JPH0225271Y2 - - Google Patents

Info

Publication number

JPH0225271Y2

JPH0225271Y2 JP6925584U JP6925584U JPH0225271Y2 JP H0225271 Y2 JPH0225271 Y2 JP H0225271Y2 JP 6925584 U JP6925584 U JP 6925584U JP 6925584 U JP6925584 U JP 6925584U JP H0225271 Y2 JPH0225271 Y2 JP H0225271Y2

Authority

JP

Japan

Prior art keywords

lid

circuit board

printed circuit

back lid

bottom lid

Prior art date

1984-05-11

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

• 210000002105 tongue Anatomy 0.000 description 7
• XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
• 238000005452 bending Methods 0.000 description 3
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• 239000011889 copper foil Substances 0.000 description 2
• 230000037431 insertion Effects 0.000 description 2
• 238000003780 insertion Methods 0.000 description 2
• 229910052742 iron Inorganic materials 0.000 description 2
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
• 230000003014 reinforcing effect Effects 0.000 description 2
• 238000005476 soldering Methods 0.000 description 2
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
• 229910052782 aluminium Inorganic materials 0.000 description 1
• 238000005336 cracking Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1