JPH0218375B2 - - Google Patents
Info
- Publication number
- JPH0218375B2 JPH0218375B2 JP58233701A JP23370183A JPH0218375B2 JP H0218375 B2 JPH0218375 B2 JP H0218375B2 JP 58233701 A JP58233701 A JP 58233701A JP 23370183 A JP23370183 A JP 23370183A JP H0218375 B2 JPH0218375 B2 JP H0218375B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- weight
- strength
- copper
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910045601 alloy Inorganic materials 0.000 claims description 21
- 239000000956 alloy Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 8
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23370183A JPS59145748A (ja) | 1983-12-13 | 1983-12-13 | 半導体機器のリ−ド材用銅合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23370183A JPS59145748A (ja) | 1983-12-13 | 1983-12-13 | 半導体機器のリ−ド材用銅合金 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP606182A Division JPS58124254A (ja) | 1982-01-20 | 1982-01-20 | 半導体機器のリ−ド材用銅合金 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5345185A Division JPS60215723A (ja) | 1985-03-19 | 1985-03-19 | 半導体機器のリード材用銅合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59145748A JPS59145748A (ja) | 1984-08-21 |
| JPH0218375B2 true JPH0218375B2 (fr) | 1990-04-25 |
Family
ID=16959188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23370183A Granted JPS59145748A (ja) | 1983-12-13 | 1983-12-13 | 半導体機器のリ−ド材用銅合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59145748A (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111455373A (zh) * | 2020-03-23 | 2020-07-28 | 陕西斯瑞新材料股份有限公司 | 一种高导热耐高温复合铜合金散热材料制备方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63149347A (ja) * | 1986-12-15 | 1988-06-22 | Komatsu Ltd | レ−ザ肉盛用高耐摺動摩耗用銅合金 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS572851A (en) * | 1980-06-06 | 1982-01-08 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor device |
| JPS58124257A (ja) * | 1982-01-20 | 1983-07-23 | Kobe Steel Ltd | 熱間加工性に優れた集積回路のリ−ドフレ−ム用銅合金 |
| JPS58177442A (ja) * | 1982-04-08 | 1983-10-18 | Kobe Steel Ltd | リ−ドフレ−ム用高強度銅合金の製造方法 |
-
1983
- 1983-12-13 JP JP23370183A patent/JPS59145748A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS572851A (en) * | 1980-06-06 | 1982-01-08 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor device |
| JPS58124257A (ja) * | 1982-01-20 | 1983-07-23 | Kobe Steel Ltd | 熱間加工性に優れた集積回路のリ−ドフレ−ム用銅合金 |
| JPS58177442A (ja) * | 1982-04-08 | 1983-10-18 | Kobe Steel Ltd | リ−ドフレ−ム用高強度銅合金の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111455373A (zh) * | 2020-03-23 | 2020-07-28 | 陕西斯瑞新材料股份有限公司 | 一种高导热耐高温复合铜合金散热材料制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59145748A (ja) | 1984-08-21 |
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