JPH02159351A - Low-expansion fe-ni alloy with high strength and its production - Google Patents
Low-expansion fe-ni alloy with high strength and its productionInfo
- Publication number
- JPH02159351A JPH02159351A JP31564788A JP31564788A JPH02159351A JP H02159351 A JPH02159351 A JP H02159351A JP 31564788 A JP31564788 A JP 31564788A JP 31564788 A JP31564788 A JP 31564788A JP H02159351 A JPH02159351 A JP H02159351A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- expansion
- low
- strength
- plastic working
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 229910000990 Ni alloy Inorganic materials 0.000 title description 2
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 29
- 239000000956 alloy Substances 0.000 claims abstract description 29
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 19
- 230000032683 aging Effects 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000000137 annealing Methods 0.000 claims abstract description 6
- 239000002994 raw material Substances 0.000 claims abstract description 5
- 238000002844 melting Methods 0.000 claims abstract description 4
- 230000008018 melting Effects 0.000 claims abstract description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 19
- 229910052748 manganese Inorganic materials 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 8
- 229910052759 nickel Inorganic materials 0.000 abstract description 6
- 229910052790 beryllium Inorganic materials 0.000 abstract description 4
- 239000012535 impurity Substances 0.000 abstract description 2
- 229910017709 Ni Co Inorganic materials 0.000 abstract 2
- 229910003267 Ni-Co Inorganic materials 0.000 abstract 2
- 229910003262 Ni‐Co Inorganic materials 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- 239000011572 manganese Substances 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 238000005096 rolling process Methods 0.000 description 6
- 238000004881 precipitation hardening Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 238000003483 aging Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 first Substances 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
- C21D8/005—Modifying the physical properties by deformation combined with, or followed by, heat treatment of ferrous alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Heat Treatment Of Steel (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本願発明は、多ピンＩＣ用リードフレーム材料などとし
て好適な高強度低膨張Ｆｅ−Ｎｉ合金およびその製法に
関１、ＦｅとＮｉとＣｏとＭｎとＳｉを特定ｎ１含有す
る合金に１３ ａを特定ｍ添加することにより、従来の
合金よりら優れた変形抵抗を示し、従来の合金と同等の
低膨張性を確保したもの、および、ＦａとＮｉとＧｏと
ＭｎとＳｉを特定量含汀し、更にＩｌｅを特定■添加し
た合金に、特定の温度域において特定時間の熱処理を行
うようにするらのである。Detailed Description of the Invention "Field of Industrial Application" The present invention relates to a high-strength, low-expansion Fe-Ni alloy suitable as a lead frame material for multi-pin ICs, and a method for producing the same. By adding a specific amount of 13a to an alloy containing a specific amount of Mn and Si, an alloy that exhibits better deformation resistance than conventional alloys and has a low expansion property equivalent to that of conventional alloys, and An alloy containing specific amounts of Ni, Go, Mn, and Si, and further adding a specific amount of He, is subjected to heat treatment in a specific temperature range for a specific time.
「従来の技術」
近年、集積度の高い大規模集積回路（ＬＳＩ）や超大規
模集積回路（超ＷＩＬｓｆ）などの開発が盛んとなって
きているが、このようなＬＳＩや超しＳｌにおいては、
シリコン素子が大型化し、発熱ｍも多くなってきている
。従ってシリコン素子とリードフレームとの間の熱膨張
率の差異が大きい場合は、通電発熱によるリードフレー
ムの膨張と収縮によりシリコン素子が熱ストレスを受け
て割れたり、亀裂を生じたりするおそれがある。そこで
ＬＳＩや超ＬＳＩ用などのリードフレーム材料にあって
は、特にその熱膨張率をシリコン素子の熱膨張率に近付
ける必要がある。"Conventional technology" In recent years, the development of highly integrated large-scale integrated circuits (LSI) and ultra-large-scale integrated circuits (super WILsf) has become active.
Silicon elements are becoming larger and generating more heat m. Therefore, if the difference in coefficient of thermal expansion between the silicon element and the lead frame is large, there is a risk that the silicon element will be subject to thermal stress due to the expansion and contraction of the lead frame due to the heat generated by electricity, and may break or crack. Therefore, for lead frame materials for LSIs and VLSIs, it is particularly necessary to bring the coefficient of thermal expansion close to that of silicon elements.
このため従来から、リードフレーム用の材料においては
、シリコン素子などに作用する熱応力を緩和することを
目的とした低膨張のＦ ｅ−Ｎ ｉ合金として、４２
Ａ １ｌｏｙ（４２％Ｎｉ−１？’ｅ）（特開昭５５１
１９１５６号など）、コバール（２９％Ｎｉ−１７％Ｇ
ｏ−Ｆｅ）などが知られている。For this reason, 42 has traditionally been used as a material for lead frames as a low-expansion Fe-Ni alloy for the purpose of relieving thermal stress acting on silicon elements.
A 1loy (42%Ni-1?'e) (Unexamined Japanese Patent Publication No. 551
No. 19156), Kovar (29%Ni-17%G)
o-Fe) and the like are known.
ところがこれら従来のリードフレーム材料にあってら、
シリコン素子との間に若干の熱膨張差があるので、本願
発明者らは先に、この熱膨張差を更に改善し、前記ＬＳ
Ｉや超ＬＳＩ用などとしてより好適なリードフレーム材
料について特許出願を行っている。However, with these conventional lead frame materials,
Since there is a slight difference in thermal expansion between the silicon element and the silicon element, the inventors of the present application first further improved this thermal expansion difference, and the LS
We have filed a patent application for a lead frame material that is more suitable for ICs and VLSIs.
このリードフレーム材料は、特開昭５９−１９８７４１
号公報に開示されているように、Ｎｉを２６〜３０％、
ＣＯを１１〜１６％、Ｍｎを０．１〜０．８％、残部Ｆ
ｅの組成を有する半導体集積回路用リードフレー１２材
と、Ｎｉを２６〜３０％、ＧｏをＩＩ〜Ｉ（ｉ％、Ｍｎ
を０．１〜０．８％、Ｓｉを０．５％以下含有し、残部
Ｐｃの組成を有する半導体集積回路用す、−ドフレーム
材である。This lead frame material is disclosed in Japanese Patent Application Laid-Open No. 59-198741.
As disclosed in the publication, 26 to 30% Ni,
11-16% CO, 0.1-0.8% Mn, balance F
12 materials for leadflakes for semiconductor integrated circuits having a composition of e, Ni of 26 to 30%, Go of II to I (i%, Mn
This is a bonded frame material for use in semiconductor integrated circuits, containing 0.1 to 0.8% of Si, 0.5% or less of Si, and the remainder Pc.
「発明が解決しようとする課題」
ところか、最近、リードフレームの多ピン化に伴い、以
前はインナーリードの幅が０．３〜０．５１程度であっ
たものが、０．１５〜０．２ｍｍ程度の幅に形成される
場合が生じている。このようにインナーリードの幅が小
さくなった場合、インナーリードの材料強度が不足する
ことから、製造工程途中において、運搬時やセパレータ
のテーピング時に、インナーリードが外力による変形を
起こしやすくなる問題があった。"Problem to be Solved by the Invention" Recently, as lead frames have increased in number of pins, the width of the inner leads, which used to be about 0.3 to 0.51, has become 0.15 to 0.0. In some cases, the width is about 2 mm. When the width of the inner lead becomes smaller in this way, the material strength of the inner lead becomes insufficient, which causes the problem that the inner lead becomes easily deformed by external force during transportation or taping of the separator during the manufacturing process. Ta.
本願発明は前記課題を解決するためになされた乙ので、
従来の合金よりも硬度と引張強度と曲げ性に優れ、変形
抵抗が大きいとともに、本願発明者らが先に特許出願し
ているリードフレーム材と同等の低膨張率を示す高強度
低膨張Ｆｅ−Ｎｉ合金を提供することおよびその製法を
提供することを目的とする。Since the present invention was made to solve the above problem,
High-strength, low-expansion Fe- The object of the present invention is to provide a Ni alloy and a method for producing the same.
［課題を解決するための手段」
請求項１に記載した発明は、前記課題を解決ずろために
、
Ｎｉ ２６〜３２％（重量％、以下同じ）Ｃｏ １
ｌ＝ｌｌｌｉ％以下
Ｍｎ ０ １〜０．８％
Ｓｉ ０．５％以下
Ｂｅ ０．０５〜２．０％
Ｆｅ 残部
の組成にしたものである。[Means for solving the problem] In order to solve the problem, the invention described in claim 1 includes: Ni 26 to 32% (weight %, same hereinafter) Co 1
1=lli% or less Mn 0 1 to 0.8% Si 0.5% or less Be 0.05 to 2.0% Fe the balance.
請求項２に記載した発明は、１１η記課題を解決するた
めに、請求項Ｉに記載した組成を満たずように原材料を
配合し、溶解して得たインゴットを目的の形状になるま
で塑性加工と焼鈍処理を必要回数施し、最終塑性加工と
同時に、もしくは、最終塑性加工後に３００〜７００℃
の温度域において５時間以下熱処理を行って時効するも
のである。In order to solve the problem described in Item 11, the invention described in Claim 2 combines raw materials so that the composition does not satisfy the composition described in Claim I, and plastically processes the ingot obtained by melting it until it has a desired shape. and annealing treatment for the necessary number of times, and at 300 to 700°C at the same time as the final plastic working or after the final plastic working.
Aging is performed by heat treatment in a temperature range of 5 hours or less.
「作用」
ＦｅとＮｉとＣｏとＭｎとＳｉを所定ｍ含有する低膨張
率の合金に、１３ ｃを少ｌｉ？添加Ｊ−ることで高強
度になるととらに、ｌｌｅの添加ｎｔか少量で済むので
、合金の主成分は低膨張率の合金であり、このため、リ
ードフレーム用の材料として好適な熱膨張率が確保され
る。また、前記組成とした合金に、３００〜７００℃で
５時間以下の熱処理を施すと、引張り強さの制御が可能
になり、時効硬化する。"Action" A small amount of 13c is added to a low expansion coefficient alloy containing a predetermined m of Fe, Ni, Co, Mn, and Si. In addition to the high strength achieved by adding J-, only a small amount of lle is required, so the main component of the alloy is an alloy with a low coefficient of expansion. Therefore, the coefficient of thermal expansion is suitable as a material for lead frames. is ensured. Further, when the alloy having the above composition is heat treated at 300 to 700° C. for 5 hours or less, the tensile strength can be controlled and age hardening occurs.
以下に本願発明を更に詳細に説明する。The present invention will be explained in more detail below.
本願発明の合金においては、Ｎｉにッケル）を２６〜３
２％、Ｃｏ（コバルト）を１１〜１６％以下、！３ｅ（
ベリリウム）を０．０５〜２．０％、Ｓｉ（ケイ素）を
０．５％以下、Ｍｎ（マンガン）を０．１〜０．８％含
有している。前記組成において、Ｎｉ含ｆｒ ｆｉｔを
２６〜３２％以外に、ＣＯ含有量を１１〜１６％以外に
すると、リードフレーム材料が適用されるシリコン素子
等の熱膨張率に適応した熱膨張率が得られなくなるため
に好ましくない。なお、この組成範囲は、本願発明者ら
が先に行った特許出願（特開昭５９−１９８７４１号）
の明細書において、第１図と第２図に記載されているグ
ラフの関係から明らかにされている。また、Ｂｅの含ａ
ｍを０．０５％未満とすると、析出硬化の効果が得られ
ずに時効不能であり、１３ｅの含有ｍが２．０％を越え
る場合、強度向上の割に高価な［３ｅの使用量が多くな
ってコストが高くなり、不適当である。更に、Ｓｉは脱
酸剤として用いるが含有量が０．５％を越えると合金を
脆化さ仕るので不都合であり、Ｍｎは鍛造性を向上さけ
るとともに脱酸剤として用いるが、含有量が０．１％未
満では十分な効果が得られず、０．８％を越えると曲げ
性を悪化さけるので好ましくない。In the alloy of the present invention, Ni (nickel) is 26 to 3
2%, Co (cobalt) 11-16% or less! 3e(
It contains 0.05 to 2.0% of beryllium), 0.5% or less of Si (silicon), and 0.1 to 0.8% of Mn (manganese). In the above composition, if the Ni content is set to a value other than 26 to 32% and the CO content is set to a value other than 11 to 16%, a coefficient of thermal expansion adapted to the coefficient of thermal expansion of a silicon element, etc. to which the lead frame material is applied can be obtained. This is undesirable because it makes it difficult to use. Note that this composition range is based on the patent application previously filed by the inventors of the present invention (Japanese Patent Laid-Open No. 198741/1983).
This is made clear from the relationship between the graphs shown in FIGS. 1 and 2 in the specification of . In addition, the content of Be
If m is less than 0.05%, no precipitation hardening effect can be obtained and aging cannot be achieved, and if the m content of 13e exceeds 2.0%, the amount of 3e used is expensive compared to the improvement in strength. This increases the cost and is inappropriate. Furthermore, Si is used as a deoxidizing agent, but if the content exceeds 0.5%, it will cause the alloy to become brittle, which is disadvantageous.Mn is used as a deoxidizing agent while improving forgeability, but if the content exceeds 0.5%, it will cause the alloy to become brittle. If it is less than 0.1%, a sufficient effect cannot be obtained, and if it exceeds 0.8%, bendability may be deteriorated, which is not preferable.
前記合金を製造するには、まず、前記の組成になるよう
に原材料を配合した後に、不純物の混入を避ける目的で
Ａ「ガスなどの雰囲気中で真空溶解を行って前記組成の
インゴットを得る。To produce the alloy, first, raw materials are blended to have the composition as described above, and then vacuum melting is performed in an atmosphere of gas or the like in order to avoid contamination with impurities to obtain an ingot having the composition as described above.
次いでこのインゴットを１２００〜１４００℃で鍛造加
工し、目的の形状、例えば目的の板厚になるまで、好ま
しくは加工率７０％以下で行う圧延加工と、８００〜！
！００℃で行う焼鈍処理を繰り返し施す。そして、最終
圧延加工時に加工率を好ましくは５０％以下程度に設定
し、この最終圧延中から連続して、ししくは、最終圧延
後に時効便化処理を目的として、３００〜７００℃の温
度域においζ、う２時間以内の熱処理を行い、所望の厚
さの板材を得る。Next, this ingot is forged at 1,200 to 1,400°C, and then rolled to a desired shape, for example, to a desired thickness, preferably at a processing rate of 70% or less.
! The annealing treatment performed at 00°C is repeated. Then, during the final rolling process, the processing rate is preferably set to about 50% or less, and continuously from this final rolling process, or preferably after the final rolling process, for the purpose of aging treatment, the temperature range is 300 to 700°C. Heat treatment is performed for less than 2 hours to obtain a plate material of desired thickness.
前記時効処理温度において３００℃以下では、ｔｌｉ出
粒子粒子さずぎて析出硬化が進まずに未時効となり、７
００℃以上では時効により強度がピークになるまでの熱
処理時間が短かずぎて温度コンｌ−ｒｒ−ルが困難であ
り、それを越えると析出粒子が大きくなりすぎて十分な
析出硬化が期待できない。When the aging treatment temperature is 300°C or lower, precipitation hardening does not proceed immediately after the tli extruded particles, resulting in unaged condition.
At temperatures above 00°C, the heat treatment time until the strength reaches its peak due to aging is too short and temperature control is difficult; above that temperature, the precipitated particles become too large and sufficient precipitation hardening cannot be expected. .
以」二説明したような製造方法で１１９記組成の合金を
製造４゛るならば、従来の合金より６強度が高く曲げに
強いなど変形抵抗が高いとともに、シリコン素子やセラ
ミック封止材料の熱膨張率に近い熱膨張率のリードフレ
ーム用材料を得ることができろ。しかも前記合金は時効
処理の温度と時間を調節”４”ることにより引張強さを
調節できるので、所望の強さのリードフレーム材料を得
ることができる。更に、Ｂｅの添加量が少量でも引張強
度の向上効果が得られるので、高価な［３ｅの使用量が
少なくて済み、低コストで製造できる効果がある。If an alloy with a composition of 119 is manufactured using the manufacturing method described below, it will have higher strength than conventional alloys and will have high deformation resistance such as bending resistance, and will also be able to withstand the heat of silicon elements and ceramic sealing materials. It would be possible to obtain a lead frame material with a coefficient of thermal expansion close to the coefficient of expansion. Moreover, since the tensile strength of the alloy can be adjusted by adjusting the temperature and time of the aging treatment, a lead frame material with desired strength can be obtained. Furthermore, even if the amount of Be added is small, the effect of improving the tensile strength can be obtained, so the amount of expensive [3e] used can be small, and there is an effect that production can be performed at low cost.
「実施例」
以下に示す第１表の組成になるように各々原材料を配合
し、各配合物をＡ「ガスを含む８０１”ｏｒｒの真空雰
囲気において溶解してインゴットを作成し、次いでこの
インゴットに１２００〜１４００℃で熱間鍛造加工を施
し、次いで、加工率７０％以下で行う圧延加工と８００
〜ｌｌ００℃に加熱後に徐冷する焼鈍処理とを繰り返し
行い、最終圧延加工を加工率５０％以下で行って圧延加
工を終了し、厚さ０．１５ｍ−の板材を得、次いで５０
０℃に２時間加熱する特効処理を行って試料Ｎｏｔ〜５
の板状の試験片を得た。"Example" Each raw material was blended to have the composition shown in Table 1 below, and each blend was melted in a vacuum atmosphere of 801" orr containing A" gas to create an ingot. Hot forging at 1,200 to 1,400°C, followed by rolling at a processing rate of 70% or less and 800°C.
The annealing process of heating to ~ll00°C and then slow cooling is repeated, and the final rolling process is performed at a processing rate of 50% or less to complete the rolling process to obtain a plate material with a thickness of 0.15m.
After special treatment of heating to 0℃ for 2 hours, samples No. 5
A plate-shaped test piece was obtained.
各試験片の引張強度（ｋｇ／ｓａりと伸び（％）と硬度
と平均熱膨張係数（３０〜３００℃、μ／Ｉｔｏ・℃）
を測定した。その結果を第２表に示す。Tensile strength (kg/sa), elongation (%), hardness, and average coefficient of thermal expansion (30-300℃, μ/Ito・℃) of each test piece
was measured. The results are shown in Table 2.
（以下、余白）
第１表
第２表
第２表に示す結果から、本願発明品の試料３゜４におい
ては、いずれも従来品の試料１よりら引張強度が高く、
硬度ら高いことが明らかとなった。(Hereinafter, blank space) From the results shown in Table 1, Table 2, and Table 2, the tensile strength of Sample 3゜4 of the invention product is higher than that of Sample 1 of the conventional product.
It became clear that the hardness was high.
また、Ｂｅを０．０３％添加している試料２（比較品）
にあっては試料］（従来品）に比較して引張強度の向上
効果が少ないことが明らかである。これらの結果から鑑
みて本願発明ではＢｅの添加量を０．０５〜２．０％に
限定した。In addition, sample 2 (comparative product) with 0.03% Be added
It is clear that the effect of improving tensile strength is smaller in the case of the sample [Sample] (conventional product). In view of these results, in the present invention, the amount of Be added is limited to 0.05 to 2.0%.
一方、前記の手順で製造した発明品の試料について、時
効処理時間と引張り強さの関係を求めた。On the other hand, the relationship between the aging treatment time and the tensile strength was determined for the samples of the invention products manufactured by the above procedure.
その結果を第１図に示す。The results are shown in FIG.
第１図から明らかなように、時効処理の温度が３００℃
の場合、処理時間の経過とともに引張強度は緩やかなカ
ーブで上昇し、処理時間５時間程度でピークに向かい、
５００℃の場合、引張強さのピークは２時間程度に短縮
され、・７００℃の場合、ピークは１時間程度に短縮さ
れるが１時間経過後の引張強度は＾＾少している。As is clear from Figure 1, the aging treatment temperature was 300°C.
In the case of , the tensile strength increases with a gentle curve as the treatment time progresses, reaching a peak at around 5 hours of treatment time, and
At 500°C, the peak tensile strength is shortened to about 2 hours, and at 700°C, the peak is shortened to about 1 hour, but the tensile strength after 1 hour is slightly lower.
第１図に示す結果から鑑みて本願発明方法では時効処理
温度を３００〜７００℃の範囲に限定し、時効処理時間
を５時間以下に限定した。In view of the results shown in FIG. 1, in the method of the present invention, the aging treatment temperature was limited to a range of 300 to 700°C, and the aging treatment time was limited to 5 hours or less.
また、前記の手順で製造した試料３（発明品）と試料ｌ
（従来品）について曲げ性のテストを行った。In addition, sample 3 (invention product) and sample l produced by the above procedure
(Conventional product) was tested for bendability.
このテストは、板状の各試料の一端側を把持して水平に
支持し、他端側に上方から垂直荷重を加えた場合に、他
端に生じたへたりｍ （ｍｓ）を測定して行った。その
結場を第２図に示す。In this test, one end of each plate-shaped sample is gripped and supported horizontally, and when a vertical load is applied to the other end from above, the settling m (ms) that occurs at the other end is measured. went. The ending point is shown in Figure 2.
第２図から明らかなように試料３（発明品）は試料１（
従来品）よりらへたりｍが少ないことが明らかとなった
。As is clear from Figure 2, sample 3 (invention) is different from sample 1 (
It became clear that the sagging m was smaller than that of the conventional product.
「発明の効果」
以上説明したように本願発明によれば、ＦｅとＮｉとｃ
ｏとＭｎとＳｉを所定ｍ含ａする低膨張率の合金に、Ｂ
ｅを少量添加することで高強度にしたので、シリコン素
子や封ｎ用セラミックなどに近い熱膨張率を維持した上
に、従来合金よりし硬度と引張強度に曲げ性？こ侵れた
変形抵抗の大きな合金を提供することができる。従って
本願発明によれば、従来よりし優れたリードフレーム材
料を提供４°ることかできる。また、本願発明の合金に
あっては高価なりｅの添加量が少量で済むので、低コス
トで得ることができる。"Effects of the Invention" As explained above, according to the present invention, Fe, Ni and c
B is added to a low expansion coefficient alloy containing a predetermined m content of O, Mn, and Si.
By adding a small amount of e, it has high strength, so it maintains a coefficient of thermal expansion close to that of silicon elements and sealing ceramics, and has higher hardness, tensile strength, and bendability than conventional alloys. This makes it possible to provide an alloy with high resistance to deformation. Therefore, according to the present invention, it is possible to provide a lead frame material that is superior to the conventional lead frame material. Furthermore, since the alloy of the present invention requires only a small amount of expensive e added, it can be obtained at low cost.
一方、前記組成とした合金に、３００〜７００℃で５時
間以下の熱処理を施すと、時効硬化させることができる
ので、時効条件の選定により引張り強さなどの値の制御
が可能になり、所望の引張強さと硬度と曲げ性を有する
リードフレーム用に好適な合金を得ることができる。従
って本願発明方法により得られた合金を用いてリードフ
レームを形成するならば、’Ｒｌｊｉ工程途中において
外力が作用しても変形を起こすおそれが少ないリードフ
レームを得ることができる効果がある。On the other hand, if the alloy with the above composition is heat treated at 300 to 700°C for 5 hours or less, it can be age hardened, so values such as tensile strength can be controlled by selecting the aging conditions, making it possible to obtain the desired It is possible to obtain an alloy suitable for lead frames having tensile strength, hardness, and bendability of . Therefore, if a lead frame is formed using the alloy obtained by the method of the present invention, it is possible to obtain a lead frame that is less likely to be deformed even if an external force is applied during the 'Rlji process.
第１図は試験片の引張強さと時効処理時間の関係を示す
グラフ、
第２図は試験片の曲げ性のテスト結果を示すグラフであ
る。Figure 1 is a graph showing the relationship between the tensile strength of the test piece and aging treatment time, and Figure 2 is a graph showing the test results of the bendability of the test piece.
Claims (2)
〜１６％以下 Ｍｎ０．１〜０．８％ Ｓｉ０．５％以下 Ｂｅ０．０５〜２．０％ Ｆｅ残部 の組成を有する高強度低膨張Ｆｅ−Ｎｉ合金。(1) Ni26-32% (weight%, same below) Co11
A high-strength, low-expansion Fe-Ni alloy having a composition of ~16% or less Mn 0.1-0.8% Si 0.5% or less Be 0.05-2.0% Fe balance.
配合し、溶解して得たインゴットに目的の形状になるま
で塑性加工と焼鈍処理を必要回数施し、最終塑性加工と
同時に、もしくは、最終塑性加工後に、３００〜７００
℃の温度域において５時間以内の熱処理を行って時効す
ることを特徴とする高強度低膨張Ｆｅ−Ｎｉ合金の製法
。(2) The raw materials are blended to satisfy the composition described in claim 1, and the ingot obtained by melting is subjected to plastic working and annealing treatment a necessary number of times until the desired shape is obtained, and simultaneously with the final plastic working, or After final plastic working, 300-700
A method for producing a high-strength, low-expansion Fe-Ni alloy, which is characterized by aging by heat treatment within 5 hours in a temperature range of °C.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31564788A JPH02159351A (en) | 1988-12-14 | 1988-12-14 | Low-expansion fe-ni alloy with high strength and its production |
| US07/450,038 US5084111A (en) | 1988-12-14 | 1989-12-13 | Fe-Ni alloy and method for treating ingot the same |
| US07/778,256 US5264052A (en) | 1988-12-14 | 1991-10-17 | Fe-Ni alloy and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31564788A JPH02159351A (en) | 1988-12-14 | 1988-12-14 | Low-expansion fe-ni alloy with high strength and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02159351A true JPH02159351A (en) | 1990-06-19 |
Family
ID=18067886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31564788A Pending JPH02159351A (en) | 1988-12-14 | 1988-12-14 | Low-expansion fe-ni alloy with high strength and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02159351A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5246511A (en) * | 1990-05-14 | 1993-09-21 | Hitachi Metals, Ltd. | High-strength lead frame material and method of producing same |
| CN112453101A (en) * | 2020-11-10 | 2021-03-09 | 华能国际电力股份有限公司 | Forming preparation process of large-caliber thick-wall pipe made of iron-based high-temperature alloy |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS552733A (en) * | 1978-06-21 | 1980-01-10 | Hitachi Ltd | Deformable alloy of high strength and its manufacture |
-
1988
- 1988-12-14 JP JP31564788A patent/JPH02159351A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS552733A (en) * | 1978-06-21 | 1980-01-10 | Hitachi Ltd | Deformable alloy of high strength and its manufacture |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5246511A (en) * | 1990-05-14 | 1993-09-21 | Hitachi Metals, Ltd. | High-strength lead frame material and method of producing same |
| CN112453101A (en) * | 2020-11-10 | 2021-03-09 | 华能国际电力股份有限公司 | Forming preparation process of large-caliber thick-wall pipe made of iron-based high-temperature alloy |
| CN112453101B (en) * | 2020-11-10 | 2023-03-10 | 华能国际电力股份有限公司 | Forming preparation process of large-caliber thick-wall pipe made of iron-based high-temperature alloy |
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