JPH0219499A - プリント基板自動着脱式ラック装置 - Google Patents

プリント基板自動着脱式ラック装置

Info

Publication number
JPH0219499A
JPH0219499A JP16968088A JP16968088A JPH0219499A JP H0219499 A JPH0219499 A JP H0219499A JP 16968088 A JP16968088 A JP 16968088A JP 16968088 A JP16968088 A JP 16968088A JP H0219499 A JPH0219499 A JP H0219499A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
rack body
parts
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16968088A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0414199B2 (enrdf_load_stackoverflow
Inventor
Kazumi Kuwabara
桑原 一美
Motoi Kamiyama
上山 基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Plant Kogyo Kk
Original Assignee
Fuji Plant Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Plant Kogyo Kk filed Critical Fuji Plant Kogyo Kk
Priority to JP16968088A priority Critical patent/JPH0219499A/ja
Publication of JPH0219499A publication Critical patent/JPH0219499A/ja
Publication of JPH0414199B2 publication Critical patent/JPH0414199B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • C25D17/08Supporting racks, i.e. not for suspending
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/241Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP16968088A 1988-07-06 1988-07-06 プリント基板自動着脱式ラック装置 Granted JPH0219499A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16968088A JPH0219499A (ja) 1988-07-06 1988-07-06 プリント基板自動着脱式ラック装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16968088A JPH0219499A (ja) 1988-07-06 1988-07-06 プリント基板自動着脱式ラック装置

Publications (2)

Publication Number Publication Date
JPH0219499A true JPH0219499A (ja) 1990-01-23
JPH0414199B2 JPH0414199B2 (enrdf_load_stackoverflow) 1992-03-12

Family

ID=15890917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16968088A Granted JPH0219499A (ja) 1988-07-06 1988-07-06 プリント基板自動着脱式ラック装置

Country Status (1)

Country Link
JP (1) JPH0219499A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009287100A (ja) * 2008-05-30 2009-12-10 C Uyemura & Co Ltd めっき処理用ワーク保持治具
CN106283165A (zh) * 2015-06-04 2017-01-04 昆山雅鑫化工有限公司 Pcb板用电镀夹具

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009287100A (ja) * 2008-05-30 2009-12-10 C Uyemura & Co Ltd めっき処理用ワーク保持治具
CN106283165A (zh) * 2015-06-04 2017-01-04 昆山雅鑫化工有限公司 Pcb板用电镀夹具

Also Published As

Publication number Publication date
JPH0414199B2 (enrdf_load_stackoverflow) 1992-03-12

Similar Documents

Publication Publication Date Title
US6112885A (en) Transport apparatus for thin, board-shaped substrates
JPH0219499A (ja) プリント基板自動着脱式ラック装置
JPS62253799A (ja) 吊り架台に対して電気めつきすべきプレ−ト状部品を搬入・搬出するための装置
TW577935B (en) Device for the transport and wet-chemical or electrolytic treatment of a very thin and flat workpiece
TW202021034A (zh) 使基板保持器保持基板的方法
JP2000290797A (ja) プリント基板メッキ用治具
TW202038366A (zh) 用於基板固持器之密封件
CN118563416A (zh) 分子束外延设备的原位掩膜架及分子束外延设备
JPH0631478B2 (ja) めつき用引掛治具
JP3743372B2 (ja) 平板状ワークのクランパー
JP4307653B2 (ja) 基板支持装置および基板搬送機構
JPH0348218Y2 (enrdf_load_stackoverflow)
JP2500024B2 (ja) 薄型プリント配線板のコンベア作業補助治具
JP3122753B2 (ja) プリント基板メッキ用治具
JP3507129B2 (ja) メッキ用基板取付け装置および取外し装置
KR200180025Y1 (ko) 박판 도금용 지그
CN220350430U (zh) 一种玻璃镀膜转运基片架
JPH0627657Y2 (ja) 板状被処理物の保持装置
JP3297684B2 (ja) プリント基板メッキ用治具
JP2002047599A (ja) プリント基板メッキ用治具
JPH0435416Y2 (enrdf_load_stackoverflow)
JPH0992957A (ja) 薄い金属箔張基板の表面処理治具
KR19990068420A (ko) 도금장치용랙
JPH0715779U (ja) 被表面処理材料の吊下装置
JPS5823191Y2 (ja) 印刷配線板の端子めつき治具