JPH0224046B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a deposition frequency adjustment device for a piezoelectric vibrator.

A conventional method for adjusting the deposition frequency of a tuning fork type crystal resonator will be explained with reference to FIG. First, a vapor deposition source 1 is heated in a vacuum chamber to generate metal vapor 2, which is squeezed by a mask 3 and is deposited as a metal thin film on the tip of a tuning fork-shaped crystal oscillation piece (hereinafter referred to as an oscillation piece) 4a (mass addition). The oscillating piece 4a which is oscillating independently by the oscillating circuit 5 is
This mass addition causes the frequency to change and reach the reference frequency. When the reference frequency is reached, the detection circuit (counter) 6 and the control circuit 7 are activated, and the shielding plate 8 blocks the metal vapor 2 from flowing into the oscillation piece 4a.
Finish frequency adjustment. Oscillating pieces 4, 4a, 4b...
...4n surrounds the evaporation source 1 at a constant distance, and advances by one pitch at the same time as frequency adjustment is completed. In the figure, 4a indicates an oscillation piece whose frequency is being adjusted, and 4b and subsequent oscillation pieces show oscillation pieces whose frequency is not yet adjusted.

According to the conventional evaporation frequency adjustment method described above, if one pitch is one cycle, one oscillation piece is processed in one cycle, and the efficiency is low.
Furthermore, even though the metal used for vapor deposition is an expensive material such as silver (Ag), only one oscillating piece is provided in the metal evaporation area (in other words, only one oscillating piece is provided in the metal evaporation area). However, even with 10 tubes, the same amount of metal vapor would be consumed.) This was an extremely wasteful method. Of course, the metal that adheres to things other than the oscillating piece can be collected and reused, but the time required to collect and reuse is wasted.

The present invention solves the above drawbacks,
An embodiment of the present invention will be described in detail below with reference to the explanatory diagram of FIG.

In FIG. 2, the present invention includes a plurality of oscillating pieces 12 (12a to 12n, usually in a connected ring shape) in a vapor region of metal vapor 11 evaporated from a vapor deposition source 10.
230 to 250) and the opening 1 provided in the mask 13.
In the evaporation area of the metal vapor narrowed down by the openings 14 and 15, the oscillating piece 12a is placed in the opening 14.
In the area of the opening 15, the subsequent oscillation pieces 12b, 1
2c, when the leading oscillating piece 12a reaches the set frequency, the detection circuit 17 activates the control circuit, the shielding plate 19 blocks the metal vapor on the oscillating piece 12a side, and the oscillating circuit 16a is opened. At the same time, the metal vapor on the side of the oscillating pieces 12b and 12c generated later is blocked, and the vapor deposition frequency is adjusted by one oscillating piece (one pitch).

The present invention also relates to the above manufacturing method, in which the oscillating pieces 12, 12a to 12n are arranged in a ring shape at the same pitch around the vapor deposition source 10 in a vacuum chamber.
A mask plate 13 is provided between the oscillating piece 12 and the evaporation source 10, a shielding plate 19 blocks metal vapor 11 from the evaporating source 10, and a set frequency is set while the oscillating piece 12 is oscillated. Oscillation circuit 1 to detect
6 and a detection circuit 17, and a control circuit 18 for operating a shielding plate 19 to shut off metal vapor when the oscillation piece 12 reaches a set value. is opening 1
4 and 15, one of the openings 14 and 15 has a vapor deposition area for one oscillation piece 12a, and the other opening 15 has a vapor deposition area for two oscillation pieces 12b and 12c. The oscillating piece 12a has an oscillating circuit 16a, a detection circuit 17a, a control circuit 18a, and a shielding plate 19a, and the oscillating piece 12b and 12c each have an oscillating circuit 16b, 16 independently.
c and the detection circuits 17b, 17c, the oscillation piece 12b,
The present invention relates to a vapor deposition frequency adjustment device having the above configuration, in which a control circuit 18a and a shielding plate 19b are provided in common with 12c.

A specific embodiment of the method for adjusting the evaporation frequency of a piezoelectric vibrator of the present invention will be described using the above-mentioned evaporation frequency adjustment apparatus. When the oscillation piece 12a comes in front of the opening 14 of the mask plate 13, is connected to the oscillating piece 12a, and the oscillating pieces 12b and 12c are connected to oscillating circuits 16b and 16c, respectively. The oscillation piece 12a is oscillated by an oscillation circuit 16a, the output of the oscillation circuit 16a is detected by a detection circuit 17a, and when the oscillation frequency is higher than the set frequency, the control circuit 18a opens the shielding plate 19a to adjust the frequency. Ru. The oscillation pieces 12b and 12c also have an oscillation circuit 16.
Detection circuits 17b, 17c are oscillated by b, 16c.
A signal is sent to the control circuit 18b. The control circuit 18b operates as a shield plate when the oscillation frequency of both the oscillating pieces 12b and 12c is equal to or higher than the second set frequency (which is set slightly higher than the previous set frequency so that the frequency can be adjusted later). 19b will be opened. When the frequency of the oscillating piece 12a is adjusted and reaches the set frequency, the shielding plate 19a closes, and at the same time 19b also closes and the oscillating circuits 16a and 16b are disconnected, advancing one oscillating piece (1 pitch) and adjusting the frequency of the next 12b. will be held. Here, if the oscillating piece 12a is below the set frequency from the beginning, it is defective, so the shielding plate 19
A is not opened and frequency adjustment is not performed. Further, when the oscillating pieces 12b and 12c are below the second set frequency from the beginning, the shielding plate 19b does not open, or when the oscillating piece 12a reaches the second set frequency first before the frequency is adjusted. At that point, the shielding plate 19b
This is to prevent the oscillating pieces 12b and 12c from becoming defective due to excessive frequency adjustment. As shown above, while the frequency of the oscillating piece 12a is being adjusted, the oscillating pieces 12b and 12c are
Preliminary frequency adjustment of the oscillating pieces 12b and 12c can be performed by vapor-depositing the oscillator on the oscillating pieces 12b and 12c.

As described above, according to the present invention, according to the inventor's data, compared to the conventional method, processing capacity can be improved by 60%, and metal vapor usage can be reduced by 1/2. It should be noted that the present invention is not limited to the three oscillation pieces in the embodiment, but can be applied in other ways as long as the oscillation pieces are disposed within the metal vapor evaporation region. Furthermore, the type of oscillation piece is not limited to the tuning fork type crystal oscillation piece of the embodiment.
It is possible to implement the manufacturing method and apparatus of the present invention.

Further, according to the present invention, since the oscillation frequencies of all the oscillation pieces to be vapor-deposited are measured and monitored, there is no occurrence of frequency adjustment failure due to excessive vapor-deposition.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing an example of a conventional frequency adjustment method. FIG. 2 is an explanatory diagram showing an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Vapor deposition source, 2... Metal vapor, 3... Mask, 4... Oscillation piece, 5... Oscillation circuit, 6... Detection circuit, 7... Control circuit, 8... Shielding plate, 10... …
Vapor deposition source, 11... Metal vapor, 12... Oscillation piece, 1
3... Mask, 14, 15... Aperture, 16... Oscillation circuit, 17... Detection circuit, 18... Control circuit,
19...Blocking plate.

Claims (1)

[Scope of Claims] 1 Piezoelectric oscillating pieces arranged in a ring shape at the same pitch around the evaporation source, a mask plate provided between the piezoelectric oscillating pieces and the evaporation source, and a metal vapor emitted from the evaporation source. an oscillation circuit and a detection circuit that detect a set frequency while oscillating the piezoelectric oscillation piece; and a shielding plate that operates to cut off metal vapor when the piezoelectric oscillation piece reaches the set value. In the vapor deposition frequency adjusting device for piezoelectric oscillation pieces having a control circuit, the mask plate has at least two openings, one of the openings having a vapor deposition area for one piezoelectric oscillation piece on the starting side. , other openings on the later side include;
A vapor deposition area for at least two piezoelectric oscillation pieces is provided, and the first piezoelectric oscillation piece has a first oscillation circuit,
a first detection circuit that detects that the frequency of the piezoelectric oscillation piece has reached a first frequency; and a first detection circuit that detects that the frequency of the piezoelectric oscillation piece is equal to or higher than the first frequency based on a detection signal of the first detection circuit; A first control circuit is connected to the first control circuit for controlling a first shielding plate to open an opening on the first side and close an opening on the first side when the frequency is lower than the first frequency, and a plurality of piezoelectric oscillation pieces on the second side are individually connected to each other. a second oscillation circuit for detecting that the frequency of the piezoelectric oscillation piece has reached a second frequency higher than the first frequency;
When a detection circuit is connected and all of the frequencies of the plurality of piezoelectric oscillation pieces on the second generation side are equal to or higher than the second frequency based on the detection signal of the second detection circuit, the opening on the second generation side is opened; A deposition frequency adjustment device for a piezoelectric vibrator, which is connected to a common second control circuit that controls the second shielding plate to close the opening on the latter side when the frequency of the piezoelectric oscillating piece is equal to or lower than the second frequency. .