JPH02196452A - Attaching of heat sink of semiconductor device - Google Patents
Attaching of heat sink of semiconductor deviceInfo
- Publication number
- JPH02196452A JPH02196452A JP1672789A JP1672789A JPH02196452A JP H02196452 A JPH02196452 A JP H02196452A JP 1672789 A JP1672789 A JP 1672789A JP 1672789 A JP1672789 A JP 1672789A JP H02196452 A JPH02196452 A JP H02196452A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor device
- pressure
- adhesive
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 claims abstract description 42
- 239000000853 adhesive Substances 0.000 claims abstract description 26
- 230000001070 adhesive effect Effects 0.000 claims abstract description 26
- 238000003825 pressing Methods 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置のし一■〜シンク取付方法に関し、
特に接着樹脂を用いて取付ける方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a semiconductor device and a sink mounting method.
In particular, it relates to a method of attachment using adhesive resin.
従来、大容量の記憶装置とか電流容量の大きい半導体装
置は、その必要性から、ヒートシンクが収り付けられて
いる。この取付方法に関しては、接着剤による方法ある
いはねじ等による機械的な取付方法などあるが、これら
の方法に種々の改善が施されてきた。Conventionally, large-capacity storage devices and semiconductor devices with large current capacity have been equipped with heat sinks due to their necessity. As for this attachment method, there are methods using adhesives and mechanical attachment methods using screws, etc., and various improvements have been made to these methods.
第２図は従来の半導体装置のヒートシンク取付方法の一
例を説明するための工程流れ図、第５図は従来の半導体
装置のヒートシンク取付方法に使用する加圧治具の断面
図である。この取付方法は、第５図に示す加圧治具を用
いて、まず、第２図の〔接着剤塗布〕工程で、下型ホル
ダ３ｂの上にヒートシンク２を乗せる。次に、上型ホル
ダ３ａを下降させて、ヒートシンク２を位置決めする。FIG. 2 is a process flowchart for explaining an example of a conventional method for attaching a heat sink to a semiconductor device, and FIG. 5 is a sectional view of a pressing jig used in the conventional method for attaching a heat sink to a semiconductor device. In this mounting method, first, the heat sink 2 is placed on the lower mold holder 3b in the [adhesive application] step shown in FIG. 2 using the pressure jig shown in FIG. Next, the upper die holder 3a is lowered to position the heat sink 2.
次に、ヒートシンク２上に接着剤４を滴下する。次に、
加圧治具の上型ホルダ３ａのいんろう部３ｄに半導体装
置１を挿入する。Next, the adhesive 4 is dropped onto the heat sink 2. next,
The semiconductor device 1 is inserted into the spigot part 3d of the upper mold holder 3a of the pressurizing jig.
次に、〔加圧仮組み〕工程で、突き上げユニット７を矢
印９ａの方向に上昇させる。このことにより、下型ホル
ダ３ｂ上のヒートシンク２は半導体装置１の取り付は面
に押し付けられる。次に、突き上げユニット７の固定ア
ーム８を矢印９ｂの方向に動かして、定加圧ユニット５
のプレート５ａに引掛ける。このことにより、半導体装
置１とヒートシンク２の間の加圧力は、例えば、１ｋｇ
程度の定圧力となる。Next, in a [pressure temporary assembly] step, the push-up unit 7 is raised in the direction of the arrow 9a. As a result, the heat sink 2 on the lower mold holder 3b is pressed against the surface on which the semiconductor device 1 is attached. Next, move the fixed arm 8 of the push-up unit 7 in the direction of arrow 9b, and
hook on the plate 5a. As a result, the pressing force between the semiconductor device 1 and the heat sink 2 is, for example, 1 kg.
The pressure will be constant.
次に、〔接着剤硬化′〕工程で、キュア装置（図示せず
）のチャンバ内に、ヒートシンクが仮組みされた多数の
半導体装置を、この加圧治具とともに挿入し、数時間加
熱し接着剤を硬化させて、取り付けを完了する。Next, in the [adhesive curing'] process, a large number of semiconductor devices with heat sinks temporarily assembled are inserted into the chamber of a curing device (not shown) together with this pressure jig, and heated for several hours to bond them. Allow the agent to harden and complete the installation.
上述した従来の取付方法では、接着剤を硬化させるため
に、ヒートシンクと半導体装置を一つずつ仮組みする加
圧治具が必要となるだけではなく、接着剤を硬化する際
に、この加圧治具に仮組みされた半導体装置及びヒート
シンクの構成体をキュア装置のチャンバ内に入れるので
、この加圧治具の大きさのため、チャンバの内容積によ
り収納する個数に制限があり、また、加熱不要な加圧治
具も加熱するという欠点がある。更に、このような加圧
治具が一対の半導体装置及びヒートシンクとに対して一
個ずつ必要とする決意がある。これらの欠点は、いずれ
も、製品のコスト高を招く恐れがある。The conventional mounting method described above not only requires a pressure jig to temporarily assemble the heat sink and semiconductor device one by one in order to cure the adhesive, but also requires Since the semiconductor device and heat sink components temporarily assembled on the jig are placed in the chamber of the curing device, there is a limit to the number of devices that can be stored due to the size of the pressurizing jig and the internal volume of the chamber. This method has the disadvantage that it also heats the pressurizing jig, which does not need to be heated. Furthermore, there is a determination that one such pressurizing jig is required for each pair of semiconductor devices and heat sinks. All of these drawbacks can lead to high product costs.
本発明の目的は、一対の半導体装置及びヒートシンクに
対応する加圧治具を必要と°することがないとともに大
型チャンバや大型のヒータをもつキュア装置を必要とし
ない低コストの半導体装置のヒートシンク取付方法を提
供することにある。An object of the present invention is to provide a low-cost method for attaching a heat sink to a semiconductor device, which does not require a pressurizing jig that corresponds to a pair of semiconductor devices and a heat sink, and which does not require a curing device having a large chamber or a large heater. The purpose is to provide a method.
本発明の半導体装置のヒートシンク取付方法は、ヒート
シンクと半導体装置との間に接着剤を塗布し加圧治具に
て所定の時間加圧し仮接着する工程と、仮接着された前
記半導体装置と前記ヒートシンクとを前記加圧治具から
離脱させてこのヒートシンクと半導体装置とを無加圧状
態にした後に前記接着剤を硬化させる工程とを含んで構
成される。The method for attaching a heat sink to a semiconductor device according to the present invention includes the steps of applying an adhesive between the heat sink and the semiconductor device and applying pressure with a pressure jig for a predetermined period of time to temporarily bond the semiconductor device and the semiconductor device that have been temporarily bonded. The method includes the step of curing the adhesive after separating the heat sink from the pressure jig and placing the heat sink and the semiconductor device in a non-pressurized state.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の半導体装置のヒートシンク取付方法の
一例を説明するための工程流れ図である。FIG. 1 is a process flowchart for explaining an example of a method for attaching a heat sink to a semiconductor device according to the present invention.
この取付方法は、従来の〔加圧仮組み〕の工程を〔仮接
着〕の工程に変更したことである。This attachment method changes the conventional process of [pressure temporary assembly] to a process of [temporary adhesion].
第３図は本実施例の取付方法に使用した加圧治具の一例
を示す断面図である。この加圧治具の従来の加圧治具と
異なる点は、ヒートシンクを保持する下型ホルダ６と、
半導体装置１を保持する真空チャ・ツク１１とに分離さ
れていることである。FIG. 3 is a sectional view showing an example of a pressing jig used in the mounting method of this embodiment. The difference between this pressure jig and conventional pressure jig is that the lower mold holder 6 that holds the heat sink,
It is separated into a vacuum chuck 11 that holds the semiconductor device 1.
次に、半導体装置にヒートシンクを取り付ける方法を説
明する。まず、〔接着剤塗布〕の工程で、円形インデッ
クステーブル（図示せず）に取り付けられた下型ホルダ
６の窪み６ａに、例えば、ハンドラ等により自動的にヒ
ートシンク２を装填する。次に、デイスペンサ（図示せ
ず）により、例えば、シリコン樹脂の接着剤４を滴下す
る。Next, a method for attaching a heat sink to a semiconductor device will be explained. First, in the process of [adhesive application], the heat sink 2 is automatically loaded into the recess 6a of the lower die holder 6 attached to a circular index table (not shown) using, for example, a handler. Next, an adhesive 4 made of silicone resin, for example, is dripped using a dispenser (not shown).
次に、〔仮接着〕の工程で、真空チャック１１により、
収納トレー（図示せず）からピックアップした半導体装
置ｌをヒートシンク２上に位置決めする。次に、定加圧
ユニット５を矢印１０ａの方向に下降させ、半導体装置
１をヒー１ヘシク２に、定圧力、例えば、１ｋｇ程度で
、２〜３分間押し付ける。Next, in the [temporary bonding] process, the vacuum chuck 11 is used to
A semiconductor device l picked up from a storage tray (not shown) is positioned on a heat sink 2. Next, the constant pressure unit 5 is lowered in the direction of the arrow 10a, and the semiconductor device 1 is pressed against the heater 1 and the press 2 at a constant pressure, for example, about 1 kg, for 2 to 3 minutes.
次に、〔接着剤硬化〕の工程で、定加圧ユニツ１−５を
上昇させ、真空チャック１１により、ヒートシンク２が
仮接着された半導体装置１をキュア装置のチャンバ内の
搬送ベルト（図示せず）に載置する。次に、あらかじめ
所定の温度、例えば、１００℃程度に熱せられたチャン
バ内を搬送ベルトにより所定の時間ヒートシンクが仮接
着された半導体装置を送り、接着剤を硬化させ完了する
。Next, in the process of [adhesive curing], the constant pressure unit 1-5 is raised, and the semiconductor device 1, to which the heat sink 2 is temporarily bonded, is moved by the vacuum chuck 11 to the conveyor belt (not shown) in the chamber of the curing device. ). Next, the semiconductor device to which the heat sink has been temporarily bonded is transported for a predetermined period of time by a conveyor belt through a chamber that has been preheated to a predetermined temperature, for example, about 100° C., and the adhesive is cured.
この操作を順次行ない、連続的に半導体装置にヒートシ
ンクを取り付けることが出来る。By performing this operation in sequence, heat sinks can be successively attached to semiconductor devices.
第４図は本実施例の取付方法に使用した加圧治具のもう
一つの他の例を示す断面図である。この加圧治具は、前
述の実施例、と異なり、ヒートシンク２を上昇させ、あ
らかじめ載置された半導体装置１に押し付けることであ
る。FIG. 4 is a sectional view showing another example of the pressing jig used in the mounting method of this embodiment. This pressurizing jig is different from the above-mentioned embodiment in that it raises the heat sink 2 and presses it against the semiconductor device 1 placed in advance.
次に、この加圧治具による取付方法を説明する。Next, a mounting method using this pressure jig will be explained.
まず、〔接着剤塗布〕の工程で、半導体装置１を他の収
納トレー（図示せず）から上型ホルダ１２の窪み１２ａ
に移載する。次に、突き上げユニット７ａに移載された
ヒートシンク上に接着剤を滴下する。First, in the process of [adhesive application], the semiconductor device 1 is transferred from another storage tray (not shown) to the recess 12a of the upper die holder 12.
Transferred to. Next, adhesive is dripped onto the heat sink transferred to the push-up unit 7a.
次に、〔仮接着〕の工程で、突き上げユニット７ａを矢
印１０ｅの方向に上昇させ、ガイドブレート１３が矢印
１０ｂの方向に移動し、ヒートシンク２が上型ホルダ１
２の穴１２ｂに案内されて、半導体装置１に接触する。Next, in the [temporary bonding] process, the push-up unit 7a is raised in the direction of arrow 10e, the guide plate 13 is moved in the direction of arrow 10b, and the heat sink 2 is attached to the upper mold holder 1.
2 and comes into contact with the semiconductor device 1.
次に、定加圧ユニットに、あらかじめ、加圧力９例えば
、１ｋｇに設定しであるので、この加圧力で、２〜３分
程度ヒートシンク２を半導体装置１に押しつずける。Next, since the constant pressure unit is set in advance to a pressure of 9, for example 1 kg, the heat sink 2 is pressed against the semiconductor device 1 for about 2 to 3 minutes using this pressure.
次に、〔接着剤硬化〕の工程で、押圧時間が過ると、突
き上げユニット７ａが下降し、前述の実施例と同様に、
キュア装置で、ヒートシフ２が仮接着された半導体装置
１の接着剤を硬化させ取り付けを完了する。Next, in the [adhesive curing] step, when the pressing time has elapsed, the push-up unit 7a descends, and as in the previous embodiment,
The curing device cures the adhesive of the semiconductor device 1 to which the heat shifter 2 is temporarily attached, completing the attachment.
この加圧用治具は、前述の治具に比べ、半導体装置より
ヒートシンクの方を移動して仮接着するので、半導体装
置の外郭体である脆いセラミックの欠け、割れ等を引起
す恐れが少ない点で有利である。Compared to the above-mentioned jigs, this pressurizing jig temporarily bonds the heat sink by moving it from the semiconductor device, so there is less risk of chipping, cracking, etc. of the brittle ceramic that is the outer shell of the semiconductor device. It is advantageous.
以上説明したように本発明は、ヒートシンクを半導体装
置に接着する工程を仮接着工程と接着剤硬化工程とに分
離し、多数のヒートシンク及び半導体装置対に対して、
一つの加圧治具により仮接着出来る。また、ヒートシン
クが仮接着された半導体装置のみをキュア装置のチャン
バに挿入し接着剤を硬化出来るので、大きいチャンバと
大きい加熱容量のヒータをもつキュア装置が不要になる
ばかりか、高価な加圧治具を多数必要としない半導体装
置のヒートシンク取付方法が得られるという効果がある
。As explained above, the present invention separates the process of adhering a heat sink to a semiconductor device into a temporary adhesion process and an adhesive curing process, and applies the process to a large number of pairs of heat sinks and semiconductor devices.
Temporary adhesion can be done using one pressure jig. In addition, since the adhesive can be cured by inserting only the semiconductor device to which the heat sink has been temporarily attached into the chamber of the curing device, not only is there no need for a curing device with a large chamber and a heater with a large heating capacity, but also expensive pressure treatment is not required. This has the effect of providing a method for attaching a heat sink to a semiconductor device that does not require a large number of tools.
第１図は本発明の半導体装置のヒートシンク取付方法の
一例を説明するための工程流れ図、第２図は従来の半導
体装置のヒートシンク取付方法の一例を説明するための
工程流れ図、第３図は本実施例の取付方法に使用した加
圧治具の一例を示す断面図、第４図は本実施例の取付方
法に使用した加圧治具のもう一つの他の例を示す断面図
、第５図は従来の半導体装置のヒートシンク取付方法に
使用する加圧治具の断面図である。
１・・・半導体装置、２・・・ヒートシンク、３ａ、１
２・・上型ホルダ、３ｂ、６・・・下型ホルダ、３ｄ・
・・いんろう部、４・・・接着剤、５・・・定加圧ユニ
ット、５ａ・・・プレート、６ａ、１２ａ・・・窪み、
７．７ａ・・・突き上げユニット、８・・・固定アーム
、９ａ、９ｂ、１０ａ、１０ｂ、１０ ｃ−・・矢印、
１１−・・真空チャック、１２ｂ・・・穴。
第１図
第２図FIG. 1 is a process flow chart for explaining an example of the heat sink mounting method for a semiconductor device according to the present invention, FIG. 2 is a process flow chart for explaining an example of a conventional heat sink mounting method for a semiconductor device, and FIG. FIG. 4 is a cross-sectional view showing an example of the pressure jig used in the mounting method of this embodiment, FIG. 4 is a cross-sectional view showing another example of the pressure jig used in the mounting method of this embodiment, and FIG. The figure is a sectional view of a pressing jig used in a conventional method for attaching a heat sink to a semiconductor device. 1... Semiconductor device, 2... Heat sink, 3a, 1
2... Upper mold holder, 3b, 6... Lower mold holder, 3d.
... In-rotating part, 4... Adhesive, 5... Constant pressure unit, 5a... Plate, 6a, 12a... Hollow,
7.7a... Push-up unit, 8... Fixed arm, 9a, 9b, 10a, 10b, 10 c-... Arrow,
11-... Vacuum chuck, 12b... Hole. Figure 1 Figure 2
Claims (1)
治具にて所定の時間加圧し仮接着する工程と、仮接着さ
れた前記半導体装置と前記ヒートシンクとを前記加圧治
具から離脱させてこのヒートシンクと半導体装置とを無
加圧状態にした後に前記接着剤を硬化させる工程とを含
むことを特徴とする半導体装置のヒートシンク取付方法
。A step of temporarily adhering the heat sink and the semiconductor device by applying an adhesive between the heat sink and the semiconductor device and applying pressure for a predetermined time using a pressure jig, and separating the temporarily bonded semiconductor device and the heat sink from the pressure jig. A method for attaching a heat sink to a semiconductor device, comprising the step of curing the adhesive after bringing the heat sink of the lever and the semiconductor device into a non-pressurized state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1016727A JP2569781B2 (en) | 1989-01-25 | 1989-01-25 | Pressing jig for heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1016727A JP2569781B2 (en) | 1989-01-25 | 1989-01-25 | Pressing jig for heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02196452A true JPH02196452A (en) | 1990-08-03 |
| JP2569781B2 JP2569781B2 (en) | 1997-01-08 |
Family
ID=11924297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1016727A Expired - Lifetime JP2569781B2 (en) | 1989-01-25 | 1989-01-25 | Pressing jig for heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2569781B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6755229B2 (en) * | 2001-07-27 | 2004-06-29 | Samsung Electro-Mechanics Co., Ltd. | Method for preparing high performance ball grid array board and jig applicable to said method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6459897A (en) * | 1987-08-29 | 1989-03-07 | Niles Parts Co Ltd | Fixing of heat generating element |
-
1989
- 1989-01-25 JP JP1016727A patent/JP2569781B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6459897A (en) * | 1987-08-29 | 1989-03-07 | Niles Parts Co Ltd | Fixing of heat generating element |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6755229B2 (en) * | 2001-07-27 | 2004-06-29 | Samsung Electro-Mechanics Co., Ltd. | Method for preparing high performance ball grid array board and jig applicable to said method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2569781B2 (en) | 1997-01-08 |
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