JPH0215863B2 - - Google Patents

Info

Publication number
JPH0215863B2
JPH0215863B2 JP58218206A JP21820683A JPH0215863B2 JP H0215863 B2 JPH0215863 B2 JP H0215863B2 JP 58218206 A JP58218206 A JP 58218206A JP 21820683 A JP21820683 A JP 21820683A JP H0215863 B2 JPH0215863 B2 JP H0215863B2
Authority
JP
Japan
Prior art keywords
group
polysiloxane
general formula
ladder
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58218206A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60108839A (ja
Inventor
Hiroshi Adachi
Osamu Hayashi
Kazuo Okabashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP58218206A priority Critical patent/JPS60108839A/ja
Publication of JPS60108839A publication Critical patent/JPS60108839A/ja
Publication of JPH0215863B2 publication Critical patent/JPH0215863B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)
  • Polymerisation Methods In General (AREA)
JP58218206A 1983-11-18 1983-11-18 感光性耐熱材料 Granted JPS60108839A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58218206A JPS60108839A (ja) 1983-11-18 1983-11-18 感光性耐熱材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58218206A JPS60108839A (ja) 1983-11-18 1983-11-18 感光性耐熱材料

Publications (2)

Publication Number Publication Date
JPS60108839A JPS60108839A (ja) 1985-06-14
JPH0215863B2 true JPH0215863B2 (enrdf_load_stackoverflow) 1990-04-13

Family

ID=16716281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58218206A Granted JPS60108839A (ja) 1983-11-18 1983-11-18 感光性耐熱材料

Country Status (1)

Country Link
JP (1) JPS60108839A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6310146B1 (en) * 1999-07-01 2001-10-30 Dow Corning Corporation Silsesquioxane resin with high strength and fracture toughness and method for the preparation thereof

Also Published As

Publication number Publication date
JPS60108839A (ja) 1985-06-14

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