JPH0219499A - プリント基板自動着脱式ラック装置 - Google Patents
プリント基板自動着脱式ラック装置Info
- Publication number
- JPH0219499A JPH0219499A JP16968088A JP16968088A JPH0219499A JP H0219499 A JPH0219499 A JP H0219499A JP 16968088 A JP16968088 A JP 16968088A JP 16968088 A JP16968088 A JP 16968088A JP H0219499 A JPH0219499 A JP H0219499A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- rack body
- parts
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16968088A JPH0219499A (ja) | 1988-07-06 | 1988-07-06 | プリント基板自動着脱式ラック装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16968088A JPH0219499A (ja) | 1988-07-06 | 1988-07-06 | プリント基板自動着脱式ラック装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0219499A true JPH0219499A (ja) | 1990-01-23 |
| JPH0414199B2 JPH0414199B2 (enrdf_load_stackoverflow) | 1992-03-12 |
Family
ID=15890917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16968088A Granted JPH0219499A (ja) | 1988-07-06 | 1988-07-06 | プリント基板自動着脱式ラック装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0219499A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009287100A (ja) * | 2008-05-30 | 2009-12-10 | C Uyemura & Co Ltd | めっき処理用ワーク保持治具 |
| CN106283165A (zh) * | 2015-06-04 | 2017-01-04 | 昆山雅鑫化工有限公司 | Pcb板用电镀夹具 |
-
1988
- 1988-07-06 JP JP16968088A patent/JPH0219499A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009287100A (ja) * | 2008-05-30 | 2009-12-10 | C Uyemura & Co Ltd | めっき処理用ワーク保持治具 |
| CN106283165A (zh) * | 2015-06-04 | 2017-01-04 | 昆山雅鑫化工有限公司 | Pcb板用电镀夹具 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0414199B2 (enrdf_load_stackoverflow) | 1992-03-12 |