JPH02166909A - Method for performing fine adjustment on delay time of surface acoustic wave delay line - Google Patents
Method for performing fine adjustment on delay time of surface acoustic wave delay lineInfo
- Publication number
- JPH02166909A JPH02166909A JP32230888A JP32230888A JPH02166909A JP H02166909 A JPH02166909 A JP H02166909A JP 32230888 A JP32230888 A JP 32230888A JP 32230888 A JP32230888 A JP 32230888A JP H02166909 A JPH02166909 A JP H02166909A
- Authority
- JP
- Japan
- Prior art keywords
- delay time
- delay line
- delay
- saw
- parylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 14
- 229920000052 poly(p-xylylene) Polymers 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 238000012544 monitoring process Methods 0.000 claims abstract description 8
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims abstract description 3
- 238000007740 vapor deposition Methods 0.000 abstract description 5
- 238000005229 chemical vapour deposition Methods 0.000 abstract description 3
- 238000001704 evaporation Methods 0.000 abstract description 3
- 230000008020 evaporation Effects 0.000 abstract description 3
- 239000012808 vapor phase Substances 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 1
- 238000000151 deposition Methods 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000008021 deposition Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、弾性表面波(SAW)遅延線の製造において
、該SAW遅延線の遅延時間を微調整する方法に関する
。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for fine-tuning the delay time of a surface acoustic wave (SAW) delay line in the manufacture of the same.
(従来の技術)
SAW遅延線の製造過程において、遅延時間を変化させ
る要因(製造偏差要因)としては、(1)基板の音速の
ばらつき
(2)電極指の膜厚
(3)ウェハー内の膜厚分布
等が挙げられる。 これらの製造偏差要因を管理しても
0.3%程度の遅延時間のばらつきが生ずる。(Prior art) In the manufacturing process of a SAW delay line, factors that change the delay time (manufacturing deviation factors) include (1) variation in the sound speed of the substrate, (2) film thickness of electrode fingers, and (3) film within the wafer. Examples include thickness distribution. Even if these manufacturing deviation factors are controlled, a variation in delay time of about 0.3% occurs.
このために、遅延時間偏差が0.5%程度に通常製造さ
れるSAW遅延線の遅延時間を、通常のプロセスのみで
、目的の偏差内に合わせることは、前述の要因により困
難であることがわかる。 強いては歩留りを低下させ、
生産性を悪化させる。For this reason, it is difficult to adjust the delay time of SAW delay lines, which are normally manufactured with a delay time deviation of about 0.5%, to within the desired deviation using only normal processes due to the factors mentioned above. Recognize. In the end, it reduces the yield,
Decreases productivity.
従って、SAW遅延線を製造した後に、遅延時間を測定
器で監視しながら、基板表面に絶縁性薄膜(例えば51
02 ) t′スパッタ法や真空蒸着法により堆積させ
て形成し、遅延時間を微調整する方法が考え出されてい
た。Therefore, after manufacturing the SAW delay line, while monitoring the delay time with a measuring device, an insulating thin film (for example, 51
02) A method has been devised in which the film is deposited by t' sputtering or vacuum evaporation, and the delay time is finely adjusted.
(発明が解決しようとする課題)
しかし、上記の3102等をスパッタ法や真空蒸着法で
基板表面に堆積させる方法では、成膜時における温度上
昇により、SAW遅延線に熱的支障を与えたり、温度特
性により遅延時間が変化したりしていて、折角測定器で
監視しながら遅延時間を調整しても、常温に戻ると変化
してしまっており、正確な微調整が困難であることがわ
かった。(Problems to be Solved by the Invention) However, in the method of depositing 3102 and the like on the substrate surface by sputtering or vacuum evaporation, the temperature rise during film formation may cause thermal problems to the SAW delay line. The delay time changes depending on the temperature characteristics, and even if you adjust the delay time while monitoring it with an angle measuring device, it will change when the temperature returns to room temperature, making it difficult to make accurate fine adjustments. Ta.
本発明は、これらの欠点を解決するために為されたもの
であり、SAW遅延線に熱的支障を与えずに、常温にて
遅延時間を測定器で監視しながら、高精度に遅延時間を
微調整できるようにすることを目的としたものである。The present invention was made to solve these drawbacks, and it is possible to measure the delay time with high precision while monitoring the delay time with a measuring device at room temperature without causing any thermal damage to the SAW delay line. The purpose is to allow fine adjustments.
(課題を解決するための手段)
本発明は、SAW遅延線の遅延時間を群遅延特性測定器
等でモニターしながら、熱可塑性樹脂パリレンを常温化
学気相反応法(以下常温CVD法という)でSAW遅延
線の基板表面上に堆積させてパリレンのfHiを形成し
、形成される前記パリレンの膜の厚さを制御して前記遅
延時間を微調整する方法である。(Means for Solving the Problems) The present invention uses a room-temperature chemical vapor phase reaction method (hereinafter referred to as "room-temperature CVD method") to prepare thermoplastic resin parylene while monitoring the delay time of a SAW delay line using a group delay characteristic measuring instrument or the like. In this method, fHi of parylene is formed by depositing it on the substrate surface of the SAW delay line, and the thickness of the formed parylene film is controlled to finely adjust the delay time.
(作用)
パリレン膜の長所として、
(1)ピンホールのない均一なWj腹ココ−ティング可
能
(2)膜厚のコントロールがし易い
(3)優れた絶縁特性、耐溶剤性
(4)応力を伴わない堆積が可能
が挙げられ、SAW遅延線の基板表面の遅延時間微調整
用コーテイング材として有効である。 このような熱可
塑性樹脂パリレンを常温CVD法により成膜するので、
SAW遅延線に熱的支障を与えないで済む。(Function) The advantages of parylene film are: (1) Enables uniform WJ coating without pinholes (2) Easy to control film thickness (3) Excellent insulation properties and solvent resistance (4) Stress resistance It is effective as a coating material for finely adjusting the delay time on the substrate surface of a SAW delay line. Since this kind of thermoplastic resin parylene is formed into a film by the normal temperature CVD method,
There is no need to cause thermal trouble to the SAW delay line.
その結果、遅延時間偏差0.1%以下のSAW遅延線を
歩留り良く、効率的に設計、製造することができる。
また、本発明による遅延時間の可変量も、挿入損失の増
加しない範囲として2%程度と、製造偏差分に対し十分
大きいことがわかり、生産性の向上に寄与できる。As a result, a SAW delay line with a delay time deviation of 0.1% or less can be efficiently designed and manufactured with high yield.
Furthermore, the variable amount of the delay time according to the present invention is about 2%, which is a range in which the insertion loss does not increase, which is sufficiently large compared to the manufacturing deviation, and can contribute to improving productivity.
(実施例)
第1図は本発明の方法を実施する装置例を示す図、第2
図は蒸着室内のSAW遅延線周辺部の拡大図で、1は熱
可塑性樹脂パリレンの蒸発部、2は蒸着室、3は排気系
ポンプ、4はSAW遅延線、5は群遅延特性測定用のネ
ットワークアナライザ、6は基板表面露出用カバー 7
は群遅延特性測定用治具、8は測定用同軸ケーブル、9
はシャッターである。(Example) Fig. 1 is a diagram showing an example of an apparatus for carrying out the method of the present invention, and Fig. 2
The figure is an enlarged view of the area around the SAW delay line in the deposition chamber, where 1 is the evaporation part of the thermoplastic resin parylene, 2 is the deposition chamber, 3 is the exhaust system pump, 4 is the SAW delay line, and 5 is the area for measuring group delay characteristics. Network analyzer, 6 is a cover for exposing the board surface 7
8 is a jig for measuring group delay characteristics, 8 is a coaxial cable for measurement, 9 is
is the shutter.
これを動作させるには、先ず基板表面だけを露出するよ
うに基板表面露出用カバー6をSAW遅延線4に被せ、
該SAW遅延UJ4f:M着室2に入れ、群遅延特性測
定用治具7に取り付けた後、蒸着室2内を排気系ポンプ
3で空気を抜いて真空にする。 そしてSAW遅延線4
の遅延時間をネットワークアナライザ5で測定しながら
、熱可塑性樹脂パリレンを常温CVD法により蒸発部1
から蒸着室2内に導入する。 ついでシャッター9を開
き、SAW遅延!4の基板表面上にパリレンを堆積させ
て行くと、パリレンの質量により表面波の伝播速度が遅
くなり、SAW遅延線4の遅延時間が増加する。 そこ
で、目的とする遅延時間と一致したところでシャッター
9を閉じ、熱可塑性樹脂パリレンの堆積を終了させる。To operate this, first cover the SAW delay line 4 with the substrate surface exposure cover 6 so that only the substrate surface is exposed.
After putting the SAW delay UJ4f:M into the deposition chamber 2 and attaching it to the group delay characteristic measurement jig 7, the inside of the deposition chamber 2 is evacuated by the exhaust system pump 3 to create a vacuum. and SAW delay line 4
While measuring the delay time of
It is introduced into the vapor deposition chamber 2 from above. Then open shutter 9 and SAW delay! As parylene is deposited on the surface of the substrate 4, the propagation speed of the surface wave slows down due to the mass of the parylene, and the delay time of the SAW delay line 4 increases. Therefore, the shutter 9 is closed when the desired delay time coincides with the end of the deposition of the thermoplastic resin parylene.
(発明の効果)
この方法は、SAW遅延線の常温における群遅延時間特
性を常にモニターしながら、遅延時間の微調整ができる
ので、リアルタイムで遅延時間が合わせられるという、
従来の方法では得られなかった利点がある。 また、歩
留りが向上し、更に、遅延時間偏差0.1%以下の高精
度のSAW遅延線の設計、製造が可能になる利点がある
。(Effect of the invention) This method allows fine adjustment of the delay time while constantly monitoring the group delay time characteristics of the SAW delay line at room temperature, so the delay time can be adjusted in real time.
There are advantages not available with conventional methods. Further, there are advantages in that the yield is improved and it is possible to design and manufacture a highly accurate SAW delay line with a delay time deviation of 0.1% or less.
第1図は本発明の方法を実施する装置例を示す図、第2
図は蒸着室内のSAW遅延線周辺部の拡大図である。
1・・・蒸発部、 2・・・蒸着室、3・・・排気
系ポンプ、4・・・SAW遅延線、5・・・ネットワー
クアナライザ、
6・・・基板表面露出用カバー
7・・・群遅延特性測定用治具、
8・・・測定用同軸ケーブル、
9・・・シャッターFIG. 1 is a diagram showing an example of an apparatus for carrying out the method of the present invention, and FIG.
The figure is an enlarged view of the area around the SAW delay line inside the deposition chamber. DESCRIPTION OF SYMBOLS 1... Evaporation part, 2... Vapor deposition chamber, 3... Exhaust system pump, 4... SAW delay line, 5... Network analyzer, 6... Cover for substrate surface exposure 7... Group delay characteristic measurement jig, 8... Coaxial cable for measurement, 9... Shutter
Claims (1)
該遅延時間を微調整する方法において、熱可塑性樹脂ポ
リ・パラ・キシレン(poly para xylyl
ene)(以下パリレンという)を常温化学気相反応法
により前記弾性表面波遅延線の基板表面上に堆積させて
前記パリレンの膜を形成し、前記遅延時間を測定器で監
視しながら形成される前記パリレンの膜の厚さを制御し
て前記遅延時間を微調整するようにしたことを特徴とす
る弾性表面波遅延線の遅延時間微調整方法。In a method of finely adjusting the delay time of a surface acoustic wave delay line while monitoring the delay time with a measuring device, thermoplastic resin poly para
ene) (hereinafter referred to as parylene) is deposited on the surface of the substrate of the surface acoustic wave delay line by a room temperature chemical vapor reaction method to form the parylene film, and the film is formed while monitoring the delay time with a measuring device. A method for finely adjusting the delay time of a surface acoustic wave delay line, characterized in that the delay time is finely adjusted by controlling the thickness of the parylene film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32230888A JPH02166909A (en) | 1988-12-21 | 1988-12-21 | Method for performing fine adjustment on delay time of surface acoustic wave delay line |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32230888A JPH02166909A (en) | 1988-12-21 | 1988-12-21 | Method for performing fine adjustment on delay time of surface acoustic wave delay line |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02166909A true JPH02166909A (en) | 1990-06-27 |
Family
ID=18142180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32230888A Pending JPH02166909A (en) | 1988-12-21 | 1988-12-21 | Method for performing fine adjustment on delay time of surface acoustic wave delay line |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02166909A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001029553A1 (en) * | 1999-10-15 | 2001-04-26 | Forschungszentrum Karlsruhe Gmbh | Method for producing surface acoustic wave sensors and such a surface acoustic wave sensor |
JP2015141165A (en) * | 2014-01-30 | 2015-08-03 | 日本無線株式会社 | surface acoustic wave sensor and measuring device |
-
1988
- 1988-12-21 JP JP32230888A patent/JPH02166909A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001029553A1 (en) * | 1999-10-15 | 2001-04-26 | Forschungszentrum Karlsruhe Gmbh | Method for producing surface acoustic wave sensors and such a surface acoustic wave sensor |
US6640613B2 (en) | 1999-10-15 | 2003-11-04 | Forschungszentrum Karlsruhe Gmbh | Method for producing surface acoustic wave sensors and such a surface acoustic wave sensor |
JP2015141165A (en) * | 2014-01-30 | 2015-08-03 | 日本無線株式会社 | surface acoustic wave sensor and measuring device |
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