JPH02185994A - 選択的に電気メッキする装置 - Google Patents

選択的に電気メッキする装置

Info

Publication number
JPH02185994A
JPH02185994A JP1299910A JP29991089A JPH02185994A JP H02185994 A JPH02185994 A JP H02185994A JP 1299910 A JP1299910 A JP 1299910A JP 29991089 A JP29991089 A JP 29991089A JP H02185994 A JPH02185994 A JP H02185994A
Authority
JP
Japan
Prior art keywords
electrolyte
anode
edge
strip
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1299910A
Other languages
English (en)
Japanese (ja)
Inventor
Peter Wingenfeld
ペーター・ヴインゲンフエルト
Dietmar Holdt
デイートマール・ホルト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Degussa GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6367534&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH02185994(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Degussa GmbH filed Critical Degussa GmbH
Publication of JPH02185994A publication Critical patent/JPH02185994A/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04Electroplating with moving electrodes
    • C25D5/06Brush or pad plating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing of the conductive pattern
    • H05K3/241Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
    • H01H2011/046Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion by plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coating Apparatus (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP1299910A 1988-11-19 1989-11-20 選択的に電気メッキする装置 Pending JPH02185994A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3839223.2 1988-11-19
DE3839223A DE3839223C2 (de) 1988-11-19 1988-11-19 Vorrichtung zur selektiven galvanischen Beschichtung

Publications (1)

Publication Number Publication Date
JPH02185994A true JPH02185994A (ja) 1990-07-20

Family

ID=6367534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1299910A Pending JPH02185994A (ja) 1988-11-19 1989-11-20 選択的に電気メッキする装置

Country Status (6)

Country Link
US (1) US4952296A (https=)
EP (1) EP0370239B1 (https=)
JP (1) JPH02185994A (https=)
BR (1) BR8905799A (https=)
DE (2) DE3839223C2 (https=)
RU (1) RU1782251C (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5116480A (en) * 1990-03-26 1992-05-26 The Carolinch Company Method and apparatus for electrolytic plating
CH684840A5 (fr) * 1991-06-11 1995-01-13 Electroplating Eng Eesa Cellule pour plaquer par voie électrolytique sélectivement des zones choisies de pièces métalliques disposées en bande.
FR2714080B1 (fr) * 1993-12-16 1996-03-01 Dalic Dispositif pour le traitement électrochimique, notamment localisé, d'un substrat conducteur.
DE4436071C2 (de) * 1994-07-28 1996-09-05 Duerrwaechter E Dr Doduco Verfahren zum Vergolden von bandförmigem Halbzeug, insbesondere für Leadframes und nach dem Verfahren vergoldete Leadframes
EP0698677B1 (de) * 1994-07-28 2002-10-09 AMI DODUCO GmbH Verfahren zum Vergolden von bandförmigem Halbzeug, insbesondere für Leadframes
DE19503901C2 (de) * 1995-02-07 1997-01-09 Degussa Verfahren und Vorrichtung zum partiellen Beschichten von hohlzylindrischen Teilen
GB2336161B (en) * 1998-04-06 2003-03-26 John Michael Lowe Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
SE529744C2 (sv) * 2005-12-22 2007-11-13 Abb Technology Ag Anordning och metod för metallisk beläggning samt användning av anordningen
DE102020127401A1 (de) 2020-10-16 2022-04-21 Schiefer & Co., Edelmetall-Scheideanstalt (GmbH & Co.) Apparat und Verfahren zur Aufbringung einer strukturierten Beschichtung sowie Metallgegenstand mit einer strukturierten Beschichtung

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4132617A (en) * 1973-10-04 1979-01-02 Galentan, A.G. Apparatus for continuous application of strip-, ribbon- or patch-shaped coatings to a metal tape
US4186062A (en) * 1978-07-13 1980-01-29 Micro-Plate, Inc. Continuous tab plater and method
US4425212A (en) * 1981-11-20 1984-01-10 Francis William L Electroplating device
US4452684A (en) * 1983-03-11 1984-06-05 The Carolinch Company Apparatus for selective electrolytic plating
US4618407A (en) * 1984-02-09 1986-10-21 Meco Equipment Engineers B.V. Galvano-technical device for locally applying a metal layer to an elongate metal tape or the like
US4597845A (en) * 1984-09-25 1986-07-01 Robbins & Craig Welding & Mfg. Co. Continuous contact plating apparatus
US4610772A (en) * 1985-07-22 1986-09-09 The Carolinch Company Electrolytic plating apparatus
DE3683595D1 (de) * 1985-11-11 1992-03-05 Electroplating Eng Vorrichtung zum selektiven metallbeschichten von steckverbinderkontaktstiften.
DE3730740C1 (de) * 1987-09-12 1988-09-29 Degussa Verfahren und Vorrichtung zur partiellen galvanischen Beschichtung
US4786389A (en) * 1987-09-25 1988-11-22 Amp Incorporated Electroplating apparatus

Also Published As

Publication number Publication date
EP0370239A1 (de) 1990-05-30
DE3839223C2 (de) 1994-10-20
DE58902822D1 (de) 1993-01-07
EP0370239B1 (de) 1992-11-25
US4952296A (en) 1990-08-28
RU1782251C (ru) 1992-12-15
BR8905799A (pt) 1990-06-12
DE3839223C1 (https=) 1989-12-07

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