JPH021951Y2 - - Google Patents

Info

Publication number

JPH021951Y2

JPH021951Y2 JP17032584U JP17032584U JPH021951Y2 JP H021951 Y2 JPH021951 Y2 JP H021951Y2 JP 17032584 U JP17032584 U JP 17032584U JP 17032584 U JP17032584 U JP 17032584U JP H021951 Y2 JPH021951 Y2 JP H021951Y2

Authority

JP

Japan

Prior art keywords

annular

hole

terminal block

board

protruding piece

Prior art date

1984-11-12

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 238000004804 winding Methods 0.000 claims description 11
• 239000011810 insulating material Substances 0.000 claims description 7
• 239000000463 material Substances 0.000 claims description 3
• 239000000615 nonconductor Substances 0.000 claims description 2
• 239000012212 insulator Substances 0.000 claims 1
• 229910000679 solder Inorganic materials 0.000 description 4
• 239000011248 coating agent Substances 0.000 description 3
• 238000000576 coating method Methods 0.000 description 3
• 238000005476 soldering Methods 0.000 description 2
• KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 238000007598 dipping method Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 239000012777 electrically insulating material Substances 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 238000007654 immersion Methods 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 230000002093 peripheral effect Effects 0.000 description 1
• 239000005011 phenolic resin Substances 0.000 description 1
• 229920001568 phenolic resin Polymers 0.000 description 1