JPH02230862A - Picture reader - Google Patents

Picture reader

Info

Publication number
JPH02230862A
JPH02230862A JP1150605A JP15060589A JPH02230862A JP H02230862 A JPH02230862 A JP H02230862A JP 1150605 A JP1150605 A JP 1150605A JP 15060589 A JP15060589 A JP 15060589A JP H02230862 A JPH02230862 A JP H02230862A
Authority
JP
Japan
Prior art keywords
light
receiving element
pixel
insulating member
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1150605A
Other languages
Japanese (ja)
Inventor
Kiichi Yamada
紀一 山田
Masao Funada
雅夫 舟田
Kazuhisa Ando
和久 安藤
Eisaku Hayashi
栄作 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Publication of JPH02230862A publication Critical patent/JPH02230862A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve the resolution of picture reading by interposing an insulation member between a photodetector and an original face, forming a transparent part to the insulation member placed on each picture element of the photodetector and forming the transparent part to the insulation member including a face sectioning the transparent part mutually. CONSTITUTION:An insulation member 500 consists of a light transmission part 51 transmitting a light and a light shield part 52 shutting light. The light transmission part 51 is placed in each picture element 101 of a photodetector 100 and formed as a square cylindrical body with equal cross sectional area to that of the picture element 101. The insulation member 500 except the light transmission part 51 forms the light shield part 52. Moreover, each light shield part 52 is formed to shield each light transmission part 51. Thus, only a reflected light from an original face placed just above the photodetector 100 is made incident into each picture element, the reflected light from the other part of the original face is shut by the light shield part 52 and not made incident into the picture element, then the resolution of the photodetector 100 is improved.

Description

【発明の詳細な説明】 (産業上−の利用分野) 本発明はファクシミリやスキャナ等に用いられる画像読
取装置に係り、特に画像読度装置の読み取り部を構成す
る受光素子の分解能を向上させるための構造に関するも
のである。
Detailed Description of the Invention (Industrial Field of Application) The present invention relates to an image reading device used in facsimiles, scanners, etc., and in particular to improving the resolution of a light receiving element constituting the reading section of an image reading device. It is related to the structure of

(従来の技術) 従来、ファクシミリやスキャナ等に使用される密着型の
画像読取装置は、蛍光灯等の光源と、原稿幅長を有する
受光素子と、原稿からの反射光を受光素子に結像させる
収束性導光系とから成り、原稿からの濃度に応じた反射
光による光信号を電気信号としてアレイ状に配置された
受光素子に電気的走査によって蓄積し、この電気信号を
時系列的に出力して画像信号を得るものである。この画
像読取装置によれば、縮小光学系を用いる方式に比較し
て装置の小型化を図ることができるが、収束性導光系と
して高価なロッドレンズアレイ等を使用するので装置の
小型化及び低価格化に限度があるとともに、導光系とセ
ンサ受光面との焦点調整に手間がかかるという欠点があ
った。
(Prior Art) Conventionally, contact type image reading devices used in facsimile machines, scanners, etc. have a light source such as a fluorescent lamp, a light receiving element having the width of the document, and an image of reflected light from the document on the light receiving element. It consists of a convergent light guide system that stores optical signals from reflected light from the original according to the density as electrical signals in light receiving elements arranged in an array by electrical scanning, and transmits these electrical signals in time series. It is used to output an image signal. According to this image reading device, the size of the device can be reduced compared to a method using a reduction optical system, but since an expensive rod lens array or the like is used as the convergent light guiding system, There is a drawback that there is a limit to the reduction in price and that it takes time and effort to adjust the focus between the light guide system and the sensor light receiving surface.

そこで、装置の小型化,低価格化を図るため、ロッドレ
ンズアレイを使わずに収束性導光系をセンサ基板面上に
形成するいわゆる完全密着型イメージセンサを用いた画
像読取装置が提案されている。
Therefore, in order to reduce the size and cost of the device, an image reading device using a so-called full contact type image sensor, in which a converging light guide system is formed on the sensor substrate surface without using a rod lens array, has been proposed. There is.

この画像読取装置は、例えば第10図及び第11図に示
すように、絶縁基板10上に形成された受光素子100
と、絶縁基板10の裏面側に配置する螢光灯やLEDア
レイ等の光源(図示せず)とから成る。受光素子100
は、主走査方向に離散的に配置される個別電極11、帯
状の光導電層12、帯状の共通電極13を順次形成して
構成され、個別電極11.光導電層12,共通電極13
が重なり合った部分が一列にアレイ状に並べられた複数
の光電変換素子となる画素101を形成している。また
、受光素子100は、透明保護層14及び透明耐摩耗層
15で覆われている。受光素子100の副走査方向側に
は、絶縁基板10の裏面側に配置された光源からの光を
受光素子100上に配置した原稿200側へ導く光通過
窓16が形成されている。
This image reading device includes a light receiving element 100 formed on an insulating substrate 10, as shown in FIGS. 10 and 11, for example.
and a light source (not shown) such as a fluorescent lamp or an LED array arranged on the back side of the insulating substrate 10. Light receiving element 100
is constructed by sequentially forming individual electrodes 11, a band-shaped photoconductive layer 12, and a band-shaped common electrode 13, which are arranged discretely in the main scanning direction, and the individual electrodes 11. Photoconductive layer 12, common electrode 13
The overlapping portions form pixels 101, which serve as a plurality of photoelectric conversion elements arranged in a line in an array. Further, the light receiving element 100 is covered with a transparent protective layer 14 and a transparent wear-resistant layer 15. A light passage window 16 is formed on the side of the light receiving element 100 in the sub-scanning direction to guide light from a light source placed on the back side of the insulating substrate 10 to the side of the document 200 placed on the light receiving element 100.

以上のような画像読取装置によれば、光源から発光した
光が光通過窓16を通じて透明耐摩耗層15上に配置し
た原稿200に照射され、その反射光300が受光素子
100の画素101に入射する。
According to the image reading device as described above, light emitted from the light source is irradiated onto the document 200 placed on the transparent wear-resistant layer 15 through the light passing window 16, and the reflected light 300 is incident on the pixel 101 of the light receiving element 100. do.

(発明が解決しようとする課題) しかしながら上述した画像読取装置の構造によると、原
稿面からの反射光を受光素子上に集光させる導光系が備
わっていないので次のような問題点があった。
(Problems to be Solved by the Invention) However, the structure of the image reading device described above does not include a light guide system that focuses the light reflected from the document surface onto the light receiving element, so there are the following problems. Ta.

すなわち、受光素子100の画素101aには、画素1
01aが読み取るべき一画素分の原稿面AOから導かれ
る反射光300のみならず、隣接する一画素分の原稿面
A,からの不要な反射光400が照射される。従って、
画素101aにおいては、反射光300と不要な反射光
400との総光量に対して電荷を蓄積するので、画素1
01aから出力される電気信号は、原稿面AOの画情報
と原稿面A,の画情報とが重なり合ったものとなってし
まう。不要な反射光400の照射により画素101aに
蓄積される電荷量は、原稿面A,から画素101aに達
するまでの反射光400の光路長が長く入射角も大きい
ので、反射光300によるものに比較すれば少ない値で
ある。しかし、原稿面A,が白である場合、原稿面A,
からの反射光400は画素101aに対して影響を与え
る強さとなり、受光素子100の分解能(MTF)の低
下をまねいてしまう。
That is, the pixel 101a of the light receiving element 100 has the pixel 1
Not only the reflected light 300 guided from the document surface AO corresponding to one pixel that 01a should be read, but also unnecessary reflected light 400 from the document surface A corresponding to one pixel adjacent thereto is irradiated. Therefore,
In the pixel 101a, charge is accumulated for the total amount of reflected light 300 and unnecessary reflected light 400, so the pixel 101a
The electrical signal outputted from 01a is a combination of image information on document surface AO and image information on document surface A, which overlap each other. The amount of charge accumulated in the pixel 101a due to the irradiation of the unnecessary reflected light 400 is compared to that caused by the reflected light 300 because the optical path length of the reflected light 400 from the document surface A to the pixel 101a is long and the angle of incidence is large. If so, the value is small. However, if the original surface A, is white, the original surface A,
The reflected light 400 from the pixel 101a has a strength that affects the pixel 101a, leading to a decrease in the resolution (MTF) of the light receiving element 100.

特に、原稿200が透明耐摩耗層15から浮くことによ
って一画素で読み取るべき原稿面以外からの反射光が当
該原稿面の一画素を読み取る画素101aへ入射しやす
くなり、焦点深度を深《とることが構造上困難になると
いう問題点があった。
In particular, as the original 200 floats from the transparent wear-resistant layer 15, reflected light from a surface other than the original surface that should be read by one pixel is more likely to enter the pixel 101a that reads one pixel of the original surface, resulting in a deeper depth of focus. The problem was that it was structurally difficult.

本発明は上記実情に鑑みてなされたもので、導光系を用
いること無く小型化及び低価格化を図りながら、画像読
み取りの分解能の向上を図ることができる画像読取装置
を提供することを目的とする, (課題を解決するための手段) 上記従来例の問題点を解消するため本発明の画像読取装
置は、受光素子と光源とを有し、受光素子上方に位置す
る原稿面に前記光源からの光を照射させ、その反射光を
前記受光素子に入射させる画像読取装置において、前記
受光素子と前記原稿面との間に絶縁部材を介在し、受光
素子の各画素上に位置する前記絶縁部材に透光部を形成
し、該透光部を互いに分断する面を含んだ前記絶縁部材
に遮光部を形成したことを特徴としている。
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an image reading device that can improve the resolution of image reading while reducing the size and cost without using a light guide system. (Means for Solving the Problem) In order to solve the problems of the conventional example described above, an image reading device of the present invention has a light receiving element and a light source, and the light source is placed on the document surface located above the light receiving element. In an image reading device that irradiates light from a source and makes the reflected light enter the light receiving element, an insulating member is interposed between the light receiving element and the document surface, and the insulating member is located on each pixel of the light receiving element. The present invention is characterized in that a light-transmitting portion is formed in the member, and a light-blocking portion is formed in the insulating member including a surface that separates the light-transmitting portion from each other.

(作用) 本発明によれば、受光素子の各画素へはその直上に位置
する原稿面からの反射光のみが入射し、原稿面の他の部
分からの反射光は遮光部で遮断され、画素へ入射するこ
とがない。
(Function) According to the present invention, only the reflected light from the document surface located directly above enters each pixel of the light-receiving element, and the reflected light from other parts of the document surface is blocked by the light shielding part, and the pixel There is no incident on the

(実施例) 本発明の一実施例について図面を参照しながら説明する
(Example) An example of the present invention will be described with reference to the drawings.

第1図は本発明の一実施例に係る画像読取装置の断面説
明図であり、第10図と同様の構成をとる部分について
は同一符号を付している。
FIG. 1 is an explanatory cross-sectional view of an image reading device according to an embodiment of the present invention, and parts having the same configuration as in FIG. 10 are designated by the same reference numerals.

この画像読取装置は、絶縁基板10上に受光素子100
を形成し、この受光素子100上に絶縁部材500を配
置し、更にこの絶縁部材500上にガラス板等から成る
透明耐摩耗層15を形成している。
This image reading device includes a light receiving element 100 on an insulating substrate 10.
An insulating member 500 is disposed on the light receiving element 100, and a transparent wear-resistant layer 15 made of a glass plate or the like is further formed on the insulating member 500.

受光素子100は、主走査方向に離散的に形成された個
別電極(クロムパターン)11と帯状の共通電極(IT
O)13とで光導電層(a−Si)12を挟持し、個別
電極11,光導電層12.共通電極13が重なり合う部
分が光電変換素子となるサンドイッチ構造の複数のセン
サ画素101を形成している。
The light receiving element 100 includes individual electrodes (chrome patterns) 11 formed discretely in the main scanning direction and a band-shaped common electrode (IT
A photoconductive layer (a-Si) 12 is sandwiched between the individual electrodes 11, the photoconductive layer 12. The overlapping portions of the common electrodes 13 form a plurality of sensor pixels 101 having a sandwich structure and serving as photoelectric conversion elements.

絶縁部材500は、光を透過させる透光部51と、光を
遮断する遮光部52とから構成されている。透光部51
は、第2図に示すように、受光素子100の各画素10
1上に位置し、この画素101と断面積が等しい方形の
筒状体で形成されている。透光部51以外の絶縁部材5
00は遮光部52を形成している。また遮光部52は、
各透光部51間を遮蔽するように形成されている。透光
部51は少なくとも画素101上に、遮光部52は少な
くとも各透光部51を互いに分断する面を含んで形成す
ればよいので、第3図のように、透光部51と遮光部5
2とをそれぞれ壁状体に形成して交互に配置し、透光部
51がスリット状に構成されたものであってもよい。
The insulating member 500 includes a light transmitting portion 51 that transmits light and a light shielding portion 52 that blocks light. Translucent part 51
As shown in FIG. 2, each pixel 10 of the light receiving element 100
1 and is formed of a rectangular cylindrical body having the same cross-sectional area as this pixel 101. Insulating member 5 other than transparent part 51
00 forms a light shielding part 52. Moreover, the light shielding part 52 is
The light-transmitting portions 51 are formed so as to shield each other from each other. The light-transmitting portion 51 may be formed at least on the pixel 101, and the light-shielding portion 52 may be formed so as to include at least a surface that separates each light-transmitting portion 51 from each other. Therefore, as shown in FIG.
2 may be formed into wall-like bodies and arranged alternately, and the light-transmitting portion 51 may be configured in the form of a slit.

この絶縁部材500は、例えばポリイミドを塗布し、透
光部51をフォトリソ法によるパターンニングにより形
成する。遮光部52の存在により、第1図の反射光60
0より左側の原稿200面がらの反射光が画素101a
に入射しないようにするため、前記絶縁部材500の膜
厚Pは、画素101の幅W,画素101間の距MS,画
素101から原稿200までの距離dとすると、P/W
>d/(W+S)を満足するようになっている。
The insulating member 500 is formed by coating polyimide, for example, and forming the transparent portion 51 by patterning using photolithography. Due to the presence of the light shielding part 52, the reflected light 60 in FIG.
The reflected light from the surface of the original 200 on the left side of 0 is the pixel 101a.
In order to prevent the light from entering the document 200, the film thickness P of the insulating member 500 is calculated as P/W, where W is the width of the pixel 101, MS is the distance between the pixels 101, and distance d is the distance from the pixel 101 to the original 200.
>d/(W+S).

次に本実施例の製造プロセスについて説明する。Next, the manufacturing process of this example will be explained.

透光性の絶縁基板10(コーニング7090)上ニクロ
ム(Cr)の着膜及びパターンニングを行ない、更に、
アモルファスシリコン(a−Si)及び酸化インジウム
・スズ(ITO)を着膜し、それぞれパターンニングし
て画素密度が8dat/fflI(画素幅tは125μ
m)の受光素子100を形成する。
A nichrome (Cr) film is deposited and patterned on a transparent insulating substrate 10 (Corning 7090), and further,
Amorphous silicon (a-Si) and indium tin oxide (ITO) are deposited and patterned to achieve a pixel density of 8 dat/fflI (pixel width t is 125 μm).
m) The light receiving element 100 is formed.

次に受光素子100上にポリイミドを60μmの膜厚に
塗布し、透光部51部分のみフォトリソ法によりエッチ
ングして一辺Wが85μmの方形状の透光部51と主走
査方向の幅Sが40μmの遮光部52とから成る絶縁部
材500を形成する。
Next, polyimide is applied to a film thickness of 60 μm on the light-receiving element 100, and only the transparent portion 51 is etched by photolithography, so that the transparent portion 51 has a rectangular shape with a side W of 85 μm and a width S in the main scanning direction of 40 μm. An insulating member 500 consisting of a light shielding portion 52 is formed.

次いで透明の接着剤を透光部51に充虜し、絶縁部材5
00上に透明耐摩耗層15となる20μm厚のガラス板
を載置接着する。
Next, a transparent adhesive is filled in the transparent part 51, and the insulating member 5 is attached.
A glass plate having a thickness of 20 μm, which will become the transparent wear-resistant layer 15, is placed and adhered on the 00.

第4図及び第5図は、本発明の他の実施例を示すもので
、光源としてEL発光素子を用いた受光素子,発光素子
一体型の超小型の画像読取装置に本発明を適用したもの
である。
4 and 5 show other embodiments of the present invention, in which the present invention is applied to an ultra-compact image reading device that uses an EL light emitting element as a light source and is integrated with a light receiving element and a light emitting element. It is.

この画像読取装置は、絶縁基板10上に形成した受光素
子100と、透光性のガラス基板70上に形成したEL
発光素子700とで、透光性の絶縁部材500を挟んで
構成されている。
This image reading device includes a light receiving element 100 formed on an insulating substrate 10 and an EL element formed on a transparent glass substrate 70.
A light-emitting element 700 is configured with a translucent insulating member 500 sandwiched therebetween.

EL発光素子700は、ZnS:Mn等から成る発光層
73を、Y20,,Si,N,,BaTiO,等から成
る絶縁層72.74で挾持し、更にこれらをITO,I
n,O,,Sn02等から成る共通電極71とアルミニ
ウム等の金属から成る不透明な金属電極75とで扶持し
て構成される。
The EL light emitting device 700 has a light emitting layer 73 made of ZnS:Mn etc. sandwiched between insulating layers 72 and 74 made of Y20, Si, N, BaTiO, etc.
It is supported by a common electrode 71 made of n, 0, Sn02, etc. and an opaque metal electrode 75 made of metal such as aluminum.

金属電極75には、発光層73から発光した光が原稿2
00を照射し、その反射光が前記受光素子100に入射
するように、受光素子100の各画素部101上にこの
画素部101より面積が小さい方形状の光入射窓76が
開口形成されている。
The light emitted from the light emitting layer 73 is applied to the metal electrode 75.
00 and the reflected light enters the light receiving element 100, a rectangular light entrance window 76 having an area smaller than the pixel part 101 of the light receiving element 100 is formed as an opening on each pixel part 101 of the light receiving element 100. .

このEL発光素子700は次の手順で作成される。ガラ
ス基板70上にITO,In2 0,,SnO2等をス
バッタ法等で着膜して透明電極71を形成し、透明電極
71上にY20,,S,i,N,,BaTiO.等を着
膜しての絶縁層72を形成し、絶縁層72上にスバッタ
法等でZnS:Mn,ZnS;TbF,等を着膜して帯
状の発光層73を形成し、再度前記同様の絶縁層74を
形成し、絶縁層72上にアルミニウム等の金属を蒸着し
、フォトリソ法によりパターニングして光入射窓76を
有する金属電極75を形成する。
This EL light emitting element 700 is produced by the following procedure. A transparent electrode 71 is formed by depositing ITO, In20,, SnO2, etc. on a glass substrate 70 by a sputtering method or the like, and Y20, S, i, N, BaTiO. The insulating layer 72 is formed by depositing ZnS:Mn, ZnS; An insulating layer 74 is formed, a metal such as aluminum is deposited on the insulating layer 72, and patterned by photolithography to form a metal electrode 75 having a light incidence window 76.

また、受光素子100の分解能(MTF)は、金属電極
75の光入射窓76の面積が一定範囲内であれば、金属
電極75の光入射窓76と原稿200間の距離(ガラス
基板70の厚さ)及び、受光素子100と金属電極75
の光入射窓76間の距離(絶縁部材500の厚さ)に大
きく依存する。
Further, the resolution (MTF) of the light receiving element 100 is determined by the distance between the light entrance window 76 of the metal electrode 75 and the document 200 (the thickness of the glass substrate 70), if the area of the light entrance window 76 of the metal electrode 75 is within a certain range. ) and the light receiving element 100 and the metal electrode 75
depends largely on the distance between the light incident windows 76 (thickness of the insulating member 500).

従って、EL発光素子700と受光素子100との距離
を確保するスペーサとして絶縁部材500を介在させる
Therefore, the insulating member 500 is interposed as a spacer to ensure the distance between the EL light emitting element 700 and the light receiving element 100.

絶縁部材500は、透明部から成る透光部5lと、遮光
部52とから構成されている。透光部51及び遮光部5
2は、第1の実施例と同様に構成されている。すなわち
、画素101aについて着目して説明すると、原稿20
0からの反射光が画素101aの直上の光入射窓76a
に隣接する光入射窓76bを通って画素101aへ導か
れることを防ぐために遮光部52を形成している。従っ
て、透明部51を互いに分断する面を含んで形成すれば
よい。
The insulating member 500 includes a light-transmitting portion 5l made of a transparent portion and a light-shielding portion 52. Transparent part 51 and light shielding part 5
2 has the same structure as the first embodiment. That is, if we focus on the pixel 101a and explain it, the original 20
The reflected light from 0 passes through the light incidence window 76a directly above the pixel 101a.
A light shielding portion 52 is formed to prevent light from being guided to the pixel 101a through the light entrance window 76b adjacent to the light incident window 76b. Therefore, the transparent portion 51 may be formed to include a surface that separates the transparent portion 51 from each other.

この画像読取装置は、絶縁基板10上に受光素子100
を作製し、ガラス基板70上にEL発光素子700を作
成し、透光部51と遮光部52を有する絶縁部材500
を作製し、最後に受光素子100とEL発光素子700
の金属電極75側とが相対向するように絶縁部材500
を介在させて接着剤800で接合して形成する。
This image reading device includes a light receiving element 100 on an insulating substrate 10.
An EL light emitting element 700 is prepared on a glass substrate 70, and an insulating member 500 having a light transmitting part 51 and a light shielding part 52 is manufactured.
Finally, a light receiving element 100 and an EL light emitting element 700 are fabricated.
the insulating member 500 so that the metal electrode 75 side of the
It is formed by joining with adhesive 800 with .

次に、絶縁部材500の具体的な作成方法について説明
する。
Next, a specific method for creating the insulating member 500 will be described.

第1の例として、透明の感光性ガラスを絶縁部材500
として使用し、この絶縁部材500上に、各画素101
上に対応するように方形マスク(図示せず)を配置して
上方より紫外線を照射し、その後熱処理を行なって露光
された部分のみ結晶化させて不透明化し、透光部51と
遮光部52とを形成する。
As a first example, transparent photosensitive glass is used as the insulating member 500.
Each pixel 101 is placed on this insulating member 500.
A rectangular mask (not shown) is placed so as to correspond to the top, and ultraviolet rays are irradiated from above, and then heat treatment is performed to crystallize only the exposed portion and make it opaque, thereby forming a transparent part 51 and a light shielding part 52. form.

第2の例として、ポリイミドシ一トを絶縁部材500と
して使用する。すなわち第7図(a)乃至(f)に示す
ように、先ず加工しようとするポリイミドシ一ト50の
第1の面にフォトレジスト53をスピンコート.ロール
コート若しくは印刷によりコーティングし、ベークする
。次に第1の面と反対側の第2の面にフォトレジスト5
4をコーティングし、ベークする。続いて第2の面にフ
ォトマスク(図示せず)を置き紫外線照射(露光)し、
現像して所望のパターンを形成する。続いてポリイミド
シ一ト50のエッチングを行ない、洗浄後、レジスト5
3.54を除去して透光部51と遮光部52とを有する
絶縁部材500が形成される。
As a second example, polyimide sheet is used as the insulating member 500. That is, as shown in FIGS. 7(a) to 7(f), first, a photoresist 53 is spin-coated on the first surface of a polyimide sheet 50 to be processed. Coat by roll coating or printing and bake. Next, a photoresist 5 is applied to the second surface opposite to the first surface.
Coat 4 and bake. Next, a photomask (not shown) is placed on the second surface, and ultraviolet rays are irradiated (exposed).
Develop to form desired pattern. Subsequently, the polyimide sheet 50 is etched, and after cleaning, the resist 50 is etched.
3.54 is removed to form an insulating member 500 having a light-transmitting portion 51 and a light-blocking portion 52.

また、第8図(a)乃至(d)に示すように、ガラスま
たはセラミック基板90上にワックス91を塗布した後
にポリイミドシ一ト50を貼り付け、フォトレジスト5
3をコーティングし、べ一クし、上面にフォトマスク(
図示せず)を置き紫外線照射(露光)し、現像して所望
のパターンを形成する。続いて、ポリイミドシ一ト50
のエッチングを行ない、洗浄後、レジスト53及びワッ
クス91を除去して透光部51と遮光部52とを有する
絶縁部材500が形成される。この方法によれば、基板
90上に絶縁部材500を形成することができるので、
取り扱いが容易となる。
Further, as shown in FIGS. 8(a) to 8(d), after applying wax 91 on a glass or ceramic substrate 90, a polyimide sheet 50 is attached, and a photoresist 5
Coat 3, bake, and apply a photomask (
(not shown) is placed, exposed to ultraviolet light, and developed to form a desired pattern. Next, polyimide sheet 50
After etching and cleaning, the resist 53 and wax 91 are removed to form an insulating member 500 having a light transmitting portion 51 and a light shielding portion 52. According to this method, the insulating member 500 can be formed on the substrate 90.
Easy to handle.

以上の実施例において、ポリイミドシ一トの代わりに、
金属箔を使用することもできる。
In the above embodiments, instead of polyimide sheet,
Metal foil can also be used.

また、第9図Cl)乃至(c)に示すように、受光素子
100が形成ざれた絶縁基板10上にネガレジスト55
(東京応化工業(株)製:商品名PMER−N−HC4
0)をコーティングし、露光,現像によりパターンニン
グして透光部51と遮光部52とを形成し、この上にE
L発光素子700が形成されたガラス基板70を接着剤
800を介して配置してもよい。尚、第10図(c)に
おいて、第4図と同一構成部分については同一符号を付
している。
Further, as shown in FIGS. 9C to 9C, a negative resist 55 is placed on the insulating substrate 10 on which the light receiving element 100 is formed.
(Manufactured by Tokyo Ohka Kogyo Co., Ltd.: Product name PMER-N-HC4
0), patterned by exposure and development to form a light-transmitting part 51 and a light-blocking part 52, and then coated with E.
The glass substrate 70 on which the L light emitting element 700 is formed may be placed with an adhesive 800 interposed therebetween. In FIG. 10(c), the same components as those in FIG. 4 are designated by the same reference numerals.

また、透明部51に該当する部分を穴あけ加工した結晶
化ガラス(例えばコーニング社製:フォトフォーム等)
を絶縁部材500として使用しても実現できる。また、
透明のガラス板を絶縁部材500として使用し、この透
明のガラス板の所定の箇所のみ染色を施して遮光部52
を形成することも可能である。
In addition, crystallized glass (for example, Photoform, etc. manufactured by Corning Inc.) in which the part corresponding to the transparent part 51 is drilled
This can also be realized by using as the insulating member 500. Also,
A transparent glass plate is used as the insulating member 500, and only predetermined areas of the transparent glass plate are dyed to form the light shielding part 52.
It is also possible to form

以上述べた受光素子,発光素子一体型の画像読取装置に
おいて、EL素子発光のための駆動信号を金属電極75
と透明電極71との間に与えれば、これらの両電極で挟
まれた部分(発光層73の内、光入射窓76の直上部分
を除いた部分)の発光層73が発光し、画素101直上
部分の発光層73から光が放射して直接画素101に照
射することはない。上方に放射される光は原稿200で
反射し、その反射光が光入射窓76から各画素101に
照射し、原稿の濃淡に応じた電気信号に変換される。ま
た、受光素子100の画素101aへ入射する光は、画
素101a直上の原稿面からの反射光のみで、隣接光入
射窓76bからの入射光を遮光部52で遮断することが
でき、受光素子100の分解能の向上を図ることができ
る。そして、受光素子100の画素101から時系列的
に電気信号を抽出すれば原稿面の1ラインの画信号を得
ることができる。
In the above-mentioned image reading device integrated with a light receiving element and a light emitting element, a drive signal for emitting light from the EL element is transmitted to the metal electrode 75.
and the transparent electrode 71, the portion of the light emitting layer 73 sandwiched between these two electrodes (the portion of the light emitting layer 73 excluding the portion directly above the light incidence window 76) emits light, and the light emitting layer 73 directly above the pixel 101 emits light. Light is not emitted from the light emitting layer 73 in the portion and directly irradiates the pixel 101 . The light emitted upward is reflected by the original 200, and the reflected light is applied to each pixel 101 through the light entrance window 76, and is converted into an electrical signal corresponding to the density of the original. Further, the light that enters the pixel 101a of the light receiving element 100 is only the reflected light from the document surface directly above the pixel 101a, and the light that enters the adjacent light entrance window 76b can be blocked by the light shielding part 52. It is possible to improve the resolution of Then, by extracting electrical signals in time series from the pixels 101 of the light receiving element 100, an image signal for one line of the document surface can be obtained.

第6図は受光素子,発光素子一体型の画像読取装置にお
ける他の実施例を示すもので、絶縁部材500の具体的
な作成の第1の例で述べた方法で遮光部52を既に形成
したガラス基板から成る絶縁部材500上に、光入射窓
76を有する金属電極75、絶縁層74、発光層73、
絶縁層72、透明電極71を順次形成し、これらを覆う
ようにポリイミド等から成る絶縁性を有しかつ透明なバ
ッシベーション膜900を着膜し、この絶縁部材500
の透明部51と前記実施例と同様に作製した受光素子1
00の画素101部分とが相対応するよう、透明接着剤
800を介して両者を接合したものである。図中、第4
図と同一構成部分については同一符号を付している。
FIG. 6 shows another embodiment of an image reading device integrated with a light receiving element and a light emitting element, in which the light shielding part 52 has already been formed by the method described in the first example of the specific production of the insulating member 500. On an insulating member 500 made of a glass substrate, a metal electrode 75 having a light entrance window 76, an insulating layer 74, a light emitting layer 73,
An insulating layer 72 and a transparent electrode 71 are sequentially formed, and an insulating and transparent passivation film 900 made of polyimide or the like is deposited to cover them, and this insulating member 500 is formed.
The transparent part 51 and the light receiving element 1 manufactured in the same manner as in the above example
The two are bonded via a transparent adhesive 800 so that the pixel 101 portion of pixel 00 corresponds to the pixel 101 portion of pixel 00. In the figure, the fourth
Components that are the same as those in the figures are given the same reference numerals.

本実施例によれば、透明接着剤800による接合工程を
一回で済ませることができ、製造工程を減少させること
ができる。
According to this embodiment, the bonding process using the transparent adhesive 800 can be completed only once, and the number of manufacturing steps can be reduced.

(発明の効果) 本発明によれば、受光素子と原稿面間に介在する絶縁部
材を透光部と遮光部とから構成し、受光素子の各画素へ
はその直上に位置する原稿面からの反射光のみが入射し
、原稿面の他の部分からの反射光は遮光部で遮断される
ので、不要な反射光が画素へ入射することがなく、受光
素子の分解能の向上を図るとともに、焦点深度を深くす
ることができる。
(Effects of the Invention) According to the present invention, the insulating member interposed between the light-receiving element and the document surface is composed of a light-transmitting part and a light-blocking part, and each pixel of the light-receiving element receives light from the document surface located directly above it. Only the reflected light enters, and the light reflected from other parts of the document surface is blocked by the light shielding part, so unnecessary reflected light does not enter the pixels, improving the resolution of the light receiving element and improving the focus. The depth can be increased.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明実施例の画像読取装置の縦断面説明図、
第2図及び第3図は上記実施例の絶縁部材の平面説明図
、第4図は本発明の他の実施例を示す画像読取装置の断
面説明図、第5図は第4図のIV−IV’線断面説明図
、第6図は本発明の他の実施例を示す画像読取装置の断
面説明図、第7図(a)乃至(f)は本実施例における
絶縁部材の製造工程を示す説明図、第8図(a)乃至(
d)は本実施例における絶縁部材の製造工程を示す説明
図、第9図(a)乃至(C)は本発明の一実施例の画像
読取装置の製造工程を示す説明図、第10図は従来の完
全密着型イメージセンサを用いた画像読取装置の断面説
明図、第11図は第10図のXI−XI’線断面説明図
である。 200・・・原稿 300・・・反射光 500・・・絶縁部材 700・・・EL発光素子 0・・・・・・絶縁基板 1・・・・・・透光部 2・・・・・・遮光部 00・・・受光素子 01・・・画素 第 図 第 図 (a) 第 図
FIG. 1 is an explanatory longitudinal cross-sectional view of an image reading device according to an embodiment of the present invention;
2 and 3 are explanatory plan views of the insulating member of the above embodiment, FIG. 4 is an explanatory cross-sectional view of an image reading device showing another embodiment of the present invention, and FIG. FIG. 6 is a cross-sectional view of an image reading device showing another embodiment of the present invention, and FIGS. 7(a) to (f) show the manufacturing process of an insulating member in this embodiment. Explanatory drawings, Figures 8(a) to (
d) is an explanatory diagram showing the manufacturing process of the insulating member in this embodiment, FIGS. FIG. 11 is an explanatory cross-sectional view of an image reading device using a conventional fully contact type image sensor, and FIG. 11 is an explanatory cross-sectional view taken along the line XI-XI' in FIG. 200...Original 300...Reflected light 500...Insulating member 700...EL light emitting element 0...Insulating substrate 1...Transparent part 2... Light shielding part 00... Light receiving element 01... Pixel Figure (a) Figure

Claims (1)

【特許請求の範囲】 受光素子と光源とを有し、受光素子上方に位置する原稿
面に前記光源からの光を照射させ、その反射光を前記受
光素子に入射させる画像読取装置において、 前記受光素子と前記原稿面との間に絶縁部材を介在し、
受光素子の各画素上に位置する前記絶縁部材に透光部を
形成し、該透光部を互いに分断する面を含んだ前記絶縁
部材に遮光部を形成したことを特徴とする画像読取装置
[Scope of Claims] An image reading device that includes a light receiving element and a light source, irradiates light from the light source onto a document surface located above the light receiving element, and makes the reflected light enter the light receiving element, comprising: an insulating member is interposed between the element and the document surface,
An image reading device characterized in that a light-transmitting portion is formed in the insulating member located on each pixel of a light receiving element, and a light-blocking portion is formed in the insulating member including a surface that separates the light-transmitting portion from each other.
JP1150605A 1988-11-21 1989-06-15 Picture reader Pending JPH02230862A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63-292360 1988-11-21
JP29236088 1988-11-21

Publications (1)

Publication Number Publication Date
JPH02230862A true JPH02230862A (en) 1990-09-13

Family

ID=17780795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1150605A Pending JPH02230862A (en) 1988-11-21 1989-06-15 Picture reader

Country Status (1)

Country Link
JP (1) JPH02230862A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012022341A (en) * 2011-10-17 2012-02-02 Semiconductor Energy Lab Co Ltd Semiconductor device
JP2015133658A (en) * 2014-01-15 2015-07-23 三菱電機株式会社 image reading apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012022341A (en) * 2011-10-17 2012-02-02 Semiconductor Energy Lab Co Ltd Semiconductor device
JP2015133658A (en) * 2014-01-15 2015-07-23 三菱電機株式会社 image reading apparatus

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