JPH02200410A - 浮遊インサート成形方法及び装置 - Google Patents
浮遊インサート成形方法及び装置Info
- Publication number
- JPH02200410A JPH02200410A JP1019597A JP1959789A JPH02200410A JP H02200410 A JPH02200410 A JP H02200410A JP 1019597 A JP1019597 A JP 1019597A JP 1959789 A JP1959789 A JP 1959789A JP H02200410 A JPH02200410 A JP H02200410A
- Authority
- JP
- Japan
- Prior art keywords
- floating insert
- mold
- molds
- movable
- floating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007667 floating Methods 0.000 title claims abstract description 215
- 238000000465 moulding Methods 0.000 title claims abstract description 87
- 238000000034 method Methods 0.000 title claims abstract description 56
- 239000000463 material Substances 0.000 claims abstract description 63
- 239000012768 molten material Substances 0.000 claims abstract description 58
- 235000013305 food Nutrition 0.000 claims description 20
- 238000006073 displacement reaction Methods 0.000 claims description 14
- 239000012778 molding material Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 239000013013 elastic material Substances 0.000 claims description 8
- 229920003002 synthetic resin Polymers 0.000 claims description 8
- 239000000057 synthetic resin Substances 0.000 claims description 8
- 235000015097 nutrients Nutrition 0.000 claims description 6
- 238000009331 sowing Methods 0.000 claims description 6
- 230000035784 germination Effects 0.000 claims description 5
- 238000012423 maintenance Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 2
- 230000014759 maintenance of location Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 21
- 239000012792 core layer Substances 0.000 abstract description 17
- 238000012546 transfer Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000003908 quality control method Methods 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 241000209094 Oryza Species 0.000 description 3
- 235000007164 Oryza sativa Nutrition 0.000 description 3
- 241000209140 Triticum Species 0.000 description 3
- 235000021307 Triticum Nutrition 0.000 description 3
- 239000006261 foam material Substances 0.000 description 3
- 235000012041 food component Nutrition 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 235000009566 rice Nutrition 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000011343 solid material Substances 0.000 description 3
- 241000196324 Embryophyta Species 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 244000144972 livestock Species 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000012899 standard injection Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 240000001913 Atriplex hortensis Species 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000008394 flocculating agent Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 235000016709 nutrition Nutrition 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 235000021067 refined food Nutrition 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002195 soluble material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Fish Paste Products (AREA)
- Formation And Processing Of Food Products (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Molding Of Porous Articles (AREA)
- Fertilizers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1019597A JPH02200410A (ja) | 1989-01-31 | 1989-01-31 | 浮遊インサート成形方法及び装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1019597A JPH02200410A (ja) | 1989-01-31 | 1989-01-31 | 浮遊インサート成形方法及び装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02200410A true JPH02200410A (ja) | 1990-08-08 |
JPH0560773B2 JPH0560773B2 (enrdf_load_stackoverflow) | 1993-09-03 |
Family
ID=12003642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1019597A Granted JPH02200410A (ja) | 1989-01-31 | 1989-01-31 | 浮遊インサート成形方法及び装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02200410A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004058478A1 (ja) * | 2002-12-25 | 2004-07-15 | Honda Motor Co., Ltd. | 射出成形方法及びその装置 |
WO2006126438A1 (ja) * | 2005-05-24 | 2006-11-30 | Murata Manufacturing Co., Ltd. | インサートモールド品の製造方法および製造装置 |
JP2012152975A (ja) * | 2011-01-25 | 2012-08-16 | Kojima Press Industry Co Ltd | ダイレクト成形機 |
JP2014048945A (ja) * | 2012-08-31 | 2014-03-17 | Apic Yamada Corp | Rfidタグ、rfidタグの製造方法、金型、および、非接触給電アンテナ部品 |
CN114506009A (zh) * | 2022-01-30 | 2022-05-17 | 安克创新科技股份有限公司 | 注塑模具、数据线外模的制作方法及数据线 |
-
1989
- 1989-01-31 JP JP1019597A patent/JPH02200410A/ja active Granted
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004058478A1 (ja) * | 2002-12-25 | 2004-07-15 | Honda Motor Co., Ltd. | 射出成形方法及びその装置 |
EP2085204A3 (en) * | 2002-12-25 | 2010-01-06 | Honda Motor Co., Ltd. | Injection-molding method and apparatus |
US7749419B2 (en) | 2002-12-25 | 2010-07-06 | Honda Motor Co., Ltd. | Method and device for injection molding |
US7947208B2 (en) | 2002-12-25 | 2011-05-24 | Honda Motor Co., Ltd. | Injection-molding method and apparatus |
WO2006126438A1 (ja) * | 2005-05-24 | 2006-11-30 | Murata Manufacturing Co., Ltd. | インサートモールド品の製造方法および製造装置 |
US8057723B2 (en) | 2005-05-24 | 2011-11-15 | Murata Manufacturing Co., Ltd. | Method of manufacturing insert-molded article and apparatus therefor |
JP2012152975A (ja) * | 2011-01-25 | 2012-08-16 | Kojima Press Industry Co Ltd | ダイレクト成形機 |
JP2014048945A (ja) * | 2012-08-31 | 2014-03-17 | Apic Yamada Corp | Rfidタグ、rfidタグの製造方法、金型、および、非接触給電アンテナ部品 |
CN114506009A (zh) * | 2022-01-30 | 2022-05-17 | 安克创新科技股份有限公司 | 注塑模具、数据线外模的制作方法及数据线 |
CN114506009B (zh) * | 2022-01-30 | 2023-12-19 | 安克创新科技股份有限公司 | 注塑模具、数据线外模的制作方法及数据线 |
Also Published As
Publication number | Publication date |
---|---|
JPH0560773B2 (enrdf_load_stackoverflow) | 1993-09-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7681308B2 (en) | Fabrication method of semiconductor integrated circuit device | |
US5665281A (en) | Method for molding using venting pin | |
US20090068302A1 (en) | Resin Sealing and Molding Apparatus for Electronic Component | |
KR940000740B1 (ko) | 레진몰드 반도체의 제조방법 및 장치 | |
US5302101A (en) | Mold for resin-packaging electronic components | |
US6022583A (en) | Method of encapsulating a wire bonded die | |
EP0342237B1 (en) | Floating insert molding method and apparatus | |
JPH02200410A (ja) | 浮遊インサート成形方法及び装置 | |
US5049526A (en) | Method for fabricating semiconductor device including package | |
KR101667854B1 (ko) | 수지 밀봉 방법 및 수지 밀봉 장치 | |
WO2020253147A1 (zh) | 一种sip封装的屏蔽工艺 | |
WO1992000178A1 (en) | Method of and device for molding floating insert | |
WO2021084827A1 (ja) | ブリスター包装機及びブリスターパックの製造方法 | |
US20050110191A1 (en) | Package method of phosphoric light emitting diode | |
CN101018658B (zh) | 用调节气体封装电子元件的方法及装置 | |
US6428731B1 (en) | Mould part, mould and method for encapsulating electronic components mounted on a carrier | |
CN109920779A (zh) | 一种封装产品电磁屏蔽层的制备方法及封装产品 | |
KR100304680B1 (ko) | 반도체장치및그제조방법 | |
JP4102534B2 (ja) | 電子部品の樹脂封止成形方法 | |
CN102456582A (zh) | 用于制造模制引线框架的工艺 | |
CN209071313U (zh) | 具有六面式保护层的晶片封装结构 | |
CN216860291U (zh) | 一种锦纶6成品切片的回投装置 | |
US20250079191A1 (en) | Packaging methods and packaging apparatus | |
JP3144939U (ja) | 包装装置における物品の落し込み機構 | |
CN101093555A (zh) | 电子装置的制法 |