JPH0220370U - - Google Patents
Info
- Publication number
- JPH0220370U JPH0220370U JP9940888U JP9940888U JPH0220370U JP H0220370 U JPH0220370 U JP H0220370U JP 9940888 U JP9940888 U JP 9940888U JP 9940888 U JP9940888 U JP 9940888U JP H0220370 U JPH0220370 U JP H0220370U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrates
- chamfered
- corners
- portions
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
Description
第1図は本考案による電子回路部品の斜視図、
第2図は従来の電子回路部品の斜視図である。
〔符号の説明〕、1,2……基板、4a〜4d
……面取り部分、5a〜5d……対応角部。
FIG. 1 is a perspective view of an electronic circuit component according to the present invention;
FIG. 2 is a perspective view of a conventional electronic circuit component. [Explanation of symbols], 1, 2...Substrate, 4a to 4d
... Chamfered portion, 5a to 5d... Corresponding corner portion.
Claims (1)
基板1,2が接着剤で貼り合わされた構成からな
り、且つ少なくとも一方の前記絶縁基板1の角部
が面取りされ、該面取り部分4a,4bを介して
他方の前記絶縁基板2の対応角部5c,5dが露
呈していることを特徴とした電子回路部品の構造
。 (2) 前記電子回路部品は前記絶縁基板1,2の
側辺より導出した外部引出し端子3を回路基板上
に接続する基板実装型で、矩形形状からなる前記
絶縁基板1,2は相反する該絶縁基板1,2の対
角線上の角部が夫々面取りされ、且つ貼り合わさ
れた該絶縁基板の四隅において前記面取り部分4
a〜4dを介して前記対応角部5a〜5dが露呈
していることを特徴とした請求項第1項記載の電
子部品の構造。[Claims for Utility Model Registration] (1) Consisting of at least two insulating substrates 1 and 2 on which circuit elements are mounted and bonded together with an adhesive, and at least one corner of the insulating substrate 1 is chamfered. A structure of an electronic circuit component, characterized in that corresponding corner portions 5c and 5d of the other insulating substrate 2 are exposed through the chamfered portions 4a and 4b. (2) The electronic circuit component is a board-mounted type in which the external lead-out terminals 3 led out from the sides of the insulating substrates 1 and 2 are connected to the circuit board, and the insulating substrates 1 and 2, which are rectangular in shape, have opposite components. The diagonal corners of the insulating substrates 1 and 2 are chamfered, and the chamfered portions 4 are formed at the four corners of the bonded insulating substrates.
2. The structure of an electronic component according to claim 1, wherein the corresponding corner portions 5a to 5d are exposed through the corners a to 4d.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9940888U JPH0220370U (en) | 1988-07-27 | 1988-07-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9940888U JPH0220370U (en) | 1988-07-27 | 1988-07-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0220370U true JPH0220370U (en) | 1990-02-09 |
Family
ID=31326539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9940888U Pending JPH0220370U (en) | 1988-07-27 | 1988-07-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0220370U (en) |
-
1988
- 1988-07-27 JP JP9940888U patent/JPH0220370U/ja active Pending
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