JPH02249242A - チツプボンデイングの位置合せ方法 - Google Patents

チツプボンデイングの位置合せ方法

Info

Publication number
JPH02249242A
JPH02249242A JP26044988A JP26044988A JPH02249242A JP H02249242 A JPH02249242 A JP H02249242A JP 26044988 A JP26044988 A JP 26044988A JP 26044988 A JP26044988 A JP 26044988A JP H02249242 A JPH02249242 A JP H02249242A
Authority
JP
Japan
Prior art keywords
chip
substrate
board
positioning table
bonding tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26044988A
Other languages
English (en)
Japanese (ja)
Other versions
JPH039621B2 (enrdf_load_stackoverflow
Inventor
Noboru Fujino
昇 藤野
Seiichi Chiba
誠一 千葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP26044988A priority Critical patent/JPH02249242A/ja
Publication of JPH02249242A publication Critical patent/JPH02249242A/ja
Publication of JPH039621B2 publication Critical patent/JPH039621B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP26044988A 1988-10-18 1988-10-18 チツプボンデイングの位置合せ方法 Granted JPH02249242A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26044988A JPH02249242A (ja) 1988-10-18 1988-10-18 チツプボンデイングの位置合せ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26044988A JPH02249242A (ja) 1988-10-18 1988-10-18 チツプボンデイングの位置合せ方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP3161981A Division JPS57147245A (en) 1981-03-05 1981-03-05 Positioning method and device for chip bonding

Publications (2)

Publication Number Publication Date
JPH02249242A true JPH02249242A (ja) 1990-10-05
JPH039621B2 JPH039621B2 (enrdf_load_stackoverflow) 1991-02-08

Family

ID=17348093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26044988A Granted JPH02249242A (ja) 1988-10-18 1988-10-18 チツプボンデイングの位置合せ方法

Country Status (1)

Country Link
JP (1) JPH02249242A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH077028A (ja) * 1993-06-16 1995-01-10 Shibuya Kogyo Co Ltd 半導体位置合せ方法
JP2007173801A (ja) * 2005-12-22 2007-07-05 Unaxis Internatl Trading Ltd フリップチップを基板に取り付ける方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH077028A (ja) * 1993-06-16 1995-01-10 Shibuya Kogyo Co Ltd 半導体位置合せ方法
JP2007173801A (ja) * 2005-12-22 2007-07-05 Unaxis Internatl Trading Ltd フリップチップを基板に取り付ける方法

Also Published As

Publication number Publication date
JPH039621B2 (enrdf_load_stackoverflow) 1991-02-08

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