Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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KOWA SANGYO
Original Assignee
KOWA SANGYO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KOWA SANGYOfiledCriticalKOWA SANGYO
Priority to JP16248384ApriorityCriticalpatent/JPS60149139A/ja
Publication of JPS60149139ApublicationCriticalpatent/JPS60149139A/ja
Publication of JPH0220143B2publicationCriticalpatent/JPH0220143B2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Heat insulating board for pillars or beams of buildings, provided with grooves allowing the separation of portions of the board having adequate dimensions so as to panel one side of the above-mentioned pillars or beams