JPH02201958A - Gate array type semiconductor integrated circuit device - Google Patents

Gate array type semiconductor integrated circuit device

Info

Publication number
JPH02201958A
JPH02201958A JP2125389A JP2125389A JPH02201958A JP H02201958 A JPH02201958 A JP H02201958A JP 2125389 A JP2125389 A JP 2125389A JP 2125389 A JP2125389 A JP 2125389A JP H02201958 A JPH02201958 A JP H02201958A
Authority
JP
Japan
Prior art keywords
wiring
chip
wiring channel
central portion
gate array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2125389A
Other languages
Japanese (ja)
Inventor
Yoshikazu Kawasaki
川嵜 嘉和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC IC Microcomputer Systems Co Ltd
Original Assignee
NEC IC Microcomputer Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC IC Microcomputer Systems Co Ltd filed Critical NEC IC Microcomputer Systems Co Ltd
Priority to JP2125389A priority Critical patent/JPH02201958A/en
Publication of JPH02201958A publication Critical patent/JPH02201958A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve the efficiency of wiring in a circuit layout and shorten a design interval by making greater the number of wiring channels in a wiring channel region at a chip center than those in wiring channel regions outside the chip center. CONSTITUTION:Wiring channel regions 13-3a, 13-2a, and 13-1 are widened as they go toward the central portion. Further, a master chip (substrate) 2 is provided where the number of wiring channels in the wiring channel region 13-1 at the chip central portion is greater than that in the wiring channel regions 13-2a, 13-2b, 13-3a, and 13-3b other than the chip central portion. Accordingly, even if layouts and wirings are performed from the chip central portion and the wirings are complicated at the chip central portion to result in any non- wired portion, the probability of that trouble is reduced and a need of any manual design is also reduced. Hereby, the efficiency of the wirings in a circuit layout is improved and a design interval is shortened.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体集積回路装置に関し、特にゲートアレイ
方式で設計される半導体集積回路装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit device, and particularly to a semiconductor integrated circuit device designed using a gate array method.

〔従来の技術〕[Conventional technology]

従来のゲートアレイ方式による半導体集積回路装置では
、ゲートアレイの下地に標準化された配線チャネル領域
があらかじめ設けられている。例えば第2図に示す様に
、セルアレイ2の両側に配線チャネル領域3−1.・・
・があり、各配線チャネル領域に配線チャネル4が設け
られている。また配線チャネル領域中の配線チャネルの
本数は全て同一であるように構成されていた。
In a conventional semiconductor integrated circuit device using a gate array method, a standardized wiring channel region is provided in advance under the gate array. For example, as shown in FIG. 2, wiring channel regions 3-1.・・・
*, and a wiring channel 4 is provided in each wiring channel region. Further, the number of wiring channels in the wiring channel region was configured to be all the same.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来のゲートアレイ方式の半導体集積回路装置
では、配線チャネル領域の配線チャネルがどの配線チャ
ネル領域に於いても、同本数になっている為、ゲートア
レイで設計したい回路を自動レイアウトする際には、チ
ップの中央部分から配置及び配線がされるので、チップ
の中央部分に於いては、大規模化とともに配線が混雑し
、配線チャネル数の不足により、自動で配線できなくな
り、人手によるレイアウトを必要とすることが多くなり
、設計期間が増加してしまうという欠点がらる。
In the conventional gate array type semiconductor integrated circuit device described above, the number of wiring channels in the wiring channel area is the same regardless of the wiring channel area, so when automatically laying out the circuit you want to design using the gate array. Since the layout and wiring are done from the center of the chip, the wiring in the center of the chip becomes congested as the scale increases, and due to the lack of wiring channels, automatic routing becomes impossible, and manual layout is required. The disadvantage is that more items are required and the design period increases.

本発明の目的は、回路レイアウトにおける配線処理の効
率がよく、設計期間を短縮することができるゲートアレ
イ方式の半導体集積回路装置を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a gate array type semiconductor integrated circuit device that has high efficiency in wiring processing in circuit layout and can shorten the design period.

〔課題を解決するための手段〕[Means to solve the problem]

本発明のゲートアレイ方式の半導体集積回路装置は、配
線チャネル領域中の横方向の配線チャネルの本数をチッ
プ中央部に近い配線チャネル領域はどチップ周辺部に比
べて段階的に多く設けたというものである。
In the gate array type semiconductor integrated circuit device of the present invention, the number of horizontal wiring channels in the wiring channel region is gradually increased in the wiring channel region near the center of the chip compared to the periphery of the chip. It is.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図は、本発明の一実施例を示すチップのレイアウト
図である。
FIG. 1 is a layout diagram of a chip showing an embodiment of the present invention.

本実施例は、配線チャネル領域が13−3a。In this embodiment, the wiring channel region is 13-3a.

13−2a、13−1と中央部分に行くに従って広くな
っており、チップ中央部分の配線チャネル領域13−1
の配線チャネル数が、チップ中央部分以外の配線チャネ
ル領域13−2a、132b、13−3a、1.3−3
bの配線チャネル数より多いマスクチップ(下地)2を
有している。
13-2a and 13-1, which become wider toward the center, and the wiring channel region 13-1 in the center of the chip.
The number of wiring channels in the wiring channel regions 13-2a, 132b, 13-3a, 1.3-3 other than the central part of the chip is
It has more mask chips (base) 2 than the number of wiring channels in b.

このような構成とすることにより、チップ中央部分から
配置及び配線され、チップ中央部分で配線が混雑し未配
線が出たとしてもその発生確率は小さく人手による設計
の必要度は少なくなる。
With such a configuration, the wiring is arranged and wired starting from the central part of the chip, and even if the wiring becomes congested in the central part of the chip and there are unwired lines, the probability of this occurring is small and the need for manual design is reduced.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明は基本セルをアレイ状に複
数個配列したセルアレイの間の配線チャネル領域の配線
チャネル数を配線チャネル領域によって異なる構成とし
、チップ中央部分の配線チャネル領域の配線チャネル数
をチップ中央部分以外の配線チャネル領域の配線チャネ
ル数より多くすることにより、回路レイアウトにおける
配線処理の効率がよくなり、人手による設計の必要度を
少くでき、設計期間を短縮できる効果がある。
As explained above, the present invention has a configuration in which the number of wiring channels in the wiring channel area between the cell arrays in which a plurality of basic cells are arranged in an array is different depending on the wiring channel area, and the number of wiring channels in the wiring channel area in the central part of the chip is configured to be different depending on the wiring channel area. By making the number of wiring channels larger than the number of wiring channels in the wiring channel region other than the central part of the chip, the efficiency of wiring processing in circuit layout is improved, the necessity of manual design can be reduced, and the design period can be shortened.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例を示すチップのレイアウト図
、第2図は従来例を示すマスタチップのレイアウト図で
ある。 1−1〜1−4.11−1〜11−4・・・電源線、2
,12・・・セルアレイ、3−1.3−2a。 −3−3b、  13−1. 13−2a、  −−−
13−3b・・・配線チャネル領域、4,14・・・配
線チャネル、5.15・・・ポンディングパッド。
FIG. 1 is a chip layout diagram showing an embodiment of the present invention, and FIG. 2 is a master chip layout diagram showing a conventional example. 1-1 to 1-4.11-1 to 11-4...power line, 2
, 12...Cell array, 3-1.3-2a. -3-3b, 13-1. 13-2a, ---
13-3b... Wiring channel region, 4, 14... Wiring channel, 5.15... Bonding pad.

Claims (1)

【特許請求の範囲】[Claims] 配線チャネル領域中の横方向の配線チャネルの本数をチ
ップ中央部に近い配線チャネル領域ほどチップ周辺部に
比べて段階的に多く設けたことを特徴とするゲートアレ
イ方式の半導体集積回路装置。
A gate array type semiconductor integrated circuit device characterized in that the number of horizontal wiring channels in the wiring channel region is gradually increased in the wiring channel region closer to the center of the chip than in the periphery of the chip.
JP2125389A 1989-01-30 1989-01-30 Gate array type semiconductor integrated circuit device Pending JPH02201958A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2125389A JPH02201958A (en) 1989-01-30 1989-01-30 Gate array type semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2125389A JPH02201958A (en) 1989-01-30 1989-01-30 Gate array type semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPH02201958A true JPH02201958A (en) 1990-08-10

Family

ID=12049920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2125389A Pending JPH02201958A (en) 1989-01-30 1989-01-30 Gate array type semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPH02201958A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10209073A1 (en) * 2002-02-28 2003-09-18 Infineon Technologies Ag Semiconductor chip, and method and device for producing the semiconductor chip
US6870206B2 (en) 2001-11-27 2005-03-22 Infineon Technologies Ag Semiconductor chip, fabrication method, and device for fabricating a semiconductor chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6870206B2 (en) 2001-11-27 2005-03-22 Infineon Technologies Ag Semiconductor chip, fabrication method, and device for fabricating a semiconductor chip
DE10209073A1 (en) * 2002-02-28 2003-09-18 Infineon Technologies Ag Semiconductor chip, and method and device for producing the semiconductor chip

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