JPH02200410A - 浮遊インサート成形方法及び装置 - Google Patents

浮遊インサート成形方法及び装置

Info

Publication number
JPH02200410A
JPH02200410A JP1019597A JP1959789A JPH02200410A JP H02200410 A JPH02200410 A JP H02200410A JP 1019597 A JP1019597 A JP 1019597A JP 1959789 A JP1959789 A JP 1959789A JP H02200410 A JPH02200410 A JP H02200410A
Authority
JP
Japan
Prior art keywords
floating insert
mold
molds
movable
floating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1019597A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0560773B2 (enrdf_load_stackoverflow
Inventor
Michio Kaneko
金子 道夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP1019597A priority Critical patent/JPH02200410A/ja
Publication of JPH02200410A publication Critical patent/JPH02200410A/ja
Publication of JPH0560773B2 publication Critical patent/JPH0560773B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Fish Paste Products (AREA)
  • Formation And Processing Of Food Products (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Molding Of Porous Articles (AREA)
  • Fertilizers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP1019597A 1989-01-31 1989-01-31 浮遊インサート成形方法及び装置 Granted JPH02200410A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1019597A JPH02200410A (ja) 1989-01-31 1989-01-31 浮遊インサート成形方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1019597A JPH02200410A (ja) 1989-01-31 1989-01-31 浮遊インサート成形方法及び装置

Publications (2)

Publication Number Publication Date
JPH02200410A true JPH02200410A (ja) 1990-08-08
JPH0560773B2 JPH0560773B2 (enrdf_load_stackoverflow) 1993-09-03

Family

ID=12003642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1019597A Granted JPH02200410A (ja) 1989-01-31 1989-01-31 浮遊インサート成形方法及び装置

Country Status (1)

Country Link
JP (1) JPH02200410A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004058478A1 (ja) * 2002-12-25 2004-07-15 Honda Motor Co., Ltd. 射出成形方法及びその装置
WO2006126438A1 (ja) * 2005-05-24 2006-11-30 Murata Manufacturing Co., Ltd. インサートモールド品の製造方法および製造装置
JP2012152975A (ja) * 2011-01-25 2012-08-16 Kojima Press Industry Co Ltd ダイレクト成形機
JP2014048945A (ja) * 2012-08-31 2014-03-17 Apic Yamada Corp Rfidタグ、rfidタグの製造方法、金型、および、非接触給電アンテナ部品
CN114506009A (zh) * 2022-01-30 2022-05-17 安克创新科技股份有限公司 注塑模具、数据线外模的制作方法及数据线

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004058478A1 (ja) * 2002-12-25 2004-07-15 Honda Motor Co., Ltd. 射出成形方法及びその装置
EP2085204A3 (en) * 2002-12-25 2010-01-06 Honda Motor Co., Ltd. Injection-molding method and apparatus
US7749419B2 (en) 2002-12-25 2010-07-06 Honda Motor Co., Ltd. Method and device for injection molding
US7947208B2 (en) 2002-12-25 2011-05-24 Honda Motor Co., Ltd. Injection-molding method and apparatus
WO2006126438A1 (ja) * 2005-05-24 2006-11-30 Murata Manufacturing Co., Ltd. インサートモールド品の製造方法および製造装置
US8057723B2 (en) 2005-05-24 2011-11-15 Murata Manufacturing Co., Ltd. Method of manufacturing insert-molded article and apparatus therefor
JP2012152975A (ja) * 2011-01-25 2012-08-16 Kojima Press Industry Co Ltd ダイレクト成形機
JP2014048945A (ja) * 2012-08-31 2014-03-17 Apic Yamada Corp Rfidタグ、rfidタグの製造方法、金型、および、非接触給電アンテナ部品
CN114506009A (zh) * 2022-01-30 2022-05-17 安克创新科技股份有限公司 注塑模具、数据线外模的制作方法及数据线
CN114506009B (zh) * 2022-01-30 2023-12-19 安克创新科技股份有限公司 注塑模具、数据线外模的制作方法及数据线

Also Published As

Publication number Publication date
JPH0560773B2 (enrdf_load_stackoverflow) 1993-09-03

Similar Documents

Publication Publication Date Title
US7681308B2 (en) Fabrication method of semiconductor integrated circuit device
US5665281A (en) Method for molding using venting pin
US20090068302A1 (en) Resin Sealing and Molding Apparatus for Electronic Component
KR940000740B1 (ko) 레진몰드 반도체의 제조방법 및 장치
US5302101A (en) Mold for resin-packaging electronic components
US6022583A (en) Method of encapsulating a wire bonded die
EP0342237B1 (en) Floating insert molding method and apparatus
JPH02200410A (ja) 浮遊インサート成形方法及び装置
US5049526A (en) Method for fabricating semiconductor device including package
KR101667854B1 (ko) 수지 밀봉 방법 및 수지 밀봉 장치
WO2020253147A1 (zh) 一种sip封装的屏蔽工艺
WO1992000178A1 (en) Method of and device for molding floating insert
WO2021084827A1 (ja) ブリスター包装機及びブリスターパックの製造方法
US20050110191A1 (en) Package method of phosphoric light emitting diode
CN101018658B (zh) 用调节气体封装电子元件的方法及装置
US6428731B1 (en) Mould part, mould and method for encapsulating electronic components mounted on a carrier
CN109920779A (zh) 一种封装产品电磁屏蔽层的制备方法及封装产品
KR100304680B1 (ko) 반도체장치및그제조방법
JP4102534B2 (ja) 電子部品の樹脂封止成形方法
CN102456582A (zh) 用于制造模制引线框架的工艺
CN209071313U (zh) 具有六面式保护层的晶片封装结构
CN216860291U (zh) 一种锦纶6成品切片的回投装置
US20250079191A1 (en) Packaging methods and packaging apparatus
JP3144939U (ja) 包装装置における物品の落し込み機構
CN101093555A (zh) 电子装置的制法