JPH0217878U - - Google Patents
Info
- Publication number
- JPH0217878U JPH0217878U JP9699688U JP9699688U JPH0217878U JP H0217878 U JPH0217878 U JP H0217878U JP 9699688 U JP9699688 U JP 9699688U JP 9699688 U JP9699688 U JP 9699688U JP H0217878 U JPH0217878 U JP H0217878U
- Authority
- JP
- Japan
- Prior art keywords
- resin board
- electronic components
- surface plate
- heater
- correction device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図はこの考案の電子部品の表面実装装置の
一実施例を示す正面図、第２図は基板反り矯正装
置を示す部分拡大斜視図、第３図は従来の電子部
品の表面実装装置を示す正面図、第４図は基板反
り発生の状態を示す部分拡大斜視図である。 なお図中３は基板反り矯正装置、４は定盤、５
は抑え機構、６はヒータ、１０は樹脂基板である
。
一実施例を示す正面図、第２図は基板反り矯正装
置を示す部分拡大斜視図、第３図は従来の電子部
品の表面実装装置を示す正面図、第４図は基板反
り発生の状態を示す部分拡大斜視図である。 なお図中３は基板反り矯正装置、４は定盤、５
は抑え機構、６はヒータ、１０は樹脂基板である
。
Claims (1)
- 半田付け工程の最終工程位置に、電子部品を表
面実装した樹脂基板を載置するフラツトな定盤と
、この定盤上に上記樹脂基板を強制圧接する抑え
機構およびこれによる圧接状態の樹脂基板を加熱
するヒータを有する基板反り矯正装置を設けたこ
とを特徴とする電子部品の表面実装装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9699688U JPH0217878U (ja) | 1988-07-22 | 1988-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9699688U JPH0217878U (ja) | 1988-07-22 | 1988-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217878U true JPH0217878U (ja) | 1990-02-06 |
Family
ID=31322173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9699688U Pending JPH0217878U (ja) | 1988-07-22 | 1988-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217878U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011190458A (ja) * | 2011-06-06 | 2011-09-29 | Hitachi Chem Co Ltd | 接着シート |
| JP2011208152A (ja) * | 2011-06-06 | 2011-10-20 | Hitachi Chem Co Ltd | 接着シート |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5553484A (en) * | 1978-10-16 | 1980-04-18 | Fujitsu Ltd | Method of correcting slet of printed board |
| JPS5553485A (en) * | 1978-10-16 | 1980-04-18 | Fujitsu Ltd | Method of manufacturing printed board |
-
1988
- 1988-07-22 JP JP9699688U patent/JPH0217878U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5553484A (en) * | 1978-10-16 | 1980-04-18 | Fujitsu Ltd | Method of correcting slet of printed board |
| JPS5553485A (en) * | 1978-10-16 | 1980-04-18 | Fujitsu Ltd | Method of manufacturing printed board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011190458A (ja) * | 2011-06-06 | 2011-09-29 | Hitachi Chem Co Ltd | 接着シート |
| JP2011208152A (ja) * | 2011-06-06 | 2011-10-20 | Hitachi Chem Co Ltd | 接着シート |