JPH021826A - Manufacture of matrix type display device - Google Patents

Abstract

PURPOSE:To facilitate the reshorting of electrode wiring after cutting the short- circuit wiring by forming the short-circuit wiring by an etching resistant material which has less etching resistance than the end member of the row and column electrode wiring. CONSTITUTION:On a transparent insulating substrate 1, a picture element electrode 5, which is a matrix arrange transparent conducting film, the row electrode wiring 2 of a gate electrode and the column electrode wiring 3 of a source electrode are formed, and the same shaped under members 8 are formed on the positions being the terminal parts and end parts 2a, 2b, and 3a, 3b of wiring 2 and 3. Then, the terminal parts and the terminals 2a, 2b and 3a, 3b, and a short ring 6 are formed on the member 8 by using the material which has less etching resistance than the member 8, and the wiring 2 and 3 are shorted, and the short-circuit wiring is cut by the etching at the product completing stage. The member 8 is left by such cutting, and the reshorting of the electrode wiring is easily carried out after production is completed.

Description

[Detailed description of the invention] [Industrial application field] This invention can be applied to devices such as liquid crystal display devices. This paper relates to a method for manufacturing a display device.

[Conventional technology]

The third ffjI is a configuration diagram showing a schematic configuration on a substrate in the middle of a process of a conventional manufacturing method of a liquid crystal display device, which is an example of this type of matrix type display device.

In the figure, a plurality of gate electrode wirings 2 extending laterally are formed on a transparent insulating substrate 1 and arranged in parallel with each other. In addition, apart from these gate electrode wirings 2,
A plurality of source electrode wirings 3 extending in the vertical direction and perpendicular to the gate electrode wiring 2 are arranged in parallel to each other. Each gate electrode wiring 2 has a gate electrode terminal 2a formed at a portion slightly before its both ends, and each source electrode wiring 3 also has a source electrode terminal 3a formed at a portion slightly before its both ends. ing. At each intersection between the gate electrode wiring 2 and the source electrode wiring 3, a thin film transistor (■1 ``im Transis''), which is a nonlinear active element, is connected.
tor (hereinafter referred to as TFT) 4 has its gate connected to the gate electrode wiring 2 and its source connected to the source electrode wiring 3. In addition, each of the above-mentioned T
A plurality of pixel electrodes 5 respectively corresponding to FT4 are connected to gate electrode wiring 2. The pixel electrodes 5 are arranged in a matrix along the source electrode wiring 3 and the pixel electrode 5, and each pixel electrode 5 is connected to the drain of the corresponding TFT 4. The transparent insulating substrate 1 configured in this way is called a TFT array substrate, and a liquid crystal display device is configured by interposing a liquid crystal between this TFT array substrate and a counter substrate facing it, and the gate electrode terminal 2a By selectively applying a voltage to the source electrode terminal 3a and turning on the corresponding TFT 4, a voltage is selectively applied to the liquid crystal (pixel) of the pixel electrode 5 corresponding to the TFT 4. This is used to drive it and display images.

During the manufacturing process described above, the transparent insulating substrate 1 is connected between all the ends of the gate electrode wiring 2 and the source electrode wiring 3.
As shown in FIG. 3, the upper peripheral portion is short-circuited by a short ring 6 made of a conductive material. This short ring 6 is formed for the purpose of preventing the TFT 4 from being damaged by static electricity during the manufacturing process. By removing the short ring 6, all gate electrode wiring is removed at the stage of product completion. 263 and the ends of the source electrode wiring 3 are completely separated.

4 shows an enlarged plan view of a part of the structure shown in FIG. 3, and FIG. 5 shows a sectional view taken along the line A--A in FIG. 4. Here, for example, after the gate electrode wiring 2 is formed using aluminum as a material, the source electrode wiring 3 and the short ring 6 are simultaneously formed using the same aluminum material, and as shown in FIG. In the portion 2b, the short ring 6 is deposited thereon.

[Problems to be Solved by the Invention] In the conventional manufacturing method for matrix type display devices, as described above, the gate electrode wiring 2 which is the row electrode wiring and the source electrode wiring 3 which is the column electrode wiring are made of the same conductive material. Since a short ring 6 is formed as a short-circuit wire that shorts between the ends of these electrode wires, if the short ring 6 is etched and removed for purposes such as inspection during the manufacturing process, Since the ends of the gate electrode wiring 2 and the source electrode wiring 3 are also removed, it becomes difficult to re-form the short ring 6 and short-circuit the ends of the respective electrode wirings. Therefore, in the conventional manufacturing method, once a short circuit wiring such as the short ring 6 is formed, the wiring resistance, which affects the display quality, increases during the manufacturing process.

There is a problem in that various electrical characteristics such as interlayer insulation resistance and V4 tangent resistance cannot be easily tested.

This invention was made to solve the above-mentioned problems, and it is possible to easily re-form the short-circuit wiring even after the short-circuit wiring has been etched and removed for the purpose of inspection. The object of the present invention is to obtain a method for manufacturing a matrix type display device.

[Means to solve the problem]

The matrix type display device according to the present invention includes a plurality of row electrode wirings, a plurality of column electrode wirings intersecting the row electrode wirings, and a row electrode wiring at each intersection of the row electrode wirings and the column electrode wirings. An iV j1 method for a matrix display device in which a switching element connected between a column electrode wiring and a column electrode wiring are formed on the same substrate, and in the middle of the manufacturing process,
A short-circuit wiring that short-circuits the ends of all the row electrode wiring and column electrode wiring is formed on the substrate using a conductive material that has lower etching resistance than the end material of the row electrode wiring and column electrode wiring, and the product is At the stage of completion, the short-circuit wiring was removed to disconnect the ends of all the row electrode wiring and column electrode wiring.

[Effect]

In this invention, since the short-circuit wiring is formed of a conductive material that has lower etching resistance than the end material of the row electrode wiring and column electrode wiring, the short-circuit wiring is etched during the manufacturing process and the row electrode wiring and column electrode wiring are etched. Even after the ends of the electrode wiring are separated, the ends of the row electrode wiring and column electrode wiring can be left, so that the short-circuit wiring that short-circuits the ends of the row electrode wiring and the column electrode wiring can be avoided again. can be formed.

(Example) FIG. 1 is a plan view showing a part of the TFT array substrate 7 during the manufacturing process of a liquid crystal display device to which the method of manufacturing a matrix type display device according to the present invention is applied, and FIG. A sectional view taken along the line B-B in Fig. 1 is shown. Figs. 1 and 2
In the figure, numerals 1 to 6 are the same as the conventional device described above.

That is, in this %J base method, l TQ (Indiu
A transparent conductive film (not shown) such as (m Tin oxide) is deposited by an EB evaporation method or the like, and a plurality of pixel electrodes 5 arranged in a matrix in the vertical and horizontal directions are formed by a method such as photolithography. At this time, the part where the gate electrode terminal 2a and its end 2b of the gate electrode wiring 2, which is the row electrode wiring, are located, and the part where the source electrode terminal 3a and its end 3b of the source electrode wiring 3, which is the column electrode wiring, are located. A base member 8 having the same shape as these parts is formed of a conductive material. After this, a conductive material (for example, a metal material such as chrome) having lower etching resistance than the conductive material that will become the base member 8 is selectively deposited on the transparent insulating substrate 1 using a method such as EB evaporation or photolithography. By doing so, the gate electrode wiring 2, the gate electrode terminal 2a and end portion 2b which are part thereof, and the short ring 6 which is a short circuit wiring are formed. Thereafter, a gate insulating film, a source electrode wiring 3 which is an electrode wiring for nine columns of semiconductor layers, a part thereof, a source electrode terminal 3a and an end portion 3b, a substrate passivation film, and a light shielding film are formed in this order. The same conductive material as the gate electrode wiring 2 is selected for the source electrode wiring 3 and the source electrode terminal 3a and end portion 3b that are part thereof.

After interposing a liquid crystal between the thus formed TFT array substrate 7 and a counter substrate having transparent conductive electrodes, color filters, etc., the TFT array substrate 7 is cut at the short ring 6 forming portion. As a result, gate electrode wiring 2 and source electrode wiring 3 are electrically separated, resulting in a completed liquid crystal display device.

When inspecting the TFT array substrate 7 during the manufacturing process, the short ring 6 may be etched and removed at the same time as the above-described light shielding film is formed. As a result, the gate electrode wiring 2 and the source electrode wiring 3 are completely electrically separated, and the TFT array substrate 7 can be inspected. At this time, the base member 8 of the gate electrode wiring 2 and the source electrode wiring 3 remains without being removed because it has higher etching resistance than the short ring 6.

Therefore, after the inspection is completed, if the short ring 6 is re-formed with conductive paste or the like at the location where the short ring 6 was removed on the TFT array substrate 7 using a screen printing method, this new short ring 6
is electrically connected to the remaining base member 8, so that all the gate electrode wirings 2 and source electrode wirings 3 are short-circuited again. Therefore, in the subsequent steps,
Electrostatic damage to the TFT 5 can be prevented.

In the above embodiment, the short ring 6 is formed at the same time as the gate electrode wiring 2 and the gate electrode terminal 2a and end portion 2b, which are part of the gate electrode wiring 2, are formed.
The process is not limited to this, and may be performed simultaneously with the formation of the source electrode wiring 3 and the source electrode terminal 3a and end portion 3b that are part thereof.

〔Effect of the invention〕

As described above, according to the present invention, the short-circuit wiring is formed of a conductive material that has lower etching resistance than the end material of the row electrode wiring and the column electrode wiring, so the short-circuit wiring is etched during the manufacturing process. Even after the ends of the row electrode wiring and column electrode wiring are separated, the ends of the row electrode wiring and column electrode wiring can remain. Therefore, various inspections are performed during the manufacturing process and the row electrode wiring and column electrode wiring are separated again. There is an effect that a short-circuit wiring that short-circuits between the ends of the electrode wiring can be formed.

[Brief explanation of the drawing]

FIG. 1 shows the T during the manufacturing process of a liquid crystal display device to which the method of manufacturing a matrix type display device according to the present invention is applied.
FIG. 2 is a plan view showing a part of the FT array substrate, FIG. 2 is a sectional view taken along the line B-8 in FIG. 1, and FIG. FIG. 4 is a plan view showing an enlarged part of the structure of FIG. 3, and FIG. 5 is a sectional view taken along arrow Δ'-A in FIG. 4. In the figure, 1 is a transparent insulating substrate, 2 is a gate electrode wiring,
2b is the end of the gate electrode wiring, 3 is the source electrode wiring, 3b
4 is a source electrode wiring end, 4 is a TFT, 6 is a short ring, and 8 is a base member. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Masuo Oiwa Figure 8: Lower parts

Claims (1)

[Claims] (1) A plurality of row electrode wirings, a plurality of column electrode wirings that intersect with the row electrode wirings, and a space between the row electrode wiring and the column electrode wiring at each intersection of the row electrode wiring and the column electrode wiring. In a method for manufacturing a matrix display device in which switching elements to be connected are formed on the same substrate, short-circuit wiring that shorts the ends of all row electrode wiring and column electrode wiring is removed from the row electrode wiring during the manufacturing process. A conductive material with lower etching resistance than the end material of the wiring and column electrode wiring is formed on the substrate, and the short circuit wiring is removed at the stage of completing the product, and all row electrode wiring and column electrode wiring are A method for manufacturing a matrix type display device, characterized in that the end portions are separated.