JPH0220717B2 - - Google Patents
Info
- Publication number
- JPH0220717B2 JPH0220717B2 JP56009781A JP978181A JPH0220717B2 JP H0220717 B2 JPH0220717 B2 JP H0220717B2 JP 56009781 A JP56009781 A JP 56009781A JP 978181 A JP978181 A JP 978181A JP H0220717 B2 JPH0220717 B2 JP H0220717B2
- Authority
- JP
- Japan
- Prior art keywords
- tin
- alloy
- copper
- plating
- solderability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP978181A JPS57123997A (en) | 1981-01-26 | 1981-01-26 | Surface treatment of tin or tin alloy plated material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP978181A JPS57123997A (en) | 1981-01-26 | 1981-01-26 | Surface treatment of tin or tin alloy plated material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57123997A JPS57123997A (en) | 1982-08-02 |
JPH0220717B2 true JPH0220717B2 (enEXAMPLES) | 1990-05-10 |
Family
ID=11729775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP978181A Granted JPS57123997A (en) | 1981-01-26 | 1981-01-26 | Surface treatment of tin or tin alloy plated material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57123997A (enEXAMPLES) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2014798B1 (en) * | 2007-07-10 | 2016-04-13 | ATOTECH Deutschland GmbH | Solution and process for increasing the solderability and corrosion resistance of metal or metal alloy surface |
WO2010081833A2 (en) * | 2009-01-14 | 2010-07-22 | Atotech Deutschland Gmbh | Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surface |
JP7497138B2 (ja) * | 2018-12-11 | 2024-06-10 | Fdk株式会社 | アルカリ電池用負極集電子、アルカリ電池用負極集電子の製造方法、およびアルカリ電池 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53146237A (en) * | 1977-05-27 | 1978-12-20 | Toyo Eazooru Kougiyou Kk | Air sol component containing metal anticorrosive |
JPS592469B2 (ja) * | 1979-01-06 | 1984-01-18 | 日本油脂株式会社 | 防錆剤組成物 |
-
1981
- 1981-01-26 JP JP978181A patent/JPS57123997A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57123997A (en) | 1982-08-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101298780B1 (ko) | 전자제품에 은도금 | |
EP1224339B1 (en) | Selective deposition of organic solderability preservative on copper | |
JPH08255968A (ja) | プリント回路板の製造 | |
WO1983000704A1 (en) | Copper-containing articles with a corrosion inhibitor coating and methods of producing the coating | |
JP5422558B2 (ja) | 金属又は金属合金表面のはんだ付け性及び耐食性強化溶液および方法 | |
KR20150085542A (ko) | 구리 및 구리합금의 표면에 피막을 형성하는 프리플럭스 조성물 | |
WO1991002110A1 (en) | Treatment to reduce solder plating whisker formation | |
JP3277025B2 (ja) | 銅及び銅合金の表面処理剤 | |
JP4647073B2 (ja) | 銅及び銅合金のはんだ付け方法 | |
JP4215235B2 (ja) | Sn合金に対する表面処理剤及び表面処理方法 | |
JPH0220717B2 (enEXAMPLES) | ||
CN102282294A (zh) | 增加金属或金属合金表面的钎焊性和耐腐蚀性的溶液和方法 | |
JPH04173983A (ja) | 銅及び銅合金の表面処理方法 | |
JP3367743B2 (ja) | 銅及び銅合金の表面処理剤 | |
JPH04206681A (ja) | 印刷配線板の表面処理方法及び印刷配線板 | |
JPWO2005085498A1 (ja) | 金属の表面処理剤 | |
US547381A (en) | Robert mcknight | |
JPH06268356A (ja) | プリフラックスの使用方法およびプリント配線板の製造方法 | |
JPS62260071A (ja) | 錫又は錫合金メツキ材の表面処理方法 | |
JP3668767B2 (ja) | はんだ、無電解はんだ、銀、ニッケル、亜鉛等の金属の表面 処理方法 | |
JP3173982B2 (ja) | 鉛無含有半田めっき浴およびそれにより得られた半田めっき皮膜 | |
JP2834884B2 (ja) | 銅及び銅合金の表面処理方法 | |
JPH04183874A (ja) | 銅及び銅合金の表面処理方法 | |
JP3398296B2 (ja) | 銅及び銅合金の表面処理剤 | |
JPH01290778A (ja) | めっき鋼板の後処理方法 |