comprises screw, the screw etc. in the vehicles.
As one embodiment of the invention, with reference to Fig. 1 and 2, described magnesium alloy materials comprises magnesium alloy substrate11, be attached to the first zinc layer 12 of magnesium alloy substrate 11, be attached to the copper layer 13 of the first zinc layer 12, adhere toIn the second zinc layer 14 of copper layer 13, and be attached to the second zinc layer 14 passivating film 15.
In embodiments of the present invention, the thickness of the first zinc layer 12 is 0.5～5 μ m, and preferably 3 μ m, closeDegree is 0.71～0.78 ㎎ ㎝-2·μm-1, preferably 0.71 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of copper layer 13 is 2～8 μ m, preferably 5 μ m, and density is0.89～0.98㎎·㎝-2·μm-1, preferably 0.89 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of the second zinc layer 14 is 1.4～7.8 μ m, preferably 5 μ m,Density is 0.71～0.78 ㎎ ㎝-2·μm-1, preferably 0.71 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of described passivating film 15 is 0.2-0.6 μ m, preferably 0.4 μm。
As another embodiment of the present invention, with reference to figure 3 and 4, described magnesium alloy materials comprises magnesium alloy baseBody 11, be attached to magnesium alloy substrate 21 nickel dam 22, be attached to nickel dam 22 copper layer 13, be attached to copperLayer 13 zinc layer 24, and be attached to the passivating film 15 of zinc layer 24.
In embodiments of the present invention, the thickness of nickel dam 22 is 1～5 μ m, preferably 3 μ m, and density is0.89～0.98㎎·㎝-2·μm-1, preferably 0.89 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of copper layer 13 is 2～8 μ m, preferably 5 μ m, and density is0.89～0.98㎎·㎝-2·μm-1, preferably 0.89 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of zinc layer 24 is 1.4-7.8 μ m, preferably 5 μ m, densityBe 0.71～0.78 ㎎ ㎝-2·μm-1, preferably 0.71 ㎎ ㎝-2·μm-1。
In embodiments of the present invention, the thickness of passivating film 15 is 0.2-0.6 μ m, preferably 0.4 μ m.
In embodiments of the present invention, the described vehicles include but not limited to automobile and track vehicle, asSubway or train.
In embodiments of the present invention, the vehicles support member of the described vehicles and/or vehicles connectorThe magnesium alloy materials adopting, has the performance that quality is light, salt fog is good, makes the vehicles lighter,Reduce in the process of moving to use consuming, corrosion-resistant in use procedure.
Fig. 5 shows the preparation method's of the magnesium alloy materials that the embodiment of the present invention provides realization flow, describes in detailAs follows:
Pre-treatment step: for removing the spot on magnesium alloy substrate 11 surfaces, smooth magnesium alloy substrate table 11Face.
In embodiments of the present invention, described spot is included in the greasy dirt attaching in process, and in processingThe oxide and the burr etc. that in process, form, carry out pretreated step to magnesium alloy and adopt prior art commonProcessing method, generally comprise degreasing, alkaline etching, edging and activation. Certainly, in other embodiments of the inventionIn, pre-treatment step can also comprise other place to go magnesium alloy substrate 11 surface blots, smooth magnesium alloy substrateThe steps such as 11 surfaces.
Heavy zinc or heavy nickel step: magnesium alloy substrate 11 is placed in to the solution that contains zinc ion or nickel ion,Described magnesium alloy substrate 11 surfaces form the heavy zinc layer of one deck or heavy nickel dam, and this heavy zinc layer or heavy nickel dam can strengthen magnesiumAdhesion between alloy substrate 11 overlay coatings and magnesium alloy substrate 11.
As one embodiment of the present of invention, in the solution that contains zinc ion, each material and mass percent thereof are dividedBe not: zinc oxide 4～6%, potassium pyrophosphate 20～28%, sodium phosphate 5～9%, other are water, adopt ammoniacal liquorThe pH value of regulator solution, PH is controlled at 6.5～11.5, preferred, is controlled at 7～9.
Implement as of the present invention another, in the solution that contains nickel ion, each material and concentration thereof are respectively:Citric acid nickel 10～40g/L, sodium dihydrogen phosphate 10～40g/L, sodium pyrophosphate 20～80g/L, ammonium fluoride10～40g/L, and adopt ammoniacal liquor to regulate PH to 9～10.
In an embodiment of the present invention, the temperature of the solution that contains zinc ion/nickel ion is controlled at 60～90 DEG C,Preferably, be controlled at 80 DEG C; Heavy zinc/heavy nickel time is controlled at 2～10min, preferred, is controlled at 5～10min.
Copper facing step: by the magnesium alloy substrate 11 through described heavy zinc or heavy nickel processing in charged situation underlyingIn copper plating solution, form the pre-copper plate of one deck at described heavy zinc layer or heavy nickel dam surface.
In embodiments of the present invention, copper plating solution comprises following material and concentration thereof: cuprous cyanide 30～60g/L,Potassium cyanide 100-180g/L, potash 10-40g/L, liquid 20-70ml/L is cut in promise.
In embodiments of the present invention, using magnesium alloy substrate 11 as negative electrode, copper coin, as anode, is applied to twoPerson's electric current is 2.5-10A/m2, be 3～30min conduction time.
Zinc-plated step: the magnesium alloy substrate 11 through described copper plating treatment is placed in zinc-plated charged in the situation thatSolution, forms one deck zinc coat on described pre-copper plate surface.
In embodiments of the present invention, galvanizing solution is by dissolved oxygen zinc in NaOH/potassium hydroxide solutionMake, wherein the concentration of NaOH/potassium hydroxide is 100～200g/L, and oxidation zinc concentration is 7～60g/L.
In embodiments of the present invention, in zinc-plated step, using magnesium alloy substrate 11 as negative electrode, zine plate/Iron plate is as anode, and the electric current that is applied to magnesium alloy substrate is 0.5～6A/dm2, be 5～60min conduction time.
As a preferred embodiment of the invention, galvanizing solution also comprises the zinc-plated complexing agent of 4～6ml/L, usesIn the uniformity and the upper plating speed that ensure coating.
In embodiments of the present invention, zinc-plated complexing agent is formed by nitride and epoxychloropropane condensation, as DEComplexing agent (being formed by epoxychloropropane and dimethylamine condensation), DPE～3 complexing agent (by dimethylaminopropylamine,Ethylenediamine and epoxychloropropane condensation form) etc. As another preferred embodiment of the present invention, galvanizing solutionAlso comprise the key light agent of 2～15ml/L, for increasing the glossiness of coating.
In embodiments of the present invention, the key light agent thiocarbamide of concentration 0.1～1% that is weight percentage.
As another preferred embodiment of the present invention, galvanizing solution also comprises 2～15ml/L additive, for increasingStrong coating density, makes the magnesium alloy substrate antirust function after electroplating stronger, and more attractive in appearance.
As one embodiment of the present of invention, the be weight percentage 3-sulfydryl of concentration 1～2.5% of additive-1,2,4-triazole.
Passivation step: the magnesium alloy substrate 11 through described zinc-plated processing is placed in to passivating solution, described zinc-platedLayer surface forms one deck passivating film 15 (chromic acid layers), to increase the decay resistance of coating.
In embodiments of the present invention, passivating solution can be the aqueous solution that comprises chromic nitrate, sodium nitrate and cobalt nitrate,Its total concentration is 20～300g/L.
In embodiments of the present invention, the time of passivation is controlled at 8～50s.
As one embodiment of the invention, be while sinking zinc step when what select in heavy zinc or heavy nickel step, shouldThe heavy zinc layer that heavy zinc step forms on magnesium alloy substrate 11 surfaces be as illustrated in fig. 1 and 2 magnesium alloy materials theOne zinc layer 12, the copper plate that copper facing step forms at this heavy zinc layer electroplating surface closes for magnesium as illustrated in fig. 1 and 2The copper layer 13 of gold copper-base alloy, the zinc coat that zinc-plated step forms at this copper plate electroplating surface is for as Fig. 1 and 2 instituteShow the second zinc layer 14 of magnesium alloy materials, the passivating film forming at this Several Thiourea Derivatives on Zinc Plate Surface in passivation step is as figureThe passivating film 15 of magnesium alloy materials shown in 1 and 2.
As another embodiment of the present invention, be while sinking nickel step when what select in heavy zinc or heavy nickel step,Heavy nickel dam that this heavy nickel step forms on magnesium alloy substrate 11 surface is magnesium alloy materials as shown in Figures 3 and 4Nickel dam 22, the copper plate that copper facing step forms at this heavy nickel dam electroplating surface is magnesium alloy as shown in Figures 3 and 4The copper layer 13 of material, the zinc coat forming at this degree copper layer electroplating surface in zinc-plated step is for as Fig. 3 and 4Show the zinc layer 24 of magnesium alloy materials, the passivating film forming at this Several Thiourea Derivatives on Zinc Plate Surface in passivation step be as Fig. 3 withThe passivating film 15 of magnesium alloy materials shown in 4.
Further illustrate below by embodiment the embodiment of the present invention surface treatment method of Mg alloy process andEffect.
Embodiment 5:
The preparation of zinc ion solution: take respectively 4g zinc oxide, 20g potassium pyrophosphate and 5g sodium phosphate, addWater is dissolved as the aqueous solution of 100g, adopts ammoniacal liquor to regulate pH to 6.5, makes zinc ion solution.
The preparation of copper plating solution: take respectively cuprous cyanide 30g, potassium cyanide 180g, potash 10g, promiseCut liquid (NEOCHEL of Dongguan City, Guangdong Province An Hao industrial chemicals Co., Ltd) 70ml, be dissolved in 1LIn water, make copper plating solution.
The preparation of galvanizing solution: take the zinc oxide of 100g potassium hydroxide, 7g, both mix, furnishing is stuck with pasteShape; In said mixture, add zinc-plated complexing agent (Atotech (China) P3000 of Chemical Co., Ltd. of 4mlSeries is opened cylinder agent) and 3-sulfydryl-1 of 15g, 2,4-triazole (percentage by weight is 2.5%), is diluted with water to1L, makes galvanizing solution.
The zinc ion solution configuring is housed in electroplating bath; Will be through pretreated magnesium alloy substrate 11Be placed in the zinc ion solution 10min that is heated to 60 DEG C, take out, washing.
The copper plating solution preparing is housed in electroplating bath; By the magnesium alloy substrate through above-mentioned heavy zinc processing11 as negative electrode, and copper coin is as anode, and to both energisings, electrical current is 2.5A/dm2, energising 30minRear taking-up, washing.
The galvanizing solution preparing is housed in electroplating bath; By the magnesium alloy base through above-mentioned pre-copper plating treatmentBody 11 is as negative electrode, and zine plate/iron plate is as anode, and to both energisings, electrical current is 6A/dm2, energisingAfter 5min, take out, wash.
To be placed in passivating solution (the chemical limited public affairs of Atotech (China) through zinc-plated magnesium alloy substrate 11 after treatmentThe blue zinc passivating solution of the high-performance HC2 that department produces) in, passivation 50s, constantly stirs during this time, then take out,Wash, dry, obtain surface treated magnesium alloy materials.
To carry out salt fog performance test, resistive performance test by said method magnesium alloy substrate 11 after treatmentWith adhesion performance test. Table 1 shows test result.
Embodiment 6:
The preparation of nickel ion solution: take respectively 10g citric acid nickel, 10g sodium dihydrogen phosphate, 20g pyrophosphoric acidSodium and 10g ammonium fluoride, be dissolved in water to 1L, adopts ammoniacal liquor to regulate pH to 9, makes nickel ion solution.
The preparation of copper plating solution: take respectively cuprous cyanide 32g, potassium cyanide 165g, potash 12g, promiseCut liquid (NEOCHEL of Dongguan City, Guangdong Province An Hao industrial chemicals Co., Ltd) 60ml, be dissolved in 1LIn water, make copper plating solution.
The preparation of galvanizing solution: take the zinc oxide of 120g potassium hydroxide, 15g, both mix, furnishing is stuck with pasteShape; In said mixture, add zinc-plated complexing agent (Atotech (China) P3000 of Chemical Co., Ltd. of 5mlSeries is opened cylinder agent) and 3-sulfydryl-1 of 12g, 2,4-triazole (percentage by weight is 2.0%), is diluted with water to1L, makes galvanizing solution.
The nickel ion solution configuring is housed in electroplating bath; Will be through pretreated magnesium alloy substrate 11Be placed in the nickel ion solution 9min that is heated to 65 DEG C, take out, washing.
The copper plating solution preparing is housed in electroplating bath; By the magnesium alloy substrate through above-mentioned heavy nickel processing11 as negative electrode, and copper coin is as anode, and to both energisings, electrical current is 3.5A/dm2, energising 26minRear taking-up, washing.
The galvanizing solution preparing is housed in electroplating bath; By the magnesium alloy base through above-mentioned pre-copper plating treatmentBody 11 is as negative electrode, and zine plate/iron plate is as anode, and to both energisings, electrical current is 5.5A/dm2, logicalAfter electricity 15min, take out, wash.
To be placed in passivating solution (the chemical limited public affairs of Atotech (China) through zinc-plated magnesium alloy substrate 11 after treatmentThe blue zinc passivating solution of the high-performance HC2 that department produces) in, passivation 45s, constantly stirs during this time, then take out,Wash, dry, obtain surface treated magnesium alloy materials.
To carry out salt fog performance test, resistive performance test by said method magnesium alloy substrate 11 after treatmentWith adhesion performance test. Table 1 shows test result.
Embodiment 7:
The preparation of zinc ion solution: take respectively 4.5g zinc oxide, 22g potassium pyrophosphate and 6g sodium phosphate, addWater is dissolved as the aqueous solution of 100g, adopts ammoniacal liquor to regulate pH to 11, makes zinc ion solution.
The preparation of copper plating solution: take respectively cuprous cyanide 35g, potassium cyanide 150g, potash 15g, promiseCut liquid (NEOCHEL of Dongguan City, Guangdong Province An Hao industrial chemicals Co., Ltd) 50ml, be dissolved in 1LIn water, make copper plating solution.
The preparation of galvanizing solution: take the zinc oxide of 140g potassium hydroxide, 20g, both mix, furnishing is stuck with pasteShape; In said mixture, add zinc-plated complexing agent (Atotech (China) P3000 of Chemical Co., Ltd. of 6mlSeries is opened cylinder agent), the thiocarbamide (percentage by weight is 0.8%) of 5g and 3-sulfydryl-1 of 10g, 2,4-triazole is (heavyAmount percentage is 1.5%), be diluted with water to 1L, make galvanizing solution.
The zinc ion solution configuring is housed in electroplating bath; Will be through pretreated magnesium alloy substrate 11Be placed in the zinc ion solution 8min that is heated to 70 DEG C, take out, washing.
The copper plating solution preparing is housed in electroplating bath; By the magnesium alloy substrate through above-mentioned heavy zinc processing11 as negative electrode, and copper coin is as anode, and to both energisings, electrical current is 4.5A/dm2, energising 22minRear taking-up, washing.
The galvanizing solution preparing is housed in electroplating bath; By the magnesium alloy base through above-mentioned pre-copper plating treatmentBody 11 is as negative electrode, and zine plate/iron plate is as anode, and to both energisings, electrical current is 5A/dm2, energisingAfter 25min, take out, wash.
To be placed in passivating solution (the chemical limited public affairs of Atotech (China) through zinc-plated magnesium alloy substrate 11 after treatmentThe blue zinc passivating solution of the high-performance HC2 that department produces) in, passivation 40s, constantly stirs during this time, then take out,Wash, dry, obtain surface treated magnesium alloy materials.
To carry out salt fog performance test, resistive performance test by said method magnesium alloy substrate 11 after treatmentWith adhesion performance test. Table 1 shows test result.
Embodiment 8:
The preparation of nickel ion solution: take respectively 20g citric acid nickel, 20g sodium dihydrogen phosphate, 40g pyrophosphoric acidSodium and 20g ammonium fluoride, be dissolved in water to 1L, adopts ammoniacal liquor to regulate pH to 9.3, makes nickel ion solution.
The preparation of copper plating solution: take respectively cuprous cyanide 40g, potassium cyanide 140g, potash 20g, promiseCut liquid (as the NEOCHEL of Dongguan City, Guangdong Province An Hao industrial chemicals Co., Ltd) 40ml, be dissolved in 1LIn water, make copper plating solution.
The preparation of galvanizing solution: take the zinc oxide of 150g potassium hydroxide, 25g, both mix, furnishing is stuck with pasteShape; In said mixture, add zinc-plated complexing agent (Atotech (China) P3000 of Chemical Co., Ltd. of 4mlSeries is opened cylinder agent), the thiocarbamide (percentage by weight is 0.1%) of 8g and 3-sulfydryl-1 of 8g, 2,4-triazole is (heavyAmount percentage is 1%), be diluted with water to 1L, make galvanizing solution.
The nickel ion solution configuring is housed in electroplating bath; Will be through pretreated magnesium alloy substrate 11Be placed in the nickel ion solution 6min that is heated to 75 DEG C, take out, washing.
The copper plating solution preparing is housed in electroplating bath; By the magnesium alloy substrate through above-mentioned heavy nickel processing21 as negative electrode, and copper coin is as anode, and to both energisings, electrical current is 5.5A/dm2, energising 18minRear taking-up, washing.
The galvanizing solution preparing is housed in electroplating bath; By the magnesium alloy substrate 11 through pre-copper plating treatmentAs negative electrode, zine plate/iron plate is as anode, and to both energisings, electrical current is 4.5A/dm2, energising 35minRear taking-up, washing.
To be placed in passivating solution (the chemical limited public affairs of Atotech (China) through zinc-plated magnesium alloy substrate 11 after treatmentThe blue zinc passivating solution of the high-performance HC2 that department produces) in, passivation 35s, constantly stirs during this time, then take out,Wash, dry, obtain surface treated magnesium alloy materials.
To carry out salt fog performance test, resistive performance test by said method magnesium alloy substrate 11 after treatmentWith adhesion performance test. Table 1 shows test result.
Embodiment 9:
The preparation of zinc ion solution: take respectively 5g zinc oxide, 25g potassium pyrophosphate and 7g sodium phosphate, addWater is dissolved as the aqueous solution of 100g, adopts ammoniacal liquor to regulate pH to 7.5, makes zinc ion solution.
The preparation of copper plating solution: take respectively cuprous cyanide 45g, potassium cyanide 130g, potash 25g, promiseCut liquid (as the NEOCHEL of Dongguan City, Guangdong Province An Hao industrial chemicals Co., Ltd) 30ml, be dissolved in 1LIn water, make copper plating solution.
The preparation of galvanizing solution: take the zinc oxide of 160g potassium hydroxide, 35g, both mix, furnishing is stuck with pasteShape; In said mixture, add zinc-plated complexing agent (Atotech (China) P3000 of Chemical Co., Ltd. of 5mlSeries is opened cylinder agent), the thiocarbamide (percentage by weight is 0.3%) of 10g and 3-sulfydryl-1 of 5g, 2,4-triazole(percentage by weight is 2%),, be diluted with water to 1L, make galvanizing solution.
The zinc ion solution configuring is housed in electroplating bath; Will be through pretreated magnesium alloy substrate 11Be placed in the zinc ion solution 5min that is heated to 78 DEG C, take out, washing.
The copper plating solution preparing is housed in electroplating bath; By the magnesium alloy substrate through above-mentioned heavy zinc processing11 as negative electrode, and copper coin is as anode, and to both energisings, electrical current is 6.5A/dm2, energising 12minRear taking-up, washing.
The galvanizing solution preparing is housed in electroplating bath; By the magnesium alloy substrate 11 through copper plating treatmentAs negative electrode, zine plate/iron plate is as anode, and to both energisings, electrical current is 4A/dm2, energising 40minRear taking-up, washing.
To be placed in passivating solution (the chemical limited public affairs of Atotech (China) through zinc-plated magnesium alloy substrate 11 after treatmentThe blue zinc passivating solution of the high-performance HC2 that department produces) in, passivation 30s, constantly stirs during this time, then take out,Wash, dry, obtain surface treated magnesium alloy materials.
To carry out salt fog performance test, resistive performance test by said method magnesium alloy substrate 11 after treatmentWith adhesion performance test. Table 1 shows test result.
Embodiment 10:
The preparation of nickel ion solution: take respectively 30g citric acid nickel, 30g sodium dihydrogen phosphate, 60g pyrophosphoric acidSodium and 30g ammonium fluoride, be dissolved in water to 1L, adopts ammoniacal liquor to regulate pH to 9.6, makes nickel ion solution.
The preparation of copper plating solution: take respectively cuprous cyanide 50g, potassium cyanide 120g, potash 30g, promiseCut liquid (as the NEOCHEL of Dongguan City, Guangdong Province An Hao industrial chemicals Co., Ltd) 20ml, be dissolved in 1LIn water, make copper plating solution.
The preparation of galvanizing solution: take the zinc oxide of 170g potassium hydroxide, 45g, both mix, furnishing is stuck with pasteShape; In said mixture, add zinc-plated complexing agent (Atotech (China) P3000 of Chemical Co., Ltd. of 6mlSeries is opened cylinder agent), be diluted with water to 1L, make galvanizing solution.
The nickel ion solution configuring is housed in electroplating bath; To be placed in through pretreated magnesium alloy substrateWill be heated to 4min in the nickel ion solution of 80 DEG C, take out, washing.
The copper plating solution preparing is housed in electroplating bath; By the magnesium alloy substrate through above-mentioned heavy nickel processing11 as negative electrode, and copper coin is as anode, and to both energisings, electrical current is 7.5A/dm2, energising 8minRear taking-up, washing.
The galvanizing solution preparing is housed in electroplating bath; By the magnesium alloy substrate through above-mentioned copper plating treatment11 as negative electrode, and zine plate/iron plate is as anode, and to both energisings, electrical current is 3A/dm2, energising 45minRear taking-up, washing.
To be placed in passivating solution (the chemical limited public affairs of Atotech (China) through zinc-plated magnesium alloy substrate 11 after treatmentThe blue zinc passivating solution of the high-performance HC2 that department produces) in, passivation 25s, constantly stirs during this time, then take out,Wash, dry, obtain surface treated magnesium alloy materials.
To carry out salt fog performance test, resistive performance test by said method magnesium alloy substrate 11 after treatmentWith adhesion performance test. Table 1 shows test result.
Embodiment 11:
The preparation of zinc ion solution: take respectively 6g zinc oxide, 28g potassium pyrophosphate and 9g sodium phosphate, addWater is dissolved as the aqueous solution of 100g, adopts ammoniacal liquor to regulate pH to 9, makes zinc ion solution.
The preparation of copper plating solution: take respectively cuprous cyanide 55g, potassium cyanide 110g, potash 35g, promiseCut liquid (as the NEOCHEL of Dongguan City, Guangdong Province An Hao industrial chemicals Co., Ltd) 55ml, be dissolved in 1LIn water, make copper plating solution.
The preparation of galvanizing solution: take the zinc oxide of 180g potassium hydroxide, 55g, both mix, furnishing is stuck with pasteShape; In said mixture, add zinc-plated complexing agent (Atotech (China) Chemical Co., Ltd. of 5.5mlP3000 series is opened cylinder agent), the thiocarbamide (percentage by weight is 0.8%) of 12g and 3-sulfydryl-1 of 2g, 2,4-Triazole (percentage by weight is 2.2%), is diluted with water to 1L, makes galvanizing solution.
The zinc ion solution configuring is housed in electroplating bath; Will be through pretreated magnesium alloy substrate 11Be placed in the zinc ion solution 3min that is heated to 85 DEG C, take out, washing.
The copper plating solution preparing is housed in electroplating bath; By the magnesium alloy substrate through above-mentioned heavy zinc processing11 as negative electrode, and copper coin is as anode, and to both energisings, electrical current is 8.5A/dm2, energising 5minRear taking-up, washing.
The galvanizing solution preparing is housed in electroplating bath; By the magnesium alloy substrate 11 through copper plating treatmentAs negative electrode, zine plate/iron plate is as anode, and to both energisings, electrical current is 2A/dm2, energising 50minRear taking-up, washing.
To be placed in passivating solution (the chemical limited public affairs of Atotech (China) through zinc-plated magnesium alloy substrate 11 after treatmentThe blue zinc passivating solution of the high-performance HC2 that department produces) in, passivation 15s, constantly stirs during this time, then take out,Wash, dry, obtain surface treated magnesium alloy materials.
To carry out salt fog performance test, resistive performance test by said method magnesium alloy substrate 11 after treatmentWith adhesion performance test. Table 1 shows test result.
Embodiment 12:
The preparation of nickel ion solution: take respectively 40g citric acid nickel, 40g sodium dihydrogen phosphate, 80g pyrophosphoric acidSodium and 40g ammonium fluoride, be dissolved in water to 1L, adopts ammoniacal liquor to regulate pH to 10, makes nickel ion solution.
The preparation of copper plating solution: take respectively cuprous cyanide 60g, potassium cyanide 100g, potash 40g, promiseCut liquid (as the NEOCHEL of Dongguan City, Guangdong Province An Hao industrial chemicals Co., Ltd) 25ml, be dissolved in 1LIn water, make copper plating solution.
The preparation of galvanizing solution: take the zinc oxide of 200g potassium hydroxide, 60g, both mix, furnishing is stuck with pasteShape; In said mixture, add zinc-plated complexing agent (Atotech (China) Chemical Co., Ltd. of 4.5mlP3000 series is opened cylinder agent) and the thiocarbamide (percentage by weight is 1.2%) of 5g, be diluted with water to 1L, systemObtain galvanizing solution.
The nickel ion solution configuring is housed in electroplating bath; Will be through pretreated magnesium alloy substrate 11Be placed in the nickel ion solution 2min that is heated to 90 DEG C, take out, washing.
The copper plating solution preparing is housed in electroplating bath; To process 11 magnesium alloy base through above-mentioned heavy nickelBody is as negative electrode, and copper coin is as anode, and to both energisings, electrical current is 10A/dm2, after energising 3minTake out, wash.
The galvanizing solution preparing is housed in electroplating bath; By the magnesium alloy substrate 11 through copper plating treatmentAs negative electrode, zine plate/iron plate is as anode, and to both energisings, electrical current is 0.5A/dm2, energising 60minRear taking-up, washing.
To be placed in passivating solution (the chemical limited public affairs of Atotech (China) through zinc-plated magnesium alloy substrate 11 after treatmentThe blue zinc passivating solution of the high-performance HC2 that department produces) in, passivation 8s, constantly stirs during this time, then taking-up, waterWash, dry, obtain surface treated magnesium alloy materials.
To carry out salt fog performance test, resistive performance test by said method magnesium alloy substrate 11 after treatmentWith adhesion performance test. Table 1 shows test result.
Table 1:
In conjunction with the salt fog performance of the magnesium alloy materials of each embodiment in upper table, resistive performance and adhesion performance canTo find out, surface treatment method of Mg alloy magnesium alloy substrate 11 its salt after treatment that the embodiment of the present invention providesMist performance at least can reach 96h, the resistance before salt fog performance test all below 0.6m Ω, salt fog performanceResistance after test is all in the following performance of 0.8m Ω, and after adhesion performance test, magnesium alloy substrate 11 is shownFace is the phenomenon that occurs that coating comes off. The corrosion resistance of the magnesium alloy materials that the visible embodiment of the present invention providesCan be good, resistance is little, and binding force of cladding material is strong.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, not all at thisAny amendment of doing within bright spirit and principle, be equal to and replace and improvement etc., all should be included in the present inventionProtection domain within.
Claims (24)
1. a magnesium alloy materials, is characterized in that, described magnesium alloy materials comprises:
Magnesium alloy substrate;
The first zinc layer, is attached to described magnesium alloy substrate;
Copper layer, is attached to described the first zinc layer;
The second zinc layer, is attached to described copper layer;
Passivating film, is attached to described the second zinc layer.
2. magnesium alloy materials as claimed in claim 1, is characterized in that, the thickness of described the first zinc layer is0.5～5 μ m, density is 0.71～0.78mgcm-2·μm-1。
3. magnesium alloy materials as claimed in claim 1, is characterized in that, the thickness of described copper layer is 2～8μ m, density is 0.89～0.98mgcm-2·μm-1。
4. magnesium alloy materials as claimed in claim 1, is characterized in that, the thickness of described the second zinc layer is1.4～7.8 μ m, density is 0.71～0.78mgcm-2·μm-1。
5. magnesium alloy materials as claimed in claim 1, is characterized in that, the thickness of described passivating film is0.2-0.6μm。
6. a magnesium alloy materials, is characterized in that, described magnesium alloy materials comprises:
Magnesium alloy substrate;
Nickel dam, is attached to described magnesium alloy substrate;
Copper layer, is attached to described nickel dam;
Zinc layer, is attached to described copper layer;
Passivating film, is attached to described zinc layer.
7. magnesium alloy materials as claimed in claim 6, is characterized in that, the thickness of described nickel dam is 1～5μ m, density is 0.89～0.98mgcm-2·μm-1。
8. magnesium alloy materials as claimed in claim 6, is characterized in that, the thickness of described copper layer is 2～8μ m, density is 0.89～0.98mgcm-2·μm-1。
9. magnesium alloy materials as claimed in claim 6, is characterized in that, the thickness of described zinc layer is 1.4～7.8μ m, density is 0.71～0.78mgcm-2·μm-1。
10. magnesium alloy materials as claimed in claim 1, is characterized in that, the thickness of described passivating film is0.2-0.6μm。
11. 1 kinds of mobile terminals, include termination support and/or terminal connector, it is characterized in that instituteState termination support and/or terminal connector in whole or in part by the magnesium alloy as described in claim 1 or 6Material is made.
12. mobile terminals as claimed in claim 11, is characterized in that, described mobile terminal is mobile electricityWords, personal computer or personal digital assistant.
13. 1 kinds of communication apparatus, comprise equipment support members and/or equipment connection part, it is characterized in that, described inEquipment support members and/or equipment connection part are in whole or in part by the magnesium alloy material as described in claim 1 or 6Material is made.
14. communication apparatus as claimed in claim 13, is characterized in that, described communication apparatus be base station,Modem or communication transmitter.
15. 1 kinds of vehicles, comprise vehicles support member and/or vehicles connector, and its feature existsIn, described vehicles support member and/or vehicles connector are closed by the magnesium as described in claim 1 or 6Gold copper-base alloy is made.
16. vehicles as claimed in claim 15, is characterized in that, the described vehicles be automobile orTrack vehicle.
17. 1 kinds of surface treatment method of Mg alloy, is characterized in that, said method comprising the steps of:
Heavy zinc or heavy nickel step: magnesium alloy substrate is placed in to the solution that contains zinc ion or nickel ion, in instituteState magnesium alloy matrix surface and form the heavy zinc layer of one deck or heavy nickel dam;
Copper facing step: will be placed in charged in the situation that through the magnesium alloy substrate of described heavy zinc or heavy nickel processingIn copper plating solution, form the pre-copper plate of one deck at described heavy zinc layer or heavy nickel dam surface;
Zinc-plated step: the magnesium alloy substrate through described copper plating treatment is placed in zinc-plated molten charged in the situation thatLiquid, forms one deck zinc coat on described pre-copper plate surface;
Passivation step: the magnesium alloy substrate through described zinc-plated processing is placed in to passivating solution, at described zinc coatSurface forms one deck passivating film.
18. methods as claimed in claim 17, is characterized in that, described in contain zinc ion solution in eachMaterial and mass percent thereof are respectively: zinc oxide 4～6%, and potassium pyrophosphate 20～28%, sodium phosphate 5～9%,Other are water, pH value to 6.5～11.5 of regulator solution.
19. methods as claimed in claim 17, is characterized in that, described in contain nickel ion solution in eachMaterial and concentration thereof are respectively: citric acid nickel 10～40g/L, sodium dihydrogen phosphate 10～40g/L, sodium pyrophosphate20～80g/L, ammonium fluoride 10～40g/L, pH value to 9～10 of regulator solution.
20. methods as claimed in claim 17, is characterized in that, in described heavy zinc or heavy nickel step,The temperature of the described solution that contains zinc ion or nickel ion is controlled at 60～90 DEG C, and heavy zinc or heavy nickel time are controlledAt 2～10min.
21. methods as claimed in claim 17, is characterized in that, described copper plating solution comprises following materialAnd concentration: cuprous cyanide 30～60g/L, potassium cyanide 100-180g/L, potash 10-40g/L, liquid is cut in promise20-70ml/L。
22. methods as claimed in claim 17, is characterized in that, in copper facing step, apply magnesium alloyThe electric current of matrix is 2.5-10A/m2, be 3～30min conduction time.
23. methods as claimed in claim 17, is characterized in that, described galvanizing solution comprises following materialAnd concentration: NaOH/potassium hydroxide 100-200g/L, zinc oxide 7-60g/L.
24. methods as claimed in claim 17, is characterized in that, in described zinc-plated step, are applied toThe electric current of magnesium alloy substrate is 0.5-6A/dm2, be 5～60 minutes conduction time.
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| US10638628B2 (en) | 2017-08-30 | 2020-04-28 | Samsung Electronics Co., Ltd. | Network communication device enclosure made of different materials |
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| JPH02254179A (en) * | 1989-03-27 | 1990-10-12 | Mitsubishi Electric Corp | Formation of plating film on magnesium alloy |
| US6068938A (en) * | 1997-04-15 | 2000-05-30 | Kabushiki Kaisha Kobe Seiko Sho | Magnesium based alloys article and a method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH02254179A (en) * | 1989-03-27 | 1990-10-12 | Mitsubishi Electric Corp | Formation of plating film on magnesium alloy |
| US6068938A (en) * | 1997-04-15 | 2000-05-30 | Kabushiki Kaisha Kobe Seiko Sho | Magnesium based alloys article and a method thereof |
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| US10638628B2 (en) | 2017-08-30 | 2020-04-28 | Samsung Electronics Co., Ltd. | Network communication device enclosure made of different materials |
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