JPH0560773B2 - - Google Patents

Info

Publication number
JPH0560773B2
JPH0560773B2 JP1019597A JP1959789A JPH0560773B2 JP H0560773 B2 JPH0560773 B2 JP H0560773B2 JP 1019597 A JP1019597 A JP 1019597A JP 1959789 A JP1959789 A JP 1959789A JP H0560773 B2 JPH0560773 B2 JP H0560773B2
Authority
JP
Japan
Prior art keywords
floating insert
mold
movable
floating
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1019597A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02200410A (ja
Inventor
Michio Kaneko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP1019597A priority Critical patent/JPH02200410A/ja
Publication of JPH02200410A publication Critical patent/JPH02200410A/ja
Publication of JPH0560773B2 publication Critical patent/JPH0560773B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Molding Of Porous Articles (AREA)
  • Fertilizers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Fish Paste Products (AREA)
  • Formation And Processing Of Food Products (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP1019597A 1989-01-31 1989-01-31 浮遊インサート成形方法及び装置 Granted JPH02200410A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1019597A JPH02200410A (ja) 1989-01-31 1989-01-31 浮遊インサート成形方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1019597A JPH02200410A (ja) 1989-01-31 1989-01-31 浮遊インサート成形方法及び装置

Publications (2)

Publication Number Publication Date
JPH02200410A JPH02200410A (ja) 1990-08-08
JPH0560773B2 true JPH0560773B2 (enrdf_load_stackoverflow) 1993-09-03

Family

ID=12003642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1019597A Granted JPH02200410A (ja) 1989-01-31 1989-01-31 浮遊インサート成形方法及び装置

Country Status (1)

Country Link
JP (1) JPH02200410A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100085170A (ko) 2002-12-25 2010-07-28 혼다 기켄 고교 가부시키가이샤 사출 성형 방법 및 그 장치
JP3952084B2 (ja) * 2005-05-24 2007-08-01 株式会社村田製作所 インサートモールド品の製造方法および製造装置
JP5619636B2 (ja) * 2011-01-25 2014-11-05 小島プレス工業株式会社 ダイレクト成形機
JP2014048945A (ja) * 2012-08-31 2014-03-17 Apic Yamada Corp Rfidタグ、rfidタグの製造方法、金型、および、非接触給電アンテナ部品
CN114506009B (zh) * 2022-01-30 2023-12-19 安克创新科技股份有限公司 注塑模具、数据线外模的制作方法及数据线

Also Published As

Publication number Publication date
JPH02200410A (ja) 1990-08-08

Similar Documents

Publication Publication Date Title
US5665281A (en) Method for molding using venting pin
US20090004779A1 (en) Fabrication method of semiconductor integrated circuit device
US5302101A (en) Mold for resin-packaging electronic components
US6022583A (en) Method of encapsulating a wire bonded die
JPH0560773B2 (enrdf_load_stackoverflow)
CA2259506C (en) Method and system for manufacturing elastomeric articles
JPH0330343A (ja) 半導体装置を封入するための方法
WO1992000178A1 (en) Method of and device for molding floating insert
CN101018658B (zh) 用调节气体封装电子元件的方法及装置
US6908293B2 (en) Resin encapsulation system
EP1060507B1 (en) Mould part, mould and method for encapsulating electronic components mounted on a carrier
US5173237A (en) Method of making a metallic core assembly
US5843360A (en) Method and pellet for encapsulating lead frames
US5071612A (en) Method for sealingly molding semiconductor electronic components
JP4706127B2 (ja) 紙製トレー状容器の製造装置
CN110709978B (zh) 半导体塑封料传送系统及相关方法
CN216860291U (zh) 一种锦纶6成品切片的回投装置
JP2004319900A (ja) 樹脂封止用型及び樹脂封止用型の仕様決定方法
US3958395A (en) Die filler for a packaging machine
CN218867051U (zh) 一种压缩成型装置
KR20010074677A (ko) 주형, 캡슐에 넣기 위한 장치 및 캡슐에 넣는 방법
CN101093555A (zh) 电子装置的制法
JPH0487983A (ja) 原材料貯蔵・切出し設備
JP4253919B2 (ja) 電子タグの製造方法
CN205395007U (zh) 一种塑料托盘注塑模具的流道板