JPH0220358B2 - - Google Patents

Info

Publication number
JPH0220358B2
JPH0220358B2 JP61170260A JP17026086A JPH0220358B2 JP H0220358 B2 JPH0220358 B2 JP H0220358B2 JP 61170260 A JP61170260 A JP 61170260A JP 17026086 A JP17026086 A JP 17026086A JP H0220358 B2 JPH0220358 B2 JP H0220358B2
Authority
JP
Japan
Prior art keywords
solder
low
temperature
temperature solder
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61170260A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6326294A (ja
Inventor
Tetsuo Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON SUPERIASHA KK
Original Assignee
NIPPON SUPERIASHA KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON SUPERIASHA KK filed Critical NIPPON SUPERIASHA KK
Priority to JP17026086A priority Critical patent/JPS6326294A/ja
Priority to US07/061,220 priority patent/US4816219A/en
Priority to DE19873720594 priority patent/DE3720594A1/de
Priority to GB8716917A priority patent/GB2192898B/en
Publication of JPS6326294A publication Critical patent/JPS6326294A/ja
Publication of JPH0220358B2 publication Critical patent/JPH0220358B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP17026086A 1986-07-18 1986-07-18 低温はんだ Granted JPS6326294A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP17026086A JPS6326294A (ja) 1986-07-18 1986-07-18 低温はんだ
US07/061,220 US4816219A (en) 1986-07-18 1987-06-12 Low-temperature solder composition
DE19873720594 DE3720594A1 (de) 1986-07-18 1987-06-22 Bei tiefer temperatur einsetzbare loetmetall-zusammensetzung
GB8716917A GB2192898B (en) 1986-07-18 1987-07-17 Low-temperature solder composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17026086A JPS6326294A (ja) 1986-07-18 1986-07-18 低温はんだ

Publications (2)

Publication Number Publication Date
JPS6326294A JPS6326294A (ja) 1988-02-03
JPH0220358B2 true JPH0220358B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-05-09

Family

ID=15901642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17026086A Granted JPS6326294A (ja) 1986-07-18 1986-07-18 低温はんだ

Country Status (1)

Country Link
JP (1) JPS6326294A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3136741A1 (de) * 1981-09-16 1983-03-31 Vdo Adolf Schindling Ag, 6000 Frankfurt Fluessigkristallzelle

Also Published As

Publication number Publication date
JPS6326294A (ja) 1988-02-03

Similar Documents

Publication Publication Date Title
EP1231015B1 (en) Lead-free solder and solder joint
JP3199674B2 (ja) ソルダ合金
JPH07227690A (ja) はんだ合金及びターゲット構造体
JPH10193169A (ja) 無鉛はんだ合金
JPS6314056B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH02179388A (ja) 低融点Ａｇはんだ
JPH0653901B2 (ja) 電子電気機器用銅合金
JPS59170231A (ja) 高力導電銅合金
JPS6160846A (ja) 半導体装置用銅合金リ−ド材
JPS6239218B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS6215622B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS5839912B2 (ja) リ−ド用銅合金材の製造方法
JPH0649238B2 (ja) Ｃｕ系材料接合用はんだ及びはんだ付方法
JPH0220358B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN100413633C (zh) 一种抗氧化的锡铅系合金焊料
JP2797846B2 (ja) 樹脂封止型半導体装置のＣｕ合金製リードフレーム材
JP3597607B2 (ja) はんだ合金及びペ−スト状はんだ
JP2004122223A (ja) 電子部品および電子部品の製造方法
JPH0149597B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2910527B2 (ja) 高温はんだ
JPH0422595A (ja) クリームはんだ
JPH0437524B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2001225188A (ja) ハンダ合金
JP2001179483A (ja) 電子部品の実装構造体およびその製造方法
JPH0357175B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)