JPH02172238A - Die-bonding apparatus for semiconductor chip - Google Patents

Abstract

PURPOSE:To halt die-bonding and store semiconductor chips as they remain adhered on an expand tape with strong viscosity by a method wherein ultraviolet rays to be radiated to the expand tape are radiated to the expand tape as per part where one semiconductor chip is adhered. CONSTITUTION:After positioning of a tip 20a of a light guide 20, radiation of ultraviolet rays takes place for several seconds, and viscosity of an expand tape 11 on a part where a thrusting pin 15 is positioned. After viscosity had been sufficiently reduced, a semiconductor chip 12 adhered to the part is thrust by the thrusting pin 15 from a lower position, a thrust semiconductor chip 15 is vacuum-sucked from upward by a collect 16 to have it stripped off from the expand tape 11, and the chip is die-bonded on a specified package or the like. This apparatus enables die-bonding to be halted during operation and remaining semiconductor chips to be stored as they remain adhered on the expand tape with strong viscosity.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor chip die bonding apparatus for peeling off a semiconductor chip from an expanded tape and die bonding it to a package, lead frame, or the like.

[Conventional technology]

In the manufacturing process of semiconductor devices, a semiconductor wafer is attached to an expanding tape, the semiconductor wafer is divided into chips on the expanding tape, and the divided semiconductor chips are peeled off one by one from the expanding tape.
This is carried out by die bonding to a predetermined package or the like.

Expanded tape is an adhesive tape whose surface is coated with an adhesive. A material with strong adhesive strength is used to prevent it from shifting due to water pressure.

As mentioned above, if you use adhesive with strong adhesive strength,
When peeling off a semiconductor chip from an expanded tape and performing die bonding, if the semiconductor chip has a so-called back metal,
When peeling off the semiconductor chip from the expandable tape, the back metal sometimes peeled off.

In such cases, in order to prevent the back metal from peeling off, before peeling off the semiconductor chip from the extract band tape, the extract band tape is irradiated with ultraviolet rays to reduce the adhesive strength of the extract band tape. Semiconductor chips are pulled from a tape and subjected to die bonding.

This situation is shown in FIG. As shown in the figure, a large number of semiconductor chips 2 are attached to the surface of the expanded tape 1. The expandable tape 1 is supported by an expandable ring (not shown) at its outer periphery. A light emitting unit 3 that emits ultraviolet light is placed below the expandable tape 1, and the entire back surface of the expandable tape 1 is irradiated with ultraviolet light.
While pushing up the semiconductor chips 2 one by one from below, the semiconductor chips 2 are vacuum-sucked one by one from above by a collet 6, and the semiconductor chips 2 are peeled off from the expandable tape 1. The peeled off semiconductor chip 2 is then die-bonded to a predetermined package (not shown) or the like.

[Problem to be solved by the invention]

However, if you leave, for example, half of the semiconductor chip 2 on the expandable tape 1 and stop die bonding midway through, and try to store the remaining semiconductor chip 2 while remaining bonded on the expandable tape 1, conventionally When irradiating the tape 1 with ultraviolet rays, the entire back side of the extract band tape 1 was irradiated with ultra violet rays, so the adhesive strength of the entire extract band tape 1 decreased due to the ultraviolet irradiation, and the adhesive strength also deteriorated during storage. Since the force naturally decreases slightly, the position of the semiconductor chip 2 may shift due to some external force during storage, causing problems such as poor quality, and it is not suitable for restoring.

Therefore, in view of the above-mentioned circumstances, the present invention has been devised to provide a die bonding device for semiconductor chips, which is capable of stopping die bonding midway through and storing remaining semiconductor chips while being adhered to an expandable tape with strong adhesive force. is intended to provide.

[Means to solve the problem]

In order to achieve the above object, in the semiconductor chip die bonding apparatus according to the present invention, the ultraviolet rays irradiated onto the expanded band tape are irradiated to each area where one semiconductor chip is bonded. It has become.

[Effect]

With this structure, in the semiconductor chip die bonding apparatus according to the present invention, it is possible to weaken the adhesive force of the expandable tape for fixing each semiconductor chip.

〔Example〕.

Embodiments of the present invention will be described below with reference to FIG.

FIG. 1 is a diagram schematically showing features of a semiconductor chip die bonding apparatus according to the present invention. In addition, in the figure, the expanded tape is viewed diagonally from below.

As shown in FIG. 1, the semiconductor chip die bonding apparatus according to the present invention pushes up a large number of semiconductor chips 12 attached to the surface of the expanded tape 11 one by one from the back side of the expanded tape 11. A push-up pin 15, a collet 16 that vacuum-chucks the pushed-up semiconductor chips 12 one by one from the front side of the expand band tape 11 and peels them off from the expand band tape 11, and a collet 16 that vacuum-chucks the semiconductor chips 12 that have been pushed up one by one from the front side of the expand band tape 11, and extracts each semiconductor chip from each part to which it is bonded. Ultraviolet irradiation means 17 for irradiating the band tape 11 with ultraviolet rays
It is equipped with

The push-up pin 15 and the collet 16 are not different from the conventional ones, so a detailed explanation thereof will be omitted.

The ultraviolet irradiation means 17 mainly includes a light emitting section 1 that emits ultraviolet light.
8 and is optically coupled to this light emitting section 18 at one end, and
It is comprised of a light guide 20 facing the back surface of the expanded tape 11 at the other end. light guide 20
is, for example, a bundle of flexible optical fibers bundled to an appropriate thickness, and optical coupling between the light emitting section 18 and the light guide 20 is achieved through a condensing lens 22 within the cylindrical body 21. ing. Light guide 20 expand tape 1
The end portion 20a facing the back surface of the expanded tape 11 is bundled in a rectangular cross section to match the shape of the semiconductor chip 12, and the irradiated portion A ( (shown with diagonal lines in Figure 1)
corresponds to the back surface of one semiconductor chip 12 bonded to the front surface.

Next, the operation of the semiconductor chip die bonding apparatus according to the present invention will be explained.

First, as shown in FIG.
When the expandable tape 11 to which is attached is set in the die bonding device, the push-up pin 15
and the collet 16 are aligned with one of the semiconductor chips 12 on the expanded tape 11. This alignment is performed by conventionally known pattern recognition or the like. At this time, the end 20a of the light guide 20
are also positioned at the same time. The end portion 20a of the light guide 20 is positioned so that the ultraviolet rays emitted from the end portion 20a are irradiated onto the back surface of the bonded portion of the semiconductor chip 12 where the push-up pins 15 and collet 16 are aligned. However, as shown in the figure, the push-up pin 15 is located below the aligned semiconductor chip 12, so the end 20a of the light guide 20 is attached to the expanded tape where the semiconductor chip 12 is bonded. The expanded tape 11 is positioned diagonally below the expandable tape 11, and the expandable tape 11 is irradiated with ultraviolet rays from diagonally below. In addition,
The end 20 of the light guide 20 positioned in this way
It is preferable that the end portion 20a of the light guide 20 can be positioned at the same time by simply aligning the push-up bin 15 if the push-up bin 15 and the push-up bin 15 are fixed to each other so that their relative positions do not collapse.

After positioning the end portion 20a of the light guide 20, ultraviolet rays are irradiated for several seconds to weaken the adhesive force of the expandable tape 11 in the portion where the push-up bottle 15 is aligned. After the adhesive force is sufficiently reduced by this ultraviolet irradiation, the semiconductor chip 12 bonded thereto is pushed up from below with a push-up pin 15, and the pushed-up semiconductor chip 15 is placed in front of the vacuum from above with a collet 16. It is peeled off from the expanded tape 11 and die-bonded to a predetermined package (not shown) or the like. This operation is performed sequentially for each semiconductor chip 12 bonded on the expandable tape 11.
It is designed to be repeated.

Note that the above-mentioned operations are managed and controlled in an integrated manner by a control section (not shown) comprising a CPU, ROM, RAM, etc.

In FIG. 1, the irradiated portion A that is irradiated with ultraviolet rays corresponds to the area and shape of the back surface of the semiconductor chip 12, but the irradiated portion A extends to the gap between each semiconductor chip 12. It may be spread out, or it may be further spread over the back surfaces of adjacent semiconductor chips 12. however,
Expanding tape 11 for fixing adjacent semiconductor chips 12 covered by irradiated area A when die bonding is stopped midway and the remaining semiconductor chips 12 are to be stored while being adhered to expandable tape 11
The adhesive force must remain to such an extent that the semiconductor chip 12 will not be misaligned in the container due to some external force being applied to the semiconductor chip 12 during storage. Conversely, the irradiated portion A may be smaller than the area of the back surface of the semiconductor chip 12 as long as the adhesive force can be sufficiently weakened.

Furthermore, in the above embodiment, the push-up bottle 15 and the end portion 20a of the light guide 20 are positioned at the same time, but these positionings do not necessarily have to be done at the same time. end 2 of
0a may be positioned before the push-up pin 15, or conversely, may be positioned after the push-up pin 15. However, before the semiconductor chip 12 is peeled off from the expanded tape 11, it is only necessary to reliably weaken the adhesive force to the semiconductor chip 12 to be peeled off.

〔Effect of the invention〕

As explained above, in the semiconductor chip die bonding apparatus according to the present invention, the ultraviolet rays irradiated onto the expandable tape are irradiated onto the expandable tape at each portion where one semiconductor chip is bonded. . Therefore, it is possible to weaken the sticky force of the expandable tape that fixes each semiconductor chip, and when the required number of semiconductor chips has been die-bonded, die bonding can be stopped midway and the remaining semiconductor It becomes possible to store the chip while it is attached to the expandable tape with strong adhesive force.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an overview of a semiconductor chip die bonding apparatus according to the present invention, and FIG. 2 is a perspective view showing an overview of a conventional semiconductor chip die bonding apparatus. 1.11... Expanding tape, 2.12... Semiconductor chip, 3, 18... Light emitting part, 5.15... Push-up pin, 6.16... Collet, 17... Ultraviolet irradiation Means, 20...Light guide. Patent applicant: Sumitomo Electric Industries, Ltd.

Claims (1)

[Scope of Claims] A die bonding device for semiconductor chips that performs die bonding by peeling off semiconductor chips from an expanded tape having a plurality of semiconductor chips adhered to an adhesive surface, the expanded tape being irradiated with ultraviolet rays. comprising an ultraviolet irradiation means, the ultraviolet irradiation means having a light emitting part that emits ultraviolet light, and a flexible light guide optically coupled to the light emitting part at one end and facing the expanded tape at the other end, A die bonding apparatus for semiconductor chips, wherein the ultraviolet rays emitted from the other end of the light guide are irradiated onto the expanded tape at each portion where one semiconductor chip is bonded.