JPH02165650A - Semiconductor manufacturing device - Google Patents
Semiconductor manufacturing deviceInfo
- Publication number
- JPH02165650A JPH02165650A JP63321370A JP32137088A JPH02165650A JP H02165650 A JPH02165650 A JP H02165650A JP 63321370 A JP63321370 A JP 63321370A JP 32137088 A JP32137088 A JP 32137088A JP H02165650 A JPH02165650 A JP H02165650A
- Authority
- JP
- Japan
- Prior art keywords
- quartz boat
- semiconductor wafer
- detects
- detector
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000010453 quartz Substances 0.000 claims abstract description 46
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 46
- 235000012431 wafers Nutrition 0.000 claims description 31
- 239000000428 dust Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野］
本発明は、半導体ウェハをキャリアから石英ボートに、
あるいは１石英ボートからキャリアに移し賛える機構を
有する半導体製造装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method for transferring semiconductor wafers from a carrier to a quartz boat.
Alternatively, the present invention relates to a semiconductor manufacturing device having a mechanism for transferring the quartz from a quartz boat to a carrier.
【従来の技術］
従来、特開昭５９−４８９３７に記載され、第２図に示
すように、石英ボート９に設けられている満２の位置を
検出するＩＴＶカメラ１１を付設し、この検出信号によ
って１石英ボート９を支持する受台ｌＯを移動させるこ
とにより、満２の位置出しを容易にした半導体製造装置
が知られていた。[Prior Art] Conventionally, as described in Japanese Patent Application Laid-Open No. 59-48937, as shown in FIG. A semiconductor manufacturing apparatus has been known that facilitates the positioning of quartz boats 9 by moving a cradle 10 that supports 1 quartz boat 9.
〔発明が解決しようとする課題１
しかし、従来の半導体製造装置は１石英ボート上に半導
体ウェハが置かれた際、半導体ウェハが障害物となり、
石英ボートの溝を検出しにくく、正確な位置出しができ
ないという課題を有していた。[Problem to be solved by the invention 1 However, in conventional semiconductor manufacturing equipment, when a semiconductor wafer is placed on a quartz boat, the semiconductor wafer becomes an obstacle.
The problem was that it was difficult to detect the grooves of the quartz boat, making accurate positioning impossible.
そこで本発明は従来のこのような課題を解決するため、
石英ボート上に半導体ウェハが置かれた際、正確な位置
出しをする半導体製造装置を提供することを目的とする
。Therefore, in order to solve these conventional problems, the present invention has the following features:
An object of the present invention is to provide a semiconductor manufacturing device that accurately positions a semiconductor wafer when it is placed on a quartz boat.
また、従来の半導体製造装置は１石英ボートを支持する
受台を移動させるため、石英ボート上に半導体ウェハを
置いた場合、移動時に、石英ボートと半導体ウェハが干
渉し、半導体ウェハの損傷あるいは、発塵が起りやすい
という課題を有していた。In addition, in conventional semiconductor manufacturing equipment, the pedestal supporting the quartz boat is moved, so if a semiconductor wafer is placed on the quartz boat, the quartz boat and the semiconductor wafer may interfere with each other during movement, resulting in damage to the semiconductor wafer or damage to the semiconductor wafer. The problem was that dust generation was likely to occur.
本発明の他の目的は１石英ポートを支持する受台を固定
して、半導体ウェハの損傷、あるいは。Another object of the present invention is to fix the pedestal supporting the quartz port to prevent damage to the semiconductor wafer or the like.
発塵の少ない半導体製造装置を提供する点にある。The object of the present invention is to provide a semiconductor manufacturing device that generates less dust.
［課題を解決するための手段１
上記課題を解決するため、本発明の半導体製造装置は、
半導体ウェハを、キャリアから石英ボートに、あるいは
１石英ボートからキャリアに移し替える機構を有する半
導体製造装置において１石英ボートの有する溝の位置を
検出する検出器と、石英ボート上に置かれた半導体ウェ
ハを検出する検出器を有することを特徴とする。[Means for Solving the Problems 1 In order to solve the above problems, the semiconductor manufacturing apparatus of the present invention includes:
A detector for detecting the position of a groove in a quartz boat in a semiconductor manufacturing apparatus having a mechanism for transferring a semiconductor wafer from a carrier to a quartz boat or from a quartz boat to a carrier; and a semiconductor wafer placed on the quartz boat. It is characterized by having a detector that detects.
また、かかる半導体製造装置の、石英ボートの有する溝
を検出する検出器と１石英ボート上に置かれた半導体ウ
ェハな検出する検出器が移動手段を有することを特徴と
する。Further, the semiconductor manufacturing apparatus is characterized in that the detector for detecting grooves in the quartz boat and the detector for detecting the semiconductor wafer placed on the quartz boat each have moving means.
〔実 施 例Ｊ
以下に１本発明の実施例を図面にもとづいて、説明する
。第１図において、駆動源８によって移動する移動台４
に、該移動台４に石英ボート１の満２を検出するＩＴＶ
カメラ５と、半導体ウェハ３の端面を検出するＩＴＶカ
メラ６を配設する。[Embodiment J] An embodiment of the present invention will be described below based on the drawings. In FIG. 1, a moving platform 4 is moved by a drive source 8.
Then, an ITV is installed on the movable table 4 to detect that the quartz boat 1 is fully loaded.
A camera 5 and an ITV camera 6 for detecting the end face of the semiconductor wafer 3 are provided.
このとき、石英ボート１は固定され、移動台４は、該石
英ボート１の満２の並び方向に平行移動し、該石英ボー
トｌの満２を検出するＩＴＶカメラ５は、移動台４に、
満２上方向から溝２を映す位置に、また、半導体ウェハ
３の端面を検出するＩＴＶカメラ６は、該石英ボートｌ
上の半導体ウェハ３の外周方向から、該半導体ウェハ３
の端面を映す位置に、それぞれ配置される。At this time, the quartz boat 1 is fixed, and the movable table 4 moves in parallel in the direction in which the quartz boats 1 are lined up.
The ITV camera 6 is located at a position that images the groove 2 from above and also detects the end face of the semiconductor wafer 3.
From the outer circumferential direction of the upper semiconductor wafer 3, the semiconductor wafer 3
are placed at positions that reflect the end faces of each.
移動台４は、駆動源８によって移動する。The movable table 4 is moved by a drive source 8.
固定された石英ボートｌ上に半導体ウェハ３がない場合
は、該石英ボート１の満２を検出するＩＴＶカメラ５が
、該石英ボート１の満２を検知する。If there is no semiconductor wafer 3 on the fixed quartz boat l, the ITV camera 5 detects when the quartz boat 1 is full.
該石英ボート１上に半導体ウェハ３が置かれている場合
は、該石英ボートｌ上の該半導体ウェハ３の端面を検出
するＩＴＶカメラ６が、該半導体ウェハ３の端面な検知
する。ここで、半導体ウェハ３を保持する機能を有する
アーム７を用いて、石英ボート１の溝２への半導体ウェ
ハ３の差し込み、あるいは、該石英ボートｌ上に置かれ
た半導体ウェハ３の取り込みを行う。When a semiconductor wafer 3 is placed on the quartz boat 1, the ITV camera 6 that detects the end face of the semiconductor wafer 3 on the quartz boat 1 detects the end face of the semiconductor wafer 3. Here, using the arm 7 having the function of holding the semiconductor wafer 3, the semiconductor wafer 3 is inserted into the groove 2 of the quartz boat 1, or the semiconductor wafer 3 placed on the quartz boat 1 is taken in. .
〔発明の効果Ｊ
本発明は、以上説明したように２石英ボートの有する溝
の位置を検出する検出器と、石英ボート上に置かれた半
導体ウェハを検出する検出器を有することにより、石英
ボート上の半導体ウェハの有無にかかわらず、正確な位
置出しができる効果がある。[Effect of the Invention J] As explained above, the present invention has two detectors for detecting the position of the grooves of the quartz boat and a detector for detecting the semiconductor wafer placed on the quartz boat. This has the effect of allowing accurate positioning regardless of the presence or absence of a semiconductor wafer on top.
また、該検出器が移動手段を有することにより石英ボー
ト上の半導体ウェハ干渉による、半導体ウェハの損傷や
、発塵も軽減できる効果がある。Furthermore, since the detector has a moving means, damage to the semiconductor wafer and dust generation due to interference with the semiconductor wafer on the quartz boat can be reduced.
第１図は、本発明にかかる半導体製造装置を示す図、第
２図は従来の技術を示す図。
１．９ ・
２ ・ ・ ・
３ ・ ・ ・
４ ・ ・ ・
５、６゜
７ ・ ・ ・
８ ・ ・ ・
１０ ・ ・ ・
石英ボート
溝
半導体ウェハ
移動台
ＩＴＶカメラ
アーム
駆動源
受台
以上
出願人 セイコーエプソン株式会社FIG. 1 is a diagram showing a semiconductor manufacturing apparatus according to the present invention, and FIG. 2 is a diagram showing a conventional technique. 1.9 ・ 2 ・ ・ 3 ・ ・ 4 ・ ・ 5, 6゜7 ・ ・ 8 ・ ・ 10 ・ ・ ・ Quartz boat groove Semiconductor wafer moving platform ITV camera arm drive source cradle and above Applicant Seiko Epson Corporation
Claims (2)
るいは、石英ボートからキャリアに移し替える機構を有
する半導体製造装置において、石英ボートの有する溝の
位置を検出する検出器と、石英ボート上に置かれた半導
体ウェハを検出する検出器を有することを特徴とする半
導体製造装置。(1) In semiconductor manufacturing equipment having a mechanism for transferring semiconductor wafers from a carrier to a quartz boat or from a quartz boat to a carrier, a detector for detecting the position of a groove in a quartz boat and a detector placed on the quartz boat are used. 1. A semiconductor manufacturing apparatus comprising a detector for detecting a semiconductor wafer.
ート上に置かれた半導体ウェハを検出する検出器が移動
手段を有することを特徴とする請求項１記載の半導体製
造装置。(2) The semiconductor manufacturing apparatus according to claim 1, wherein the detector for detecting the groove of the quartz boat and the detector for detecting the semiconductor wafer placed on the quartz boat have moving means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63321370A JPH02165650A (en) | 1988-12-20 | 1988-12-20 | Semiconductor manufacturing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63321370A JPH02165650A (en) | 1988-12-20 | 1988-12-20 | Semiconductor manufacturing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02165650A true JPH02165650A (en) | 1990-06-26 |
Family
ID=18131810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63321370A Pending JPH02165650A (en) | 1988-12-20 | 1988-12-20 | Semiconductor manufacturing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02165650A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7219676B2 (en) * | 2002-09-03 | 2007-05-22 | Samsung Electronics Co., Ltd. | Substrate detecting apparatus |
| WO2015033439A1 (en) * | 2013-09-06 | 2015-03-12 | 株式会社島津製作所 | Substrate mounting attitude determination device and substrate mounting attitude determination method |
-
1988
- 1988-12-20 JP JP63321370A patent/JPH02165650A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7219676B2 (en) * | 2002-09-03 | 2007-05-22 | Samsung Electronics Co., Ltd. | Substrate detecting apparatus |
| WO2015033439A1 (en) * | 2013-09-06 | 2015-03-12 | 株式会社島津製作所 | Substrate mounting attitude determination device and substrate mounting attitude determination method |
| JP5999268B2 (en) * | 2013-09-06 | 2016-09-28 | 株式会社島津製作所 | Substrate mounting posture determination apparatus and substrate mounting posture determination method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1219394B1 (en) | Articulated robot | |
| EP0931623B1 (en) | Automatic workpiece transport apparatus for double-side polishing machine | |
| TW360898B (en) | Semiconductor fabricating apparatus, method for modifying positional displacements of a wafer in a wafer cassette within the semiconductor fabricating apparatus and method for transferring the wafer cassette | |
| US20170190019A1 (en) | Automatic handling apparatus | |
| JPH0362011B2 (en) | ||
| JPH11198068A (en) | Material conveyor and material conveying method employing it | |
| JP4151002B2 (en) | Suspended transfer equipment and learning device | |
| KR950007012A (en) | Positioning method and apparatus for semiconductor processing system and its transfer mechanism | |
| JPH02165650A (en) | Semiconductor manufacturing device | |
| JP2006185960A (en) | Substrate processing device and its conveyance alignment method | |
| JPH01169939A (en) | Centering equipment for semiconductor wafer | |
| JPH0774229A (en) | Position detection device of semiconductor substrate | |
| TWI767359B (en) | Process line, apparatus and method for transfering semiconductor wafers | |
| JPS6390146A (en) | Transfer system for substrate | |
| JPH0250455A (en) | Semiconductor wafer carrier | |
| JPH05144924A (en) | Method and device of centering wafer | |
| US6854948B1 (en) | Stage with two substrate buffer station | |
| JPH0837224A (en) | Cassette transfer unit of semiconductor manufacturing equipment | |
| JPS59121847A (en) | Device for transferring semiconductor wafer | |
| JPH04154144A (en) | Substrate carrying-in and taking-out mechanism | |
| JPS61280631A (en) | Wafer position detecting device | |
| KR20190139589A (en) | Wafer mounting apparatus | |
| JP2005134241A (en) | Prober chuck and prober | |
| JPH04107841A (en) | Apparatus and method for transporting semiconductor wafer | |
| JPH0826413A (en) | Conveying mechanism and conveying method of platelike object |