JPH02248219A - Vacuum molding method - Google Patents
Vacuum molding methodInfo
- Publication number
- JPH02248219A JPH02248219A JP6955189A JP6955189A JPH02248219A JP H02248219 A JPH02248219 A JP H02248219A JP 6955189 A JP6955189 A JP 6955189A JP 6955189 A JP6955189 A JP 6955189A JP H02248219 A JPH02248219 A JP H02248219A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- mold
- space
- molding
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 11
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 58
- 239000011347 resin Substances 0.000 claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000003566 sealing material Substances 0.000 claims abstract description 10
- 238000007666 vacuum forming Methods 0.000 claims description 9
- 238000012856 packing Methods 0.000 claims description 8
- 238000004891 communication Methods 0.000 abstract description 6
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は例えばリード線を有する電動機の固定子を熱
硬化性樹脂でモールド成形するようにした真空成形方法
に閏するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a vacuum forming method in which, for example, a stator of an electric motor having lead wires is molded with a thermosetting resin.
従来の真空成形方法は例えば時開６１−２２０８１４号
公報に示されるように、上型と下型を合わぜて被成形体
を挿入するモールド空間の周囲にシール材を配置し、樹
脂注入１］と同一方向から上型と下をの合わせ目に設け
た樹脂通路より上記モールド空間を真空にした後、」１
記上型と下型に注入［−１を密着させて熱硬化性の樹脂
を圧送して成形するようにしている。In the conventional vacuum forming method, for example, as shown in Jikai No. 61-220814, an upper mold and a lower mold are combined, a sealing material is placed around the mold space into which the object to be molded is inserted, and resin injection 1] After evacuating the mold space from the same direction as the resin passage provided at the joint between the upper mold and the lower mold,
Molding is carried out by bringing the injection mold [-1] into close contact with the upper mold and the lower mold, and then pumping the thermosetting resin.
上記のように構成された真空成形方法では、リード線を
有する電動材の固定子を成形する場合、リード線が邪魔
になり成形作業が悪く、また、リード線出口部からのモ
ールド樹脂の食み出し、さらに、真空引きが複雑になる
等の課題があった。In the vacuum forming method configured as described above, when molding a stator of an electric material having lead wires, the lead wires get in the way, making the molding work difficult, and the mold resin eats up from the lead wire outlet. In addition, there were problems such as the difficulty of evacuation.
この発明は係る課題を解決するためになされたもので、
成形時リード線が邪魔にならず、またリード線出口部の
処理が良好となり、さらに真空引きが単純化できる真空
成形方法を得ることを目的とするものである。This invention was made to solve the problem,
The object of the present invention is to provide a vacuum forming method in which the lead wire does not get in the way during molding, the lead wire exit portion can be treated well, and vacuuming can be simplified.
この発明に係る真空成形方法は、上型と下型とを合わせ
て被成形体を挿入するモールド空間とこのモールド空間
に連通し上記被成形体のリード線を収納するリード線収
納空間の周囲にシール材を配設し、上記モールド空間を
上記リード線収納空間を介して真空にした後、モールド
樹脂を注入し成形するようにしたものである。The vacuum forming method according to the present invention includes a mold space in which an upper mold and a lower mold are combined and a molded object is inserted thereinto, and a lead wire storage space communicating with this mold space and storing lead wires of the molded object. After a sealing material is provided and the mold space is evacuated via the lead wire storage space, molding resin is injected and molded.
また、上型と下型とを合わせてリード線を有する被成形
体を挿入するモールド空間の周囲にシール材を配設し、
上記モールド空間を真空にした後、モールド樹脂を注入
し成形するようにしたものにおいて、下型に上記リード
線が収納されるリード線収納空間を設けたものである。In addition, a sealing material is arranged around the mold space in which the upper mold and the lower mold are combined and a molded object having a lead wire is inserted.
After the mold space is evacuated, molding resin is injected and molded, and the lower mold is provided with a lead wire storage space in which the lead wires are stored.
また、被成形体のリード線出口部の上型と下型にリード
線を挾むように弾性を有するパツキンを設けたものであ
る。In addition, elastic packing is provided on the upper and lower molds at the lead wire exit portion of the molded object so as to sandwich the lead wire therebetween.
この発明においては、リード線を収納するリード線収納
空間をモールド空間に連通して設け、空間をリード線収
納空間を介して真空にした後、モールド樹脂を注入し成
形するようにしているから、真空引き通路が一本で済み
、また、モールド樹脂の流れも良好になる。In this invention, the lead wire storage space for storing the lead wires is provided in communication with the mold space, and after the space is evacuated through the lead wire storage space, molding resin is injected and molded. Only one vacuum passage is required, and the flow of mold resin is also improved.
また、下型にリード線を収納するリード線収納空間が設
けられているため、成形時のリード線処理が良く邪魔に
ならず作業性が良好になる。In addition, since the lower mold is provided with a lead wire storage space for storing the lead wires, the lead wires can be easily handled during molding without getting in the way, resulting in good workability.
また、被成形体のリード線出口部の上型と下型にリード
線を挾むように弾性を有するパツキンが設けられている
から、リード線の周囲からモールド樹脂が食み出すこと
がない。Further, since elastic packing is provided between the upper mold and the lower mold at the lead wire exit portion of the molded object so as to sandwich the lead wire, the mold resin does not protrude from around the lead wire.
第１図〜第５図はこの発明の一実施例を示す図で、図に
おいて（１）は上型（２）と下型（３）とから成る成形
金型、（４）は上記上型（２と下型（３）とにより形成
されるモールド空間で、この空間内にはプリント基板（
５）を介してリード線（６）と接続した巻線（図示せず
）を有する電動機の固定子（７）等の被成形体（へ）が
挿入され上記下型（３）上に載置される。（９）は上記
下型（３）に凹部を設は上記上型（２）とにより形成さ
れるリード線収納空間、叫はこのリード線収納空間と上
記モールド空間（２）を連通させリード線（６）が挿通
する連通空間で、リード線出口部（１１）にはリード線
（６）を上下から挾むよう上型■と下型１３）に弾性を
有するシリコンゴムから成るパツキン（１２）が設けら
れている。 （１３）は上記リード線収納空間（９）と
真空装置（図示せず）を連通させるよう下型に設けられ
た貫通孔、（＋４） ＜１５）は上記モールド空間川内
にエポキシ樹脂等の熱硬化性樹脂であるモールド樹脂を
注入するためのゲートおよびランナ、（１６）は上記モ
ールド空間（イ）、上記リード線収納空間（９）、ゲー
ト（１４）およびランナ（１５）の周囲の上記下型に設
けられた凹部、（１６）はこの凹部に嵌入され凹部上面
より突出する断面円状のシール材で、シリコンゴム等の
弾性材で形成されている。 （１８）はエジェクタピン
で、下型（３）との間にはＯリング（１９）が介在され
ている。Figures 1 to 5 are diagrams showing an embodiment of the present invention, in which (1) is a molding die consisting of an upper mold (2) and a lower mold (3), and (4) is the upper mold. (2) and the lower mold (3). Inside this space, there is a printed circuit board (
5) A molded object such as a stator (7) of an electric motor having a winding (not shown) connected to a lead wire (6) is inserted and placed on the lower mold (3). be done. (9) is a lead wire storage space formed by forming a recess in the lower mold (3) and the upper mold (2); (6) is inserted into the communication space, and the lead wire outlet part (11) has a packing (12) made of elastic silicone rubber on the upper mold (■) and the lower mold (13) so as to sandwich the lead wire (6) from above and below. It is provided. (13) is a through hole provided in the lower mold to communicate the lead wire storage space (9) with a vacuum device (not shown), and (+4) <15) is a through hole provided in the lower mold to communicate the lead wire storage space (9) with a vacuum device (not shown). A gate and a runner (16) for injecting the mold resin, which is a curable resin, are located below the mold space (A), the lead wire storage space (9), the gate (14), and the runner (15). A recess (16) provided in the mold is a sealing material having a circular cross section that is fitted into the recess and protrudes from the upper surface of the recess, and is made of an elastic material such as silicone rubber. (18) is an ejector pin, and an O-ring (19) is interposed between it and the lower die (3).
上記のように構成された成形金型における真空成形方法
は、上型（２）と下型（３）を加熱し、開いた状態で被
成形体（８を下型（３）に載置するとともに、リード線
（６）を連通空間叫からリード線収納空間（９）内に収
納し、」−型（２）と下型（３）を型締めする。このと
き、リード線出口部（１１）は第５図のようにはパツキ
ン（１２）の変形により隙間がないように挟まれるとと
もに、上型（２）と下型（３）との間のシール材（１７
）も変形して隙間がなくなる０次に、真空装置（図示せ
ず）により貫通孔（１３）、リード線収納空間（９）お
よび連通空間叫を介してモールド空間Ｇ７４）内を真空
にし、モールド樹脂をランナ（１５）からゲート（１４
）を介して圧送し、被成形体（へ）を成形する。リード
線出口部（１１）からリード線収納空間（９）に食み出
ようとするモールド樹脂は、パツキン（１２）により止
められ食み出ることがない、こうして所定時間経過後上
型（２）と下型（３）を開いて、被成形体を取り出す。The vacuum forming method using the molding die configured as described above heats the upper mold (2) and the lower mold (3), and places the molded object (8) on the lower mold (3) in an open state. At the same time, the lead wire (6) is stored in the lead wire storage space (9) from the communication space, and the mold (2) and the lower mold (3) are clamped. At this time, the lead wire outlet part (11 ) are sandwiched without any gaps due to the deformation of the packing (12) as shown in Figure 5, and the sealing material (17) between the upper mold (2) and the lower mold (3)
) is also deformed to eliminate the gap.Next, a vacuum device (not shown) is used to evacuate the inside of the mold space G74) via the through hole (13), lead wire storage space (9), and communication space (G74), and the mold is removed. The resin is transferred from the runner (15) to the gate (14).
) to form a molded object. The mold resin that tries to protrude from the lead wire outlet part (11) into the lead wire storage space (9) is stopped by the packing (12) and does not protrude.Thus, after a predetermined period of time, the mold resin is removed from the upper mold (2). Open the lower mold (3) and take out the object to be molded.
この発明は以上説明したとおり、上型と下型とを合わせ
て被成形体を挿入するモールド空間とこのモールド空間
に連通し上記被成形体のリード線を収納するリード線収
納空間の周囲にシール材を配設し、上記モールド空間を
上記リード線収納空間を介して真空にした後、モールド
樹脂を注入し成形するようにしたことにより、モールド
空間の真空引き通路が単純化できる効果がある。As explained above, this invention has a seal around the mold space in which the molded object is inserted by combining the upper mold and the lower mold, and the lead wire storage space that communicates with this mold space and stores the lead wire of the molded object. By arranging the molding material and evacuating the mold space through the lead wire storage space, the molding resin is injected and molded, which has the effect of simplifying the evacuation path of the mold space.
また、上型と下型とを合わせてリード線を有する被成形
体を挿入するモールド空間の周囲にシール材を配設し、
上記モールド空間を真空にした後、モールド樹脂を注入
し成形するようにしたものにおいて、下型に上記リード
線が収納されるリード線収納空間を設けたことにより、
リード線が邪魔にならず作業性が良好となる効果がある
。In addition, a sealing material is arranged around the mold space in which the upper mold and the lower mold are combined and a molded object having a lead wire is inserted.
After the mold space is evacuated, mold resin is injected and molded, and by providing a lead wire storage space in which the lead wire is stored in the lower mold,
This has the effect that the lead wire does not get in the way and improves workability.
また、被成形体のリード線出口部の上型と下型にリード
線を挾むように弾性を有するパツキンを設けたことによ
り、リード線出口部からモールド樹脂が食み出ることが
なくなる効果がある。Further, by providing elastic packing between the upper mold and the lower mold at the lead wire exit portion of the molded object so as to sandwich the lead wire, there is an effect that the mold resin does not protrude from the lead wire exit portion.
第１図は発明の一実施例を示す断面図、第２図は同じく
下型（３）の平面図、第３図は同じく他の断面図、第４
図は同じく上型Ｕと下型（３）を開いた状態のリード線
出口部（１１）を示す断面図、第５図は同じく上型（２
）と下型（３）を型締めした状態のリード線出口部（１
１）を示す断面図である。
なお、図中（１）は成形金型、（２）は上型、Ｂ）は下
型、４）はモールド空間、（６）はリード線、（へ）は
被成形体、（９）はリード線収納空間、頭は連通空間、
（１１）はリード線出口部、（１２）はパツキン、（１
３）は貫通孔、（１７）はシール材である。FIG. 1 is a sectional view showing one embodiment of the invention, FIG. 2 is a plan view of the lower mold (3), FIG. 3 is another sectional view, and FIG.
The figure is a sectional view showing the lead wire outlet part (11) with the upper mold U and lower mold (3) open, and FIG.
) and the lower mold (3) are clamped, and the lead wire outlet part (1
1) is a cross-sectional view showing. In the figure, (1) is the molding die, (2) is the upper mold, B) is the lower mold, 4) is the mold space, (6) is the lead wire, (f) is the object to be molded, and (9) is the molded object. Lead wire storage space, head communication space,
(11) is the lead wire outlet, (12) is the packing, (1
3) is a through hole, and (17) is a sealing material.
Claims (3)
ルド空間とこのモールド空間に連通し上記被成形体のリ
ード線を収納するリード線収納空間の周囲にシール材を
配設し、上記モールド空間を上記リード線収納空間を介
して真空にした後、モールド樹脂を注入し成形するよう
にした真空成形方法。(1) A sealing material is provided around the mold space into which the molded object is inserted by aligning the upper mold and the lower mold, and the lead wire storage space that communicates with this mold space and stores the lead wires of the molded object. . A vacuum forming method, wherein the mold space is evacuated via the lead wire storage space, and then molding resin is injected and molded.
体を挿入するモールド空間の周囲にシール材を配設し、
上記モールド空間を真空にした後、モールド樹脂を注入
し成形するようにしたものにおいて、下型に上記リード
線が収納されるリード線収納空間を設けた真空成形方法
。(2) Arranging a sealing material around the mold space in which the upper mold and the lower mold are combined and a molded object having a lead wire is inserted;
A vacuum forming method in which a molding resin is injected and molded after the mold space is evacuated, and the lower mold is provided with a lead wire storage space in which the lead wires are stored.
線を挾むように弾性を有するパッキンを設けた請求項１
または請求項２の真空成形方法。(3) Claim 1, wherein elastic packing is provided at the upper and lower molds at the lead wire exit portion of the molded object so as to sandwich the lead wire.
Or the vacuum forming method according to claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6955189A JPH02248219A (en) | 1989-03-22 | 1989-03-22 | Vacuum molding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6955189A JPH02248219A (en) | 1989-03-22 | 1989-03-22 | Vacuum molding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02248219A true JPH02248219A (en) | 1990-10-04 |
Family
ID=13405977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6955189A Pending JPH02248219A (en) | 1989-03-22 | 1989-03-22 | Vacuum molding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02248219A (en) |
-
1989
- 1989-03-22 JP JP6955189A patent/JPH02248219A/en active Pending
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