JPH02201958A - Gate array type semiconductor integrated circuit device - Google Patents
Gate array type semiconductor integrated circuit deviceInfo
- Publication number
- JPH02201958A JPH02201958A JP2125389A JP2125389A JPH02201958A JP H02201958 A JPH02201958 A JP H02201958A JP 2125389 A JP2125389 A JP 2125389A JP 2125389 A JP2125389 A JP 2125389A JP H02201958 A JPH02201958 A JP H02201958A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- chip
- wiring channel
- central portion
- gate array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体集積回路装置に関し、特にゲートアレイ
方式で設計される半導体集積回路装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit device, and particularly to a semiconductor integrated circuit device designed using a gate array method.
従来のゲートアレイ方式による半導体集積回路装置では
、ゲートアレイの下地に標準化された配線チャネル領域
があらかじめ設けられている。例えば第2図に示す様に
、セルアレイ2の両側に配線チャネル領域3−1.・・
・があり、各配線チャネル領域に配線チャネル4が設け
られている。また配線チャネル領域中の配線チャネルの
本数は全て同一であるように構成されていた。In a conventional semiconductor integrated circuit device using a gate array method, a standardized wiring channel region is provided in advance under the gate array. For example, as shown in FIG. 2, wiring channel regions 3-1.・・・
*, and a wiring channel 4 is provided in each wiring channel region. Further, the number of wiring channels in the wiring channel region was configured to be all the same.
上述した従来のゲートアレイ方式の半導体集積回路装置
では、配線チャネル領域の配線チャネルがどの配線チャ
ネル領域に於いても、同本数になっている為、ゲートア
レイで設計したい回路を自動レイアウトする際には、チ
ップの中央部分から配置及び配線がされるので、チップ
の中央部分に於いては、大規模化とともに配線が混雑し
、配線チャネル数の不足により、自動で配線できなくな
り、人手によるレイアウトを必要とすることが多くなり
、設計期間が増加してしまうという欠点がらる。In the conventional gate array type semiconductor integrated circuit device described above, the number of wiring channels in the wiring channel area is the same regardless of the wiring channel area, so when automatically laying out the circuit you want to design using the gate array. Since the layout and wiring are done from the center of the chip, the wiring in the center of the chip becomes congested as the scale increases, and due to the lack of wiring channels, automatic routing becomes impossible, and manual layout is required. The disadvantage is that more items are required and the design period increases.
本発明の目的は、回路レイアウトにおける配線処理の効
率がよく、設計期間を短縮することができるゲートアレ
イ方式の半導体集積回路装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a gate array type semiconductor integrated circuit device that has high efficiency in wiring processing in circuit layout and can shorten the design period.
本発明のゲートアレイ方式の半導体集積回路装置は、配
線チャネル領域中の横方向の配線チャネルの本数をチッ
プ中央部に近い配線チャネル領域はどチップ周辺部に比
べて段階的に多く設けたというものである。In the gate array type semiconductor integrated circuit device of the present invention, the number of horizontal wiring channels in the wiring channel region is gradually increased in the wiring channel region near the center of the chip compared to the periphery of the chip. It is.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図は、本発明の一実施例を示すチップのレイアウト
図である。FIG. 1 is a layout diagram of a chip showing an embodiment of the present invention.
本実施例は、配線チャネル領域が13−3a。In this embodiment, the wiring channel region is 13-3a.
13−2a、13−1と中央部分に行くに従って広くな
っており、チップ中央部分の配線チャネル領域13−1
の配線チャネル数が、チップ中央部分以外の配線チャネ
ル領域13−2a、132b、13−3a、1.3−3
bの配線チャネル数より多いマスクチップ(下地)2を
有している。13-2a and 13-1, which become wider toward the center, and the wiring channel region 13-1 in the center of the chip.
The number of wiring channels in the wiring channel regions 13-2a, 132b, 13-3a, 1.3-3 other than the central part of the chip is
It has more mask chips (base) 2 than the number of wiring channels in b.
このような構成とすることにより、チップ中央部分から
配置及び配線され、チップ中央部分で配線が混雑し未配
線が出たとしてもその発生確率は小さく人手による設計
の必要度は少なくなる。With such a configuration, the wiring is arranged and wired starting from the central part of the chip, and even if the wiring becomes congested in the central part of the chip and there are unwired lines, the probability of this occurring is small and the need for manual design is reduced.
以上説明したように、本発明は基本セルをアレイ状に複
数個配列したセルアレイの間の配線チャネル領域の配線
チャネル数を配線チャネル領域によって異なる構成とし
、チップ中央部分の配線チャネル領域の配線チャネル数
をチップ中央部分以外の配線チャネル領域の配線チャネ
ル数より多くすることにより、回路レイアウトにおける
配線処理の効率がよくなり、人手による設計の必要度を
少くでき、設計期間を短縮できる効果がある。As explained above, the present invention has a configuration in which the number of wiring channels in the wiring channel area between the cell arrays in which a plurality of basic cells are arranged in an array is different depending on the wiring channel area, and the number of wiring channels in the wiring channel area in the central part of the chip is configured to be different depending on the wiring channel area. By making the number of wiring channels larger than the number of wiring channels in the wiring channel region other than the central part of the chip, the efficiency of wiring processing in circuit layout is improved, the necessity of manual design can be reduced, and the design period can be shortened.
第1図は本発明の一実施例を示すチップのレイアウト図
、第2図は従来例を示すマスタチップのレイアウト図で
ある。
1−1〜1−4.11−1〜11−4・・・電源線、2
,12・・・セルアレイ、3−1.3−2a。
−3−3b、 13−1. 13−2a、 −−−
13−3b・・・配線チャネル領域、4,14・・・配
線チャネル、5.15・・・ポンディングパッド。FIG. 1 is a chip layout diagram showing an embodiment of the present invention, and FIG. 2 is a master chip layout diagram showing a conventional example. 1-1 to 1-4.11-1 to 11-4...power line, 2
, 12...Cell array, 3-1.3-2a. -3-3b, 13-1. 13-2a, ---
13-3b... Wiring channel region, 4, 14... Wiring channel, 5.15... Bonding pad.
Claims (1)
ップ中央部に近い配線チャネル領域ほどチップ周辺部に
比べて段階的に多く設けたことを特徴とするゲートアレ
イ方式の半導体集積回路装置。A gate array type semiconductor integrated circuit device characterized in that the number of horizontal wiring channels in the wiring channel region is gradually increased in the wiring channel region closer to the center of the chip than in the periphery of the chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2125389A JPH02201958A (en) | 1989-01-30 | 1989-01-30 | Gate array type semiconductor integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2125389A JPH02201958A (en) | 1989-01-30 | 1989-01-30 | Gate array type semiconductor integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02201958A true JPH02201958A (en) | 1990-08-10 |
Family
ID=12049920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2125389A Pending JPH02201958A (en) | 1989-01-30 | 1989-01-30 | Gate array type semiconductor integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02201958A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10209073A1 (en) * | 2002-02-28 | 2003-09-18 | Infineon Technologies Ag | Semiconductor chip, and method and device for producing the semiconductor chip |
US6870206B2 (en) | 2001-11-27 | 2005-03-22 | Infineon Technologies Ag | Semiconductor chip, fabrication method, and device for fabricating a semiconductor chip |
-
1989
- 1989-01-30 JP JP2125389A patent/JPH02201958A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6870206B2 (en) | 2001-11-27 | 2005-03-22 | Infineon Technologies Ag | Semiconductor chip, fabrication method, and device for fabricating a semiconductor chip |
DE10209073A1 (en) * | 2002-02-28 | 2003-09-18 | Infineon Technologies Ag | Semiconductor chip, and method and device for producing the semiconductor chip |
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