JPH021907A - In-line type semiconductor heat treatment device - Google Patents

Abstract

PURPOSE:To reduce the dimension in the wafer flowing direction thereby making the title device compact by a method wherein bake plate parts are vertically stacked up in the direction perpendicular to the wafer flowing direction. CONSTITUTION:A wafer 2 carried on a beater built-in type bake plate 1 is heated thereon for specified time. When next wafer is carried, the bake plate 1 is vertically moved along shafts 4 through the intermediary of a bake plate holder 3 to carry the wafer 2 to another bake plate not loaded with the wafer 2. The bake plate 1 after specific time lapse is vertically moved to the same surface as that of conveyor belts 6 to be stopped while the pins 8 buried in the bake plate 1 are raised to lift up the wafer 2 to the position of the wafer 2'. Furthermore, when a wafer carriage unit 5 approaches the position below the wafer 2, the pins 8 are lowered. The wafer 2 can be carried out of the bake plate 1 by turning the belts of the wafer carriage unit 5. In such a constitution, the title device can be prevented from extending in the wafer flowing direction.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an in-line semiconductor heat treatment apparatus used in an in-line semiconductor manufacturing apparatus such as a coating machine or a developing machine used in a semiconductor manufacturing process.

[Conventional technology]

Conventionally, this type of in-line semiconductor heat treatment apparatus has been constructed by arranging an arbitrary number of bake plates 1 with built-in heaters in series in the wafer flow direction, as shown in FIG.

[Problem to be solved by the invention]

The conventional in-line semiconductor heat treatment apparatus described above has the disadvantage that the bake plates are arranged in series in the wafer flow direction, so that the apparatus becomes long in the wafer flow direction.

[Means to solve the problem]

An in-line semiconductor heat treatment apparatus of the present invention is an in-line semiconductor heat treatment apparatus used in an in-line semiconductor manufacturing apparatus in which processing steps of a semiconductor manufacturing process are performed on a continuous line, in which a bake plate portion of the in-line semiconductor heat treatment apparatus is vertically mounted. It is characterized by being piled up.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a perspective view of an embodiment of the present invention. The wafer 2 carried onto the bake plate 1 with a built-in heater is heated on the bake plate 1 for a predetermined period of time. When the next wafer is carried within a predetermined time, the bake plate 1 is moved up and down along the shaft 4 via the bake plate holder 3, and the wafer is carried onto the bake plate 1 on which the wafer 2 is not placed. After a predetermined period of time has elapsed, the bake plate 1 moves up and down to the same level as the conveyor belt 6 and stops.

Next, the pins 8 embedded in the bake plate 1 rise and lift the wafer. At this time, the wafer is in the 2' state. Further, when the wafer unloader unit 5 approaches and comes under the wafer, the pin is lowered. When the belt attached to the wafer unloader unit 5 rotates, the wafer 2 is unloaded from the bake plate 1.

FIG. 2 is a perspective view of another embodiment of the invention.

In this example, wafer 2 is a carrier type bake breaker)
It is housed in 11. Since this bake plate 11 does not have a built-in heater, the entire bake plate 11 is covered with a cover IO and the temperature of the wafer 2 is controlled by blowing hot air inside from the hot air outlet 9. The carrier type bake plate 11 is installed on a vertically movable table 12 and can be moved up and down, so that arbitrary wafers can be carried in and out by means such as a pusher (not shown).

[Effect of idea]

As described above, the present invention has the effect of reducing the dimension in the wafer flow direction by vertically stacking the bake plate sections perpendicular to the wafer flow direction, thereby making the apparatus more compact.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing one embodiment of the present invention, FIG. 2 is a perspective view showing another embodiment of the invention, and FIG. 3 is a perspective view showing a conventional bake plate section. 1... Bake plate with built-in heater, 2...
...Wafer 2'...Wafer 3...
...Bake plate holding stand, 4...Shaft, 5...Wafer unloader unit, 6...
...Conveyor belt, 7...Pulley, 8...
...Pin, 9...Hot air outlet, 10...
... Cover 11 ... Carrier type bake plate, 12 ... Vertical movement table.

Claims (1)

[Claims] An in-line type semiconductor heat treatment apparatus used in an in-line type semiconductor manufacturing apparatus in which processing steps of a semiconductor manufacturing process are performed on a continuous line, characterized in that bake plate portions of the in-line type semiconductor heat treatment apparatus are vertically stacked. Semiconductor heat treatment equipment.