JPH0223008Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite electronic circuit, and more particularly to a composite electronic circuit such as an amplifier using a split substrate.

Electronic circuits are becoming increasingly integrated. There are various methods of integration, such as uniformly integrating electronic circuits for a given purpose based on a certain design principle, or partially integrating capacitors, coils, transistors, etc. be. Although the former has a high level of circuit integration, it is not versatile because it is produced individually. Furthermore, in the latter case, integration is insufficient.

This invention has a sufficiently high degree of integration and is highly versatile.
Ease of assembly is aimed at providing complex electronic circuits. The present invention focuses on the fact that many complex electronic circuits can be composed of standardized circuit parts,
All of the composite electronic circuits are divided according to function, and each of them is configured as a predetermined integrated board with active or passive elements and wiring patterns applied inside and/or on the surface, and the lead-out portions of these boards are They are gathered at the periphery to form a film-like external terminal, and the partially integrated circuit configured in this way is mounted on a printed wiring board (hereinafter referred to as a motherboard) and connected between the external terminals of the partially integrated circuit and the wiring of the motherboard. Make solder connections. If necessary, this motherboard can be further mounted on a larger printed wiring board to form a triple integrated type. This last case is effective in realizing complex circuits.

By integrating in this way, general-purpose circuit parts can be mass-produced, fewer parts need to be produced in small quantities, which increases economic efficiency, and it is easier to assemble complex electronic circuits by standardizing partial circuits and unifying external shapes. It can provide benefits such as:

Hereinafter, the composite electronic circuit of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows a composite electronic circuit of the present invention, which consists of a motherboard 10 consisting of a flat plate made of ceramic, plastic, etc. with printed wiring 11 on the surface, and functional parts mounted on the surface of the motherboard 10. It is composed of integrated circuits 1, 2, 3, 4, 5, 6, 7, and 8. Each of the partially integrated circuits 1 to 8 has a thin film-like connection terminal drawn out to the outer periphery, and has a predetermined solder connection with the wiring on the motherboard. As for the partially integrated circuit, 1 is a UHF high frequency amplifier cell, 2 is an interstage connection cell, 3 is an AFC cell,
4 is a local oscillation cell, 5 is an input filter cell, 6
is the RF amplification cell, 7 is the selection circuit cell, and 8 is the IF
It is an amplifier cell.

One specific example of partially integrated circuits 1 to 8 is shown in FIG. In FIG. 2, a partially integrated circuit including one functional circuit is constructed as a chip-like laminated component, which includes capacitor electrodes 21, 22, 23, etc.
4. It is composed of a sintered body in which a mask insulator layer 25, a jumper conductor 26 for bypassing other wiring and circuit elements, a lead-out conductor 27, etc. are laminated, and solder is formed by applying conductive paste and baking at low temperature. A suitable external terminal 28 is provided. In addition, transistors 29 and the like are mounted on the surface, and wiring 30
is connected by solder. Furthermore, a resistive film, a diode, an inductor, etc. can be mounted. For example, a circuit as shown in FIG. 3 can be constructed as a single chip-like component. FIG. 3 shows an amplifier circuit. The external electrodes 28 formed around the periphery are mounted and fixed to the motherboard (FIG. 1) by soldering.

With the configuration as described above, the various benefits mentioned above can be obtained, and it will greatly contribute to this field.

[Brief explanation of the drawing]

Figure 1 is a plan view of the composite electronic circuit of the present invention;
The figure is an enlarged perspective view showing a partially cut away partial electronic circuit. FIG. 3 shows an example of a circuit to which the present invention is applied. The main parts in the figure are as follows. 1, 2, 3, 4, 5, 6, 7, 8: Functional partial electronic circuit, 10: Motherboard, 11: Printed wiring, 12: Internal wiring.

Claims (1)

[Scope of utility model registration request] An electronic circuit with one final function is divided into functional parts, and each functional part is mounted on a single laminated board, and the intersections of internal wiring required for each functional part are insulated. The connection terminals are formed in a thin layer on the outer periphery of the multilayer board, and the multilayer board is mounted at a predetermined position on a printed wiring board, and the connection terminals and the printed A composite electronic circuit formed by soldering a wiring board and connecting wiring between the laminated boards provided on a wiring board.