JPH02166245A - 大気溶解可能な高導電性耐熱銅合金 - Google Patents
大気溶解可能な高導電性耐熱銅合金Info
- Publication number
- JPH02166245A JPH02166245A JP32271688A JP32271688A JPH02166245A JP H02166245 A JPH02166245 A JP H02166245A JP 32271688 A JP32271688 A JP 32271688A JP 32271688 A JP32271688 A JP 32271688A JP H02166245 A JPH02166245 A JP H02166245A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- copper alloy
- heat resistance
- alloy
- conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 19
- 238000002844 melting Methods 0.000 title abstract description 5
- 230000008018 melting Effects 0.000 title abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 29
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 11
- 229910052749 magnesium Inorganic materials 0.000 abstract description 8
- 229910045601 alloy Inorganic materials 0.000 abstract description 6
- 239000000956 alloy Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 238000010405 reoxidation reaction Methods 0.000 abstract description 3
- 238000010348 incorporation Methods 0.000 abstract 2
- 229910052709 silver Inorganic materials 0.000 abstract 2
- 230000006866 deterioration Effects 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 22
- 229910052802 copper Inorganic materials 0.000 description 20
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- 239000011575 calcium Substances 0.000 description 10
- 229910052760 oxygen Inorganic materials 0.000 description 10
- 239000001301 oxygen Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 239000011777 magnesium Substances 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- PZKRHHZKOQZHIO-UHFFFAOYSA-N [B].[B].[Mg] Chemical compound [B].[B].[Mg] PZKRHHZKOQZHIO-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 229910017818 Cu—Mg Inorganic materials 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32271688A JPH02166245A (ja) | 1988-12-20 | 1988-12-20 | 大気溶解可能な高導電性耐熱銅合金 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32271688A JPH02166245A (ja) | 1988-12-20 | 1988-12-20 | 大気溶解可能な高導電性耐熱銅合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02166245A true JPH02166245A (ja) | 1990-06-26 |
JPH0457732B2 JPH0457732B2 (enrdf_load_stackoverflow) | 1992-09-14 |
Family
ID=18146825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32271688A Granted JPH02166245A (ja) | 1988-12-20 | 1988-12-20 | 大気溶解可能な高導電性耐熱銅合金 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02166245A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997031129A1 (de) * | 1996-02-20 | 1997-08-28 | Berkenhoff Gmbh | Elektrische kontaktelemente |
JP2008516081A (ja) * | 2004-10-11 | 2008-05-15 | ディール、メタル、シュティフトゥング、ウント、コンパニー、コマンディトゲゼルシャフト | 銅/亜鉛/ケイ素の合金、その使用方法およびその製造方法 |
-
1988
- 1988-12-20 JP JP32271688A patent/JPH02166245A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997031129A1 (de) * | 1996-02-20 | 1997-08-28 | Berkenhoff Gmbh | Elektrische kontaktelemente |
US5981090A (en) * | 1996-02-20 | 1999-11-09 | Berkenhoff Gmbh | Pins for electronic assemblies |
CN1081676C (zh) * | 1996-02-20 | 2002-03-27 | 贝尔肯霍夫有限公司 | 电子组件的插头脚 |
JP2008516081A (ja) * | 2004-10-11 | 2008-05-15 | ディール、メタル、シュティフトゥング、ウント、コンパニー、コマンディトゲゼルシャフト | 銅/亜鉛/ケイ素の合金、その使用方法およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0457732B2 (enrdf_load_stackoverflow) | 1992-09-14 |
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